JPS6399557A - セラミツク基板における端子部と金属リ−ドとの接続方法 - Google Patents

セラミツク基板における端子部と金属リ−ドとの接続方法

Info

Publication number
JPS6399557A
JPS6399557A JP20123186A JP20123186A JPS6399557A JP S6399557 A JPS6399557 A JP S6399557A JP 20123186 A JP20123186 A JP 20123186A JP 20123186 A JP20123186 A JP 20123186A JP S6399557 A JPS6399557 A JP S6399557A
Authority
JP
Japan
Prior art keywords
barrier layer
substrate
terminal part
pure
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20123186A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0545064B2 (esLanguage
Inventor
Kazuo Kondo
和夫 近藤
Tsuneyuki Sukegawa
助川　恒之
Asao Morikawa
森川　朝男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to US07/089,762 priority Critical patent/US4801067A/en
Publication of JPS6399557A publication Critical patent/JPS6399557A/ja
Publication of JPH0545064B2 publication Critical patent/JPH0545064B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP20123186A 1986-05-02 1986-08-29 セラミツク基板における端子部と金属リ−ドとの接続方法 Granted JPS6399557A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US07/089,762 US4801067A (en) 1986-08-29 1987-08-27 Method of connecting metal conductor to ceramic substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61-101164 1986-05-02
JP10116486 1986-05-02

Publications (2)

Publication Number Publication Date
JPS6399557A true JPS6399557A (ja) 1988-04-30
JPH0545064B2 JPH0545064B2 (esLanguage) 1993-07-08

Family

ID=14293395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20123186A Granted JPS6399557A (ja) 1986-05-02 1986-08-29 セラミツク基板における端子部と金属リ−ドとの接続方法

Country Status (1)

Country Link
JP (1) JPS6399557A (esLanguage)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6864579B2 (en) * 2001-01-25 2005-03-08 Siemens Aktiengesellschaft Carrier with a metal area and at least one chip configured on the metal area

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6864579B2 (en) * 2001-01-25 2005-03-08 Siemens Aktiengesellschaft Carrier with a metal area and at least one chip configured on the metal area

Also Published As

Publication number Publication date
JPH0545064B2 (esLanguage) 1993-07-08

Similar Documents

Publication Publication Date Title
JP2602372B2 (ja) メタライズされた構成要素をセラミツク基板にろう付けする方法
US4835593A (en) Multilayer thin film metallurgy for pin brazing
US5041342A (en) Multilayered ceramic substrate fireable in low temperature
JPH0510310B2 (esLanguage)
JPS59232979A (ja) セラミツクとアルミニウム合金の複合体
RU2196683C2 (ru) Подложка, способ ее получения (варианты) и металлическое соединенное изделие
US5045400A (en) Composition for and method of metallizing ceramic surface, and surface-metallized ceramic article
US4801067A (en) Method of connecting metal conductor to ceramic substrate
US5521438A (en) Ceramic base and metallic member assembly
US5138426A (en) Ceramic joined body
JPS6399557A (ja) セラミツク基板における端子部と金属リ−ドとの接続方法
JPH0477467B2 (esLanguage)
JPS61121489A (ja) 基板製造用Ｃｕ配線シ−ト
JP2735708B2 (ja) セラミック配線基板
JP2652014B2 (ja) 複合セラミック基板
JPH06151642A (ja) Ｉｃパッケージ
JPS6272472A (ja) セラミツクスと金属等との接合方法
JP2650044B2 (ja) 半導体装置用部品間の接続構造
JPS63122253A (ja) 半導体パツケ−ジ
JPS6083356A (ja) 半導体装置
JPH0794624A (ja) 回路基板
JPH04300259A (ja) 接合部材及び接合方法
JP3103208B2 (ja) 半田プリフォーム基板
JPH02202041A (ja) 複合型回路装置及び接合用ペースト
JP2000349098A (ja) セラミック基板と半導体素子の接合体及びその製造方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees