JPS6399560A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6399560A
JPS6399560A JP61245824A JP24582486A JPS6399560A JP S6399560 A JPS6399560 A JP S6399560A JP 61245824 A JP61245824 A JP 61245824A JP 24582486 A JP24582486 A JP 24582486A JP S6399560 A JPS6399560 A JP S6399560A
Authority
JP
Japan
Prior art keywords
wiring board
wiring
board
chip
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61245824A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0531827B2 (enExample
Inventor
Miyoshi Yoshida
吉田　美義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61245824A priority Critical patent/JPS6399560A/ja
Publication of JPS6399560A publication Critical patent/JPS6399560A/ja
Publication of JPH0531827B2 publication Critical patent/JPH0531827B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/20—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H10W72/07251—
    • H10W90/724—
    • H10W90/754—

Landscapes

  • Combinations Of Printed Boards (AREA)
JP61245824A 1986-10-15 1986-10-15 半導体装置 Granted JPS6399560A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61245824A JPS6399560A (ja) 1986-10-15 1986-10-15 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61245824A JPS6399560A (ja) 1986-10-15 1986-10-15 半導体装置

Publications (2)

Publication Number Publication Date
JPS6399560A true JPS6399560A (ja) 1988-04-30
JPH0531827B2 JPH0531827B2 (enExample) 1993-05-13

Family

ID=17139400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61245824A Granted JPS6399560A (ja) 1986-10-15 1986-10-15 半導体装置

Country Status (1)

Country Link
JP (1) JPS6399560A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7282789B2 (en) * 1998-03-31 2007-10-16 Micron Technology, Inc. Back-to-back semiconductor device assemblies

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7282789B2 (en) * 1998-03-31 2007-10-16 Micron Technology, Inc. Back-to-back semiconductor device assemblies

Also Published As

Publication number Publication date
JPH0531827B2 (enExample) 1993-05-13

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