JPS6388824A - Applicator for resist - Google Patents
Applicator for resistInfo
- Publication number
- JPS6388824A JPS6388824A JP23316986A JP23316986A JPS6388824A JP S6388824 A JPS6388824 A JP S6388824A JP 23316986 A JP23316986 A JP 23316986A JP 23316986 A JP23316986 A JP 23316986A JP S6388824 A JPS6388824 A JP S6388824A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resist
- centrifugal force
- center
- revolution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000001788 irregular Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の目的〕 (産業上の利用分野) 本発明は、レジストの塗布装置に関するものである。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a resist coating device.
(従来の技術)
従来のレジスト塗布装置としては、例えば第4図に示す
ようなものがある。すなわち、このレジスト塗布装置は
上部にレジスト溶液を供給する供給口1を、下部にレジ
スト溶液を塗布する基板3およびこの基板3を水平に保
持し、回転させるスピナ4を備えている。(Prior Art) As a conventional resist coating device, there is one shown in FIG. 4, for example. That is, this resist coating apparatus is equipped with a supply port 1 for supplying a resist solution at the upper part, a substrate 3 for applying the resist solution at the lower part, and a spinner 4 for horizontally holding and rotating the substrate 3.
このレジスト塗布装置では、第4図に示すように供給口
1からレジスト溶液2を基板3の中央部lこ滴下させ、
スピナ4を回転させ遠心力により基板3千面上の全面に
わたって分散させ、第5図に示すように基板3表面にレ
ジスト膜5を形成させるものである。In this resist coating device, as shown in FIG. 4, a resist solution 2 is dropped from a supply port 1 onto the center portion of a substrate 3,
The spinner 4 is rotated to disperse the resist over the entire surface of the substrate 3 by centrifugal force, thereby forming a resist film 5 on the surface of the substrate 3 as shown in FIG.
しかしながら、上記のように遠心力によりレジスト溶液
2を基板3平面上に分散させレジスト膜2を形成させる
場合、レジスト浴液2の流れは遠心力の方向、つまり基
板3の回転中心から放射状に半径方向に向く流れとなる
。ところで、基板3千面上には第6図に示すように凹凸
状のエツチング・パターンが設けられており、レジスト
溶液2の流れは、この凹凸状のエツチング・パターンの
段差6でせきとめられ、これより下流ではレジスト溶液
2の流れが不均−lこなり、レジスト膜5は第7図に示
すように基板3中心から放射状に不均一な領域7が生じ
るという問題があった。However, when the resist solution 2 is dispersed on the plane of the substrate 3 by centrifugal force to form the resist film 2 as described above, the flow of the resist bath solution 2 is in the direction of the centrifugal force, that is, in a radial radius from the center of rotation of the substrate 3. The flow will be in the direction. Incidentally, as shown in FIG. 6, an uneven etching pattern is provided on the 3,000-sided substrate, and the flow of the resist solution 2 is stopped by the steps 6 of this uneven etching pattern. Further downstream, the resist solution 2 flows non-uniformly, causing the resist film 5 to have non-uniform regions 7 radially extending from the center of the substrate 3, as shown in FIG.
(発明が解決しようとする問題点)
上記のように従来のレジスト塗布装置では、基板上に設
けられたエツチング会パターンの凹凸状の段差のため、
基板回転中心から放射状にレジスト溶液の流れ(こ不均
一な領域が生じ、レジスト膜が基板全域にわたって均一
に形成されない恐れがあった〇
そこで本発明は、上記の問題点を解決するもので、基板
全域にわたって均一なレジスト膜が形成できるレジスト
の塗布装置を提供することを目的としている。(Problems to be Solved by the Invention) As mentioned above, in the conventional resist coating apparatus, due to the uneven steps of the etching pattern provided on the substrate,
The resist solution flows radially from the center of rotation of the substrate (this creates a non-uniform area, and there is a risk that the resist film will not be formed uniformly over the entire substrate. Therefore, the present invention solves the above problem. It is an object of the present invention to provide a resist coating device that can form a uniform resist film over the entire area.
