JPS6388824A - Applicator for resist - Google Patents

Abstract

PURPOSE:To form a uniform resist film extending over the whole region of a substrate by rotating the substrate, on which a resist solution is dropped, using the center of the substrate as an axis and revolving the center of the substrate. CONSTITUTION:A substrate 3 is rotated, employing a rotation axis 8 as a center, and revolved, using a revolution axis 9 as a center. Consequently, centrifugal force by revolution besides centrifugal force by rotation works to a resist solution on the substrate 3. Since centrifugal force by the revolution operates, changing in the direction of 360 deg. at the period of revolution, omnidirectional centrifugal force works on the resist solution on the substrate 3. Accordingly, the unequal region of a resist film extending in the radial direction resulting from the irregular stepped section of an etching-pattern is removed, thus also improving the mass production of an applicator for a resist.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a resist coating device.

(Prior Art) As a conventional resist coating device, there is one shown in FIG. 4, for example. That is, this resist coating apparatus is equipped with a supply port 1 for supplying a resist solution at the upper part, a substrate 3 for applying the resist solution at the lower part, and a spinner 4 for horizontally holding and rotating the substrate 3.

In this resist coating device, as shown in FIG. 4, a resist solution 2 is dropped from a supply port 1 onto the center portion of a substrate 3,
The spinner 4 is rotated to disperse the resist over the entire surface of the substrate 3 by centrifugal force, thereby forming a resist film 5 on the surface of the substrate 3 as shown in FIG.

However, when the resist solution 2 is dispersed on the plane of the substrate 3 by centrifugal force to form the resist film 2 as described above, the flow of the resist bath solution 2 is in the direction of the centrifugal force, that is, in a radial radius from the center of rotation of the substrate 3. The flow will be in the direction. Incidentally, as shown in FIG. 6, an uneven etching pattern is provided on the 3,000-sided substrate, and the flow of the resist solution 2 is stopped by the steps 6 of this uneven etching pattern. Further downstream, the resist solution 2 flows non-uniformly, causing the resist film 5 to have non-uniform regions 7 radially extending from the center of the substrate 3, as shown in FIG.

(Problems to be Solved by the Invention) As mentioned above, in the conventional resist coating apparatus, due to the uneven steps of the etching pattern provided on the substrate,
The resist solution flows radially from the center of rotation of the substrate (this creates a non-uniform area, and there is a risk that the resist film will not be formed uniformly over the entire substrate. Therefore, the present invention solves the above problem. It is an object of the present invention to provide a resist coating device that can form a uniform resist film over the entire area.

[Structure of the invention]

(Means for Solving the Problems) In order to achieve the above object, in the resist coating apparatus of the present invention, the substrate onto which the resist solution is dropped rotates around the substrate, and the substrate rotates around the substrate. The structure is such that the axis revolves.

(Function) In conventional resist coating apparatuses, since the substrate simply rotates about its center, the direction of centrifugal force was always radial from the center of the rotation axis. For this reason, the resist film has regions with non-uniform film thickness radially from the center of rotation. On the other hand, in the resist coating apparatus of the present invention, since the substrate not only rotates but also revolves, the centrifugal force due to the revolution that acts on the resist solution coated on the substrate is applied over the entire 360° period of revolution. As a result, the unevenness and non-uniformity of the resist solution are alleviated, and a more uniform resist film can be obtained.

(Example) An example of the resist coating apparatus of the present invention will be described below with reference to the drawings. FIG. 1 is a conceptual diagram of an embodiment of the present invention. The substrate 3 rotates around an axis of rotation 8 and revolves around an axis of revolution 9. Therefore, in addition to centrifugal force due to rotation, centrifugal force due to revolution acts on the resist solution on the substrate 3. The centrifugal force due to this revolution is 3 times the revolution period.
Since the centrifugal force acts while changing in the 60° direction, centrifugal force acts on the resist solution on the substrate 3 in all directions, resulting in failure of the resist film extending in the radial direction as shown in FIG. 7 of the conventional example. Uniform areas are relaxed.

Next, a specific configuration of the present invention will be explained. Second
The figure shows an autorotation/revolution mechanism using planetary gears using an inner wheel, and by rotating the drive gear 10, the gear 11 on which the substrate 3 is placed rotates and revolves. Note that the resist solution is dropped from the supply port 1 as in the conventional case.

In addition, in FIG. 3, each board 3 rotates independently on its own spinner 4a, and further, a spinner 4 for making each board 3 revolve.
A spinner 4a is mounted on b. In addition to these two configurations, various modifications can be made without departing from the gist of the present invention.

〔Effect of the invention〕

As explained above, according to the present invention, the non-uniform areas of the resist film extending in the radial direction due to the uneven steps of the etching pattern that have conventionally occurred are eliminated.
A resist coating device that can form a uniform resist film over the entire substrate area and is suitable for mass production can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a principle diagram explaining the principle of a resist coating apparatus according to the present invention, FIG. 2 is a plan view showing an embodiment of the resist coating apparatus according to the present invention, and FIG. FIGS. 4 and 5 are side views showing a conventional resist coating apparatus, and FIGS. 6 and 7 are
It is an explanatory diagram for explaining a conventional problem. DESCRIPTION OF SYMBOLS 1... Supply port, 2... Resist solution, 3... Substrate, 4... Spinner, 5... Resist film, 6... Etching pattern, 8 Autorotation axis, 9... Revolution axis .

Claims (1)

[Claims] A resist coating device that drops a resist solution onto a substrate to form a resist film on the substrate surface, further comprising a substrate rotation means that rotates the substrate around the center of the substrate and revolves around the center of the substrate. Resist coating equipment.