JPH0632674Y2 - Photoresist coating device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a photoresist coating apparatus for coating a photoresist on a substrate for forming an electrode film, for example.

[Conventional technology]

For example, when a photoresist is applied on a glass substrate for a liquid crystal display panel, a rotary photoresist applying device is generally used.

The structure of a photoresist coating apparatus of this type is shown in FIGS. 4 and 5, and 1 is a processing tank, and a spin table 3 driven by a spin motor 2 to rotate in the center of the processing tank 1 is horizontal. It is provided in. This spin table 3
A waste liquid cover 4 is provided on the outer periphery of the
A waste liquid receiving tray 5 formed in an annular shape is arranged below the periphery of the waste liquid receiving tray 5, and a drain port 6 communicating with the outside of the processing tank 1 is formed in a part of the bottom surface of the waste liquid receiving tray 5.

The spin table 3 is, as shown in FIGS. 6 to 8,
It is composed of a base 11 that rotates in conjunction with the spin motor 2 and a substrate stage 12 attached to the upper surface of the base 11. A vacuum path 13 is formed in the upper surface of the base 11 so as to be evenly distributed over substantially the entire upper surface of the base 11, and a vacuum path communicating with a vacuum pump (not shown) is formed in the lower surface of the base 11. A chamber 14 is formed, and the vacuum chamber 14 communicates with the vacuum passage 13 via a communication hole 15. A substrate stage 12 is attached to the upper surface of the base 11 via screws 16 so as to cover the entire vacuum path 13 in the form of a spider web, and along the vacuum path 13 on the plate surface of the substrate stage 12. A large number of vacuum suction holes 17 having a diameter of about 1 mm are formed so as to be evenly arranged,
A vacuum suction force acts on the surface of the substrate stage 12 through these vacuum suction holes 17.

In the photoresist coating apparatus configured as described above, a rectangular or circular substrate a is supplied and arranged on the spin table 3 during the photoresist coating process, and the substrate a is placed in each vacuum suction hole 17. It is adsorbed and fixed on the surface of the substrate stage 12 by the vacuum adsorption force acting on the substrate stage 12. Then, the photoresist is dropped onto the substrate a through a dropping nozzle (not shown), and in this state, the spin table 3 rotates in conjunction with the spin motor 2, and the rotation centrifugal force causes the substrate a to rotate.
The photoresist dropped on is spread over the entire surface of the substrate a and applied.

[Problems to be solved by the device]

However, in such a conventional photoresist coating apparatus, on the back surface of the substrate a, there are portions where the vacuum suction force is directly exerted through the vacuum suction holes 17 and portions where the vacuum suction force is not exerted, and these portions are delicate. A temperature difference is generated, and this temperature difference influences the fluidity of the photoresist, and the thickness of the photoresist on the surface of the substrate a is changed by this effect, so that the photoresist film follows the vacuum path 13. There is a problem that a nest-like striped pattern is formed and the film thickness becomes non-uniform, and as a result, the dimensional accuracy at the time of patterning the photoresist is lowered.

This invention was made with this point in mind, and its purpose is to ensure that the photoresist is applied to each part of the surface of the substrate to a uniform thickness to achieve good dimensional accuracy during patterning. It is an object of the present invention to provide a photoresist coating apparatus which can be kept at a constant temperature.

[Means for Solving the Problems]

In order to achieve such an object, the present invention forms a vacuum path uniformly distributed over the entire upper surface of a base that rotates in conjunction with a motor, and forms a porous material on the upper surface of the base. A substrate stage consisting of a base table and a substrate stage is attached to form a spin table, the substrate is placed on the substrate stage of the spin table, and the vacuum suction force of the vacuum path is passed through the porous gap of the substrate stage. Act on the surface of the stage, fix the substrate to the substrate stage with this vacuum suction force, drop photoresist on this substrate, and apply this photoresist to the entire surface of the substrate by the rotating centrifugal force of the spin table It is something that is done.

[Action]

In such a configuration, the vacuum suction force of the vacuum path acts on the substrate through the porous voids of the substrate stage, and the porous voids of the substrate stage are uniformly and densely distributed over the entire plate surface, and thus the substrate The vacuum suction force that acts on the back surface of the substrate is evenly distributed over the entire back surface of the substrate, so that a partial temperature difference does not occur in the substrate. It is spread evenly over the entire surface so that each part is surely coated to have a uniform film thickness.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS.

In this embodiment, the base 11 of the spin table 3 is formed in a rectangular shape, and a vacuum path 13 in the shape of a web is formed on the upper surface of the base 11 so as to be evenly distributed over the entire upper surface. 13 communicates with the vacuum chamber 14 on the lower surface side of the base 11 via a communication hole 15.
The substrate stage 12 is attached and fixed to the upper surface of the base 11 with an adhesive or the like so as to cover the entire vacuum passage 13.

The substrate stage 12 is formed of a porous material such as polyethylene, urethane, Teflon, and ceramics, which has a lower hardness than the substrate a.

In such a configuration, the vacuum suction force of the vacuum passage 13 acts on the surface of the substrate stage 12 through the fine porous voids of the substrate stage 12, and this vacuum suction force causes the substrate a placed on the substrate stage 12 to move. Are adsorbed and fixed. Then, in this state, the photoresist is dropped onto the substrate a, and the photoresist is spread and applied to the entire substrate a by the centrifugal force of rotation of the spin table 3.

The porous voids of the substrate stage 12 are
2 is uniformly and densely distributed over the entire surface of the substrate a, so that the vacuum suction force acting on the back surface of the substrate a is evenly distributed over the entire back surface thereof, so that a partial temperature difference does not occur in the substrate a. As a result, the photoresist dropped on the surface of the substrate a is evenly spread over the entire surface of the substrate a, and the photoresist is applied so that each portion surely has a uniform film thickness.

Therefore, it is possible to form a highly accurate electrode film pattern, for example, while maintaining good dimensional accuracy when patterning the photoresist.

[Effect of device]

As described above, according to the present invention, the photoresist can be applied to the entire surface of the substrate so that each part has a uniform film thickness. Therefore, the dimensional accuracy during patterning can be kept good. It is possible to form a highly accurate electrode film pattern and the like.

[Brief description of drawings]

1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a plan view of the same, FIG. 3 is a plan view of a base in the same embodiment, and FIG. 4 is a sectional view of a conventional photoresist coating apparatus.
5 is a plan view of the same, FIG. 6 is a plan view of a spin table in the photoresist coating apparatus, FIG. 7 is a plan view of a base in the spin table, and FIG. 8 is a sectional view of the same. 2 ... Spin motor, 3 ... Spin table, 11 ... Base, 12 ... Substrate stage, 13 ... Vacuum path, a ... Substrate.

Claims (1)

[Scope of utility model registration request] 1. A vacuum path is formed on the upper surface of a base that rotates in conjunction with a motor and is evenly distributed over substantially the entire surface of the base. A substrate stage made of a porous material is attached to the upper surface of the base. A spin table is constituted by a base and a substrate stage, a substrate is placed on the substrate stage of the spin table, and a vacuum suction force of the vacuum path is applied to the surface of the substrate stage through a porous void of the substrate stage. A photoresist characterized in that the substrate is fixed on a substrate stage by a vacuum suction force, a photoresist is dropped on the substrate, and the photoresist is applied to the entire surface of the substrate by a centrifugal force of rotation of a spin table. Coating device.