JPS641058B2 - - Google Patents
Info
- Publication number
- JPS641058B2 JPS641058B2 JP8253180A JP8253180A JPS641058B2 JP S641058 B2 JPS641058 B2 JP S641058B2 JP 8253180 A JP8253180 A JP 8253180A JP 8253180 A JP8253180 A JP 8253180A JP S641058 B2 JPS641058 B2 JP S641058B2
- Authority
- JP
- Japan
- Prior art keywords
- stem
- plating
- nickel plating
- lead
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 15
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8253180A JPS577951A (en) | 1980-06-18 | 1980-06-18 | Manufacture of stem for semiconductor device needing no whole surface finishing nickel plating process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8253180A JPS577951A (en) | 1980-06-18 | 1980-06-18 | Manufacture of stem for semiconductor device needing no whole surface finishing nickel plating process |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS577951A JPS577951A (en) | 1982-01-16 |
JPS641058B2 true JPS641058B2 (fr) | 1989-01-10 |
Family
ID=13777082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8253180A Granted JPS577951A (en) | 1980-06-18 | 1980-06-18 | Manufacture of stem for semiconductor device needing no whole surface finishing nickel plating process |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS577951A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0293183U (fr) * | 1989-01-12 | 1990-07-24 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4734350A (en) * | 1986-12-29 | 1988-03-29 | Xerox Corporation | Positively charged developer compositions with modified charge enhancing additives containing amino alcohols |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6041860B2 (ja) * | 1980-03-14 | 1985-09-19 | 日本電気ホームエレクトロニクス株式会社 | 気密端子の製造方法 |
-
1980
- 1980-06-18 JP JP8253180A patent/JPS577951A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0293183U (fr) * | 1989-01-12 | 1990-07-24 |
Also Published As
Publication number | Publication date |
---|---|
JPS577951A (en) | 1982-01-16 |
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