(問題点を解決するための手段)
上記目的を達成するために、本発明のレジストの塗布装
置にあっては、レジスト溶液を滴下された基板が基板を
中心に自転し、かつ基板中心の自転軸が公転する構成と
した。(Means for Solving the Problems) In order to achieve the above object, in the resist coating apparatus of the present invention, the substrate onto which the resist solution is dropped rotates around the substrate, and the substrate rotates around the substrate. The structure is such that the axis revolves.
(作用)
従来のレジスト塗布装置では、基板はその中心を軸に自
転しているだけなので、遠心力の方向は常に回転軸中心
から半径方向に向いていた。このためレジスト膜は回転
中心から放射状の膜厚不均一領域を生じていた。これに
対して、本発明のレジストの塗布装置では、基板は自転
のみではなく公転しているため、基板上に塗布されたレ
ジスト溶液に作用する公転による遠心力は、公転周期で
360°の全方向にはたらくことになり、レジスト溶液
のhれ、め不均一性は緩和され、レジスト膜もより均一
なものが得られる。(Function) In conventional resist coating apparatuses, since the substrate simply rotates about its center, the direction of centrifugal force was always radial from the center of the rotation axis. For this reason, the resist film has regions with non-uniform film thickness radially from the center of rotation. On the other hand, in the resist coating apparatus of the present invention, since the substrate not only rotates but also revolves, the centrifugal force due to the revolution that acts on the resist solution coated on the substrate is applied over the entire 360° period of revolution. As a result, the unevenness and non-uniformity of the resist solution are alleviated, and a more uniform resist film can be obtained.
(実施例)
以下1本発明の・レジストの塗布装置の実施例を図面を
参照して説明する。第1図は本発明の一実施例の概念図
−である。基板3は、自転軸8を中心に自転し、かつ公
転軸9を中心に公転する。このため、基板3上のレジス
ト溶液には、自転による遠心力のほかに公転による遠心
力が作用する。この公転による遠心力は、公転周期で3
60°方向に変化しながら作用するので、基板3上のレ
ジスト溶液にはあらゆる方向の遠心力が作用することに
なり、従来例の第7図に示したような半径方向にのびる
レジスト膜の不均一領域が緩和される。(Example) An example of the resist coating apparatus of the present invention will be described below with reference to the drawings. FIG. 1 is a conceptual diagram of an embodiment of the present invention. The substrate 3 rotates around an axis of rotation 8 and revolves around an axis of revolution 9. Therefore, in addition to centrifugal force due to rotation, centrifugal force due to revolution acts on the resist solution on the substrate 3. The centrifugal force due to this revolution is 3 times the revolution period.
Since the centrifugal force acts while changing in the 60° direction, centrifugal force acts on the resist solution on the substrate 3 in all directions, resulting in failure of the resist film extending in the radial direction as shown in FIG. 7 of the conventional example. Uniform areas are relaxed.
次に、この発明の具体的な構成について説明する。第2
図は内薗車を用いて遊星歯車による自転・公転機構であ
り、駆動歯車10を回転させることにより、基板3をの
せる歯車11が自転と公転をおこなう。なお、レジスト
溶液の滴下等は従来と同様に供給口1から行なっている
。Next, a specific configuration of the present invention will be explained. Second
The figure shows an autorotation/revolution mechanism using planetary gears using an inner wheel, and by rotating the drive gear 10, the gear 11 on which the substrate 3 is placed rotates and revolves. Note that the resist solution is dropped from the supply port 1 as in the conventional case.
また、第3図では各基板3は各々のスピナ4aで独立に
自転し、さらに、各基板3を公転させるためのスピナ4
bの上にスピナ4aが搭載されている。この2つの構成
の他にも本発明の要旨を逸脱しない範囲において種々変
形して用いることができる。In addition, in FIG. 3, each board 3 rotates independently on its own spinner 4a, and further, a spinner 4 for making each board 3 revolve.
