JPS639020B2 - - Google Patents

Info

Publication number
JPS639020B2
JPS639020B2 JP57039869A JP3986982A JPS639020B2 JP S639020 B2 JPS639020 B2 JP S639020B2 JP 57039869 A JP57039869 A JP 57039869A JP 3986982 A JP3986982 A JP 3986982A JP S639020 B2 JPS639020 B2 JP S639020B2
Authority
JP
Japan
Prior art keywords
copper
complexing agent
solution
exchange membrane
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57039869A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58157959A (ja
Inventor
Hideo Honma
Yoshiaki Suzuki
Yasuhiro Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KANTO KASEI KOGYO KK
Original Assignee
KANTO KASEI KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KANTO KASEI KOGYO KK filed Critical KANTO KASEI KOGYO KK
Priority to JP57039869A priority Critical patent/JPS58157959A/ja
Priority to US06/372,133 priority patent/US4425205A/en
Priority to EP82400798A priority patent/EP0088852B1/en
Priority to DE8282400798T priority patent/DE3272286D1/de
Priority to GB08212818A priority patent/GB2117003B/en
Priority to KR8201949A priority patent/KR870001547B1/ko
Priority to CA000418017A priority patent/CA1220759A/en
Publication of JPS58157959A publication Critical patent/JPS58157959A/ja
Publication of JPS639020B2 publication Critical patent/JPS639020B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
JP57039869A 1982-03-13 1982-03-13 無電解めつき浴の再生方法およびそれに使用する装置 Granted JPS58157959A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP57039869A JPS58157959A (ja) 1982-03-13 1982-03-13 無電解めつき浴の再生方法およびそれに使用する装置
US06/372,133 US4425205A (en) 1982-03-13 1982-04-27 Process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath
EP82400798A EP0088852B1 (en) 1982-03-13 1982-04-30 A process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath
DE8282400798T DE3272286D1 (en) 1982-03-13 1982-04-30 A process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath
GB08212818A GB2117003B (en) 1982-03-13 1982-05-04 Apparatus and process for electroless plating bath regeneration
KR8201949A KR870001547B1 (ko) 1982-03-13 1982-05-04 무전해 도금욕 재생방법 및 그 재생장치
CA000418017A CA1220759A (en) 1982-03-13 1982-12-17 Regeneration of plating bath by acidification and treatment of recovered chelating agent in membrane cell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57039869A JPS58157959A (ja) 1982-03-13 1982-03-13 無電解めつき浴の再生方法およびそれに使用する装置

Publications (2)

Publication Number Publication Date
JPS58157959A JPS58157959A (ja) 1983-09-20
JPS639020B2 true JPS639020B2 (enExample) 1988-02-25

Family

ID=12564974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57039869A Granted JPS58157959A (ja) 1982-03-13 1982-03-13 無電解めつき浴の再生方法およびそれに使用する装置

Country Status (2)

Country Link
JP (1) JPS58157959A (enExample)
KR (1) KR870001547B1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8177956B2 (en) * 2008-03-12 2012-05-15 Micyus Nicole J Method of electrolytically dissolving nickel into electroless nickel plating solutions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH573126A5 (enExample) * 1974-06-07 1976-02-27 Bbc Brown Boveri & Cie
JPS5223530A (en) * 1975-08-17 1977-02-22 Inoue Japax Res Treating method of chemical copper plating solution
JPS565965A (en) * 1979-06-27 1981-01-22 Hitachi Ltd Treatment of chemical copper plating waste liquor

Also Published As

Publication number Publication date
JPS58157959A (ja) 1983-09-20
KR870001547B1 (ko) 1987-09-02
KR830010223A (ko) 1983-12-26

Similar Documents

Publication Publication Date Title
CA1220759A (en) Regeneration of plating bath by acidification and treatment of recovered chelating agent in membrane cell
US5454930A (en) Electrolytic copper plating using a reducing agent
EP0079505A1 (en) A method of recovering copper from spent etch solutions
JPH10317154A (ja) 錫メッキ用溶液の再生方法およびその装置
US5217751A (en) Stabilized spray displacement plating process
US5211831A (en) Process for extending the life of a displacement plating bath
CA2083196C (en) Process for extending the life of a displacement plating bath
TWI588291B (zh) 從鍍覆溶液移除雜質之方法
KR20120075437A (ko) 도금액으로부터 불순물의 제거방법
US3843504A (en) Method of continuously regenerating and recycling a spent etching solution
JPH0416549B2 (enExample)
KR102558446B1 (ko) 회로 기판 및/또는 기판 제조의 부분 스트림으로부터 금속염 함유 매체를 처리하는 방법
JPS639020B2 (enExample)
US4734175A (en) Process for regenerating an electroless copper plating bath
JPS634634B2 (enExample)
US4416745A (en) Process for recovering nickel from spent electroless nickel plating solutions
JPS599159A (ja) 無電解めつき浴の濃度調整方法およびそれに使用する装置
JP3339386B2 (ja) 無電解めっき浴の処理方法
CN114032558B (zh) 一种从化学镀镍废液中电解制取NiP微米颗粒的方法
CN1242095C (zh) 无电解镀液的再生方法
JP2001020085A (ja) エッチング廃液の処理方法及びエッチング廃液処理装置
JPS6112871A (ja) 無電解銅めつき液の連続的再生方法
JP3401871B2 (ja) 廃液再生処理方法及びその装置
JP2000160400A (ja) 非溶解性陽極による電気メッキ法及びその装置
JPS5826427B2 (ja) 無電解銅めっき方法