JPS6390853U - - Google Patents

Info

Publication number
JPS6390853U
JPS6390853U JP1986186172U JP18617286U JPS6390853U JP S6390853 U JPS6390853 U JP S6390853U JP 1986186172 U JP1986186172 U JP 1986186172U JP 18617286 U JP18617286 U JP 18617286U JP S6390853 U JPS6390853 U JP S6390853U
Authority
JP
Japan
Prior art keywords
duct
semiconductor
conversion device
cooling
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986186172U
Other languages
English (en)
Other versions
JPH0541560Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986186172U priority Critical patent/JPH0541560Y2/ja
Priority to US07/127,393 priority patent/US4901138A/en
Publication of JPS6390853U publication Critical patent/JPS6390853U/ja
Application granted granted Critical
Publication of JPH0541560Y2 publication Critical patent/JPH0541560Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Power Conversion In General (AREA)
  • Details Of Resistors (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図は本考案による半導体変換装置の冷却構
造の実施例を示す図、第２図及び第３図は第１図
Ａ―Ａ矢視図及びＢ―Ｂ矢視図、第４図は本考案
が適用される他の実施例を示す図、第５図は本考
案が適用される代表的な半導体変換装置の回路図
、第６図は従来の半導体変換装置の構造図、第７
図は第６図のＡ―Ａ矢視図、第８図は従来の他の
半導体変換装置の構造図、第９図は抵抗の冷却風
速と最大使用電力の相関図である。 １…リアクトル、２…コンデンサ、３…半導体
ユニツト、４…抵抗、５…冷却フアン、６…トビ
ラ、７…フイルター、８…吸気口、１０…排気口
、１１ａ，１１ｂ…案内板、１２…ダクト、１３
…風穴。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を冷却した後の冷却風で抵抗等の発
    熱体を冷却するようにした冷却構造を持つ半導体
    変換装置において、前記半導体変換装置の前面に
    取付れられた各半導体素子の後面にダクトを設け
    、前記半導体を冷却した空気を一旦そのダクトに
    集め、ダクトに集められた冷却風をダクトの上部
    又は下部からダクトの後部に導きダクトの後部に
    設けられる抵抗等の発熱体を冷却するようにした
    ことを特徴とする半導体変換装置の冷却構造。
JP1986186172U 1986-12-04 1986-12-04 Expired - Lifetime JPH0541560Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1986186172U JPH0541560Y2 (ja) 1986-12-04 1986-12-04
US07/127,393 US4901138A (en) 1986-12-04 1987-12-02 Semiconductor converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986186172U JPH0541560Y2 (ja) 1986-12-04 1986-12-04

Publications (2)

Publication Number Publication Date
JPS6390853U true JPS6390853U (ja) 1988-06-13
JPH0541560Y2 JPH0541560Y2 (ja) 1993-10-20

Family

ID=16183650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986186172U Expired - Lifetime JPH0541560Y2 (ja) 1986-12-04 1986-12-04

Country Status (2)

Country Link
US (1) US4901138A (ja)
JP (1) JPH0541560Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010016959A (ja) * 2008-07-02 2010-01-21 Toshiba Mitsubishi-Electric Industrial System Corp 風冷式電力変換装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE9304264L (sv) * 1993-12-22 1995-06-23 Ericsson Telefon Ab L M Förfarande och anordning för kylning i slutna rum
JPH07202464A (ja) * 1993-12-28 1995-08-04 Toshiba Corp 電子機器装置並びに電子機器装置用冷却方法及びファン装置
GB9408043D0 (en) * 1994-04-22 1994-06-15 At & T Global Inf Solution Structure for cooling an equipment enclosure
US6158454A (en) * 1998-04-14 2000-12-12 Insync Systems, Inc. Sieve like structure for fluid flow through structural arrangement
GB9924903D0 (en) * 1999-10-22 1999-12-22 Eaton Ltd Cooling resistor banks
US6459579B1 (en) * 2001-01-03 2002-10-01 Juniper Networks, Inc. Apparatus and method for directing airflow in three dimensions to cool system components
US6541942B1 (en) * 2001-11-13 2003-04-01 Aerovironment, Inc. Capacitor tub assembly and method of cooling
GB0207382D0 (en) 2002-03-28 2002-05-08 Holland Heating Uk Ltd Computer cabinet
TWI260484B (en) * 2003-08-12 2006-08-21 Asustek Comp Inc Heat sink for power device on computer motherboard
DE202006006441U1 (de) * 2006-04-21 2006-07-06 Knürr AG Anordnung zum Kühlen von elektrischen Baugruppen und Geräten
JP5348623B2 (ja) * 2010-09-10 2013-11-20 株式会社安川電機 電子機器装置
US20190115284A1 (en) * 2017-10-16 2019-04-18 David Herbert Livingston Cooling device and method for heat-generating components

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59177997A (ja) * 1983-03-28 1984-10-08 日本電気株式会社 電子装置の冷却構造
JPS608475A (ja) * 1983-06-20 1985-01-17 ルシオ・ブイ・リ−ル 発電装置
JPH06210444A (ja) * 1993-01-14 1994-08-02 Kuroda Denki Kk 液体雰囲気を利用したはんだ付方法
JPH06273593A (ja) * 1993-03-22 1994-09-30 Hiroyuki Matsuda 物質を等価的にタキオン化する方法
JP2847605B2 (ja) * 1993-03-23 1999-01-20 住友重機械工業株式会社 低速陽電子ビーム発生装置
JPH06273592A (ja) * 1993-03-24 1994-09-30 Ishikawajima Harima Heavy Ind Co Ltd 地層シュミレーション装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010016959A (ja) * 2008-07-02 2010-01-21 Toshiba Mitsubishi-Electric Industrial System Corp 風冷式電力変換装置

Also Published As

Publication number Publication date
JPH0541560Y2 (ja) 1993-10-20
US4901138A (en) 1990-02-13

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