A spinner 4a is mounted on b. In addition to these two configurations, various modifications can be made without departing from the gist of the present invention.
以上説明したように本発明によれば、従来生じていたよ
うなエツチング・パターンの凹凸状の段差に起因する半
径方向にのびるレジスト膜の不均一な領域がなくなり、
基板全域にわたって均一なレジスト膜が形成できると共
に大量生産にもすぐれたレジストの塗布装置が得られる
。As explained above, according to the present invention, the non-uniform areas of the resist film extending in the radial direction due to the uneven steps of the etching pattern that have conventionally occurred are eliminated.
A resist coating device that can form a uniform resist film over the entire substrate area and is suitable for mass production can be obtained.
第1図は1本発明のレジストの塗布装置の原理を説明す
る原理図、第2図は、本発明のレジストの塗布装置の一
実施例を示す平面図、第3図は、本発明の他の実施例を
示す平面図及び側面図、第4図及び第5図は、従来のレ
ジストの塗布装置を示す側面図、第6図及び第7図は、
従来の問題点を説明するための説明図である。
1・・・供給口、2・・・レジスト溶液、3・・・基板
、4・・・スピナ゛、5・・レジスト膜、6・・・エツ
チングパターン、8 自転軸、9・・・公転軸。FIG. 1 is a principle diagram explaining the principle of a resist coating apparatus according to the present invention, FIG. 2 is a plan view showing an embodiment of the resist coating apparatus according to the present invention, and FIG. FIGS. 4 and 5 are side views showing a conventional resist coating apparatus, and FIGS. 6 and 7 are
It is an explanatory diagram for explaining a conventional problem. DESCRIPTION OF SYMBOLS 1... Supply port, 2... Resist solution, 3... Substrate, 4... Spinner, 5... Resist film, 6... Etching pattern, 8 Autorotation axis, 9... Revolution axis .
Claims (1)
形成するレジストの塗布装置において、前記基板を基板
中心を軸として自転させ、かつ前記基板中心を公転させ
る基板回転手段を設けたことを特徴とするレジストの塗
布装置。A resist coating device that drops a resist solution onto a substrate to form a resist film on the substrate surface, further comprising a substrate rotation means that rotates the substrate around the center of the substrate and revolves around the center of the substrate. Resist coating equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23316986A JPS6388824A (en) | 1986-10-02 | 1986-10-02 | Applicator for resist |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23316986A JPS6388824A (en) | 1986-10-02 | 1986-10-02 | Applicator for resist |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6388824A true JPS6388824A (en) | 1988-04-19 |
Family
ID=16950806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23316986A Pending JPS6388824A (en) | 1986-10-02 | 1986-10-02 | Applicator for resist |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6388824A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5478595A (en) * | 1992-03-18 | 1995-12-26 | Kimitoshi Matou | Method and apparatus for forming film on surface of disk |
US7836847B2 (en) | 2006-02-17 | 2010-11-23 | Howmedica Osteonics Corp. | Multi-station rotation system for use in spray operations |
US7981479B2 (en) | 2006-02-17 | 2011-07-19 | Howmedica Osteonics Corp. | Multi-station rotation system for use in spray operations |
-
1986
- 1986-10-02 JP JP23316986A patent/JPS6388824A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5478595A (en) * | 1992-03-18 | 1995-12-26 | Kimitoshi Matou | Method and apparatus for forming film on surface of disk |
US7836847B2 (en) | 2006-02-17 | 2010-11-23 | Howmedica Osteonics Corp. | Multi-station rotation system for use in spray operations |
US7981479B2 (en) | 2006-02-17 | 2011-07-19 | Howmedica Osteonics Corp. | Multi-station rotation system for use in spray operations |
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