JPS639137U - - Google Patents

Info

Publication number
JPS639137U
JPS639137U JP10298986U JP10298986U JPS639137U JP S639137 U JPS639137 U JP S639137U JP 10298986 U JP10298986 U JP 10298986U JP 10298986 U JP10298986 U JP 10298986U JP S639137 U JPS639137 U JP S639137U
Authority
JP
Japan
Prior art keywords
integrated circuit
power supplies
insulating film
interposed therebetween
same position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10298986U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10298986U priority Critical patent/JPS639137U/ja
Publication of JPS639137U publication Critical patent/JPS639137U/ja
Pending legal-status Critical Current

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Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のチツプ周縁における実施例の
平面図、第2図は従来例の平面図である。 1……高電位電源VDDの主幹配線、2……G
NDの主幹配線、3……ボンデイングパツド、4
……入出力回路、5……内部回路、6……チツプ
端縁、7,8……分枝配線。
FIG. 1 is a plan view of an embodiment of the chip periphery of the present invention, and FIG. 2 is a plan view of a conventional example. 1...Main wiring of high potential power supply VDD, 2...G
ND main wiring, 3...Bonding pad, 4
...Input/output circuit, 5...Internal circuit, 6...Chip edge, 7, 8...Branch wiring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数個の電源をもつ多層配線構造の半導体集積
回路において、少なくとも、前記電源のうち2電
源の主幹となる配線を絶縁膜を介して同じ位置に
上下2層の構造としたことを特徴とする半導体集
積回路。
A semiconductor integrated circuit having a multilayer wiring structure having a plurality of power supplies, characterized in that at least the main wiring for two of the power supplies is arranged in upper and lower layers at the same position with an insulating film interposed therebetween. integrated circuit.
JP10298986U 1986-07-03 1986-07-03 Pending JPS639137U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10298986U JPS639137U (en) 1986-07-03 1986-07-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10298986U JPS639137U (en) 1986-07-03 1986-07-03

Publications (1)

Publication Number Publication Date
JPS639137U true JPS639137U (en) 1988-01-21

Family

ID=30975136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10298986U Pending JPS639137U (en) 1986-07-03 1986-07-03

Country Status (1)

Country Link
JP (1) JPS639137U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60206161A (en) * 1984-03-30 1985-10-17 Toshiba Corp Semiconductor integrated circuit
JPS6164142A (en) * 1984-09-06 1986-04-02 Toshiba Corp Semiconductor integrated circuit device
JPS61158162A (en) * 1984-12-28 1986-07-17 Toshiba Corp Semiconductor integrated circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60206161A (en) * 1984-03-30 1985-10-17 Toshiba Corp Semiconductor integrated circuit
JPS6164142A (en) * 1984-09-06 1986-04-02 Toshiba Corp Semiconductor integrated circuit device
JPS61158162A (en) * 1984-12-28 1986-07-17 Toshiba Corp Semiconductor integrated circuit

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