JPS6394840A - Laminated board for metallic base printed circuit - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a metal-based laminate having excellent voltage resistance and heat dissipation for use in printed circuits.

[Prior art]

Conventionally, printed circuit laminates based on metal plates are
As shown in the figure and Fig. 3, a circuit metal foil (3) made of copper, aluminum, etc. is placed on a metal plate (1) made of iron, aluminum, brass, etc. via a prepreg (4) or a resin film (5). It is an integrated system. Looking more closely, in order to obtain adhesive strength, the surface of the metal plate is roughened by a physical method such as polishing, or chemically treated, and the insulating layer is made of a chemically processed material. Laminated boards for metal-based printed circuits have been obtained using prepregs made by impregnating thermosetting resins such as xyl resins, phenol resins, and silicone resins into base materials such as glass woven fabrics, or thermoplastic resin films.

Such conventional metal-based laminates are desired to be further improved in various properties under severe usage conditions in recent years. In particular, with regard to withstand voltage and thermal conductivity, various studies have been made from both the base material of the insulating layer and the resin, but nothing satisfactory has yet been obtained.

[Purpose of the invention]

An object of the present invention is to improve the voltage resistance and thermal conductivity of conventional metal-based laminates, and to provide a printed circuit board that can withstand harsh usage conditions.

[Structure of the invention]

As shown in FIG. 1, the present invention is based on a metal plate (1), in which thermosetting resin-impregnated alumina fibers are injected.
The present invention also relates to a laminate for a metal-based printed circuit in which alumina-silica fiber R-No (2) and metal foil (3) are sequentially laminated.

In the present invention, the metal plate serving as the paste is made of iron, aluminum, brass, zinc, galvanized iron, etc., and is preferably roughened during chemical surface treatment or physically roughened before use.

The use of thermosetting resin-impregnated alumina fiber, aluminum or silica fiber as an insulating layer will be explained below.

Alkisu fiber R-nozo- or alumina/silica fiber R
-Z- is a paper made from alumina fiber alone or alumina fiber and silica fiber together with a small amount of binder.
Although the strength is not necessarily high, it has excellent electrical properties, heat resistance, chemical stability, etc. On the other hand, the thermosetting resin to be impregnated is phenol resin, epixy resin, unsaturated, jF 1.1 ester resin, There are boli-coated resins, etc., but the alumina fibers and aluminum ξ
In order to fully exhibit the excellent properties of the silica fiber Benocou, epixy resins and polyimide resins are preferred.

The content of the resin is usually 30 to 60% by weight based on the entire insulating layer, but a smaller content is desirable as long as it satisfies the properties required for subsequent processing steps, such as adhesive strength between each layer.

Second, the metal foil, which is made of copper, aluminum, nickel, etc., is usually subjected to chemical or physical treatment on the back side to improve adhesion. Furthermore, if an adhesive is applied to the back surface of the metal foil, the adhesive force with the insulating layer will be improved, while not applying an adhesive is preferable from the viewpoint of thermal conductivity.

The metal plate, insulating layer, and metal foil described above are integrated by lamination molding, but the conditions for lamination molding may be the same as those for general printed circuit laminates, for example, at a temperature of 150 to 2
00℃, pressure 50-100kg/c-e, time 9
The duration is approximately 0 to 150 minutes.

〔Effect of the invention〕

The metal paste laminate of the present invention has excellent voltage resistance and thermal conductivity. Other properties are also excellent, so
The insulating layer can be made much thinner, and the thermal conductivity can be much improved.

〔Example〕

Example 1 Alumina fiber woven beech (made by Daicel Chemical Industries, Ltd., Ceramic Fiber II #) was impregnated with epixy resin face of the following composition so that the resin content was 40% by weight, and dried to obtain Silipreg. Ta.

Epixy resin (nibxy 6 amount: 480) 100 parts dicyandiamide 32-ethyl-4-
Methyl imidazone layer o, 15 = flying solvent (methyl ethyl ketone)' One sheet of this prepreg was superimposed on a degreased iron plate with a thickness of 0.5 m, and an electrolytic steel foil coated with adhesive (
35IRn) superimposed, 170t:, 4/J on 70
A metal paste laminate was obtained by heat-pressing molding for 120 minutes.

Example 2 The alumina fiber cellar in Example IK was
One Tsukuu to Silica Fiber (Ko-Shichiran C, Kojin Co., Ltd.)
A metal paste laminate was obtained in the same manner as in Example 1, except that the following was changed.

Examples 3 and 4 Metal paste laminates were obtained in the same manner as in Example 1, except that all of the adhesive-coated electrolytic copper foils in Examples 1 and 2 were changed to electrolytic steel foils (35 μm) that were not coated with adhesive.

Comparative example (conventional example) Alumina fiber in Example 1 -'%? −) Z! A metal paste laminate was obtained in the same manner as in Example 1 except that - was changed to a glass woven fabric (106 f/ctA).

Table 1 shows the characteristic values of the metal paste laminates obtained in these Examples and Comparative Examples.

Table 1 In addition, in the characteristics in Table 1, the thermal conductivity is Showa Denko QT.
Hot wire thermal conductivity was measured using an M-type rapid thermal conductivity needle.

Other characteristics were determined according to JI8C6481.

As is clear from Table 1, the nine metal base laminates obtained in each example have excellent voltage resistance and heat dissipation properties, and other properties are also comparable or better.

Claims (1)

[Claims] A laminate for metal-based printed circuits, which is made of a metal plate as a base, on which thermosetting resin-impregnated alumina fiber paper or alumina-silica fiber paper and metal foil are sequentially laminated.