JPS6387826U - - Google Patents
Info
- Publication number
- JPS6387826U JPS6387826U JP18236786U JP18236786U JPS6387826U JP S6387826 U JPS6387826 U JP S6387826U JP 18236786 U JP18236786 U JP 18236786U JP 18236786 U JP18236786 U JP 18236786U JP S6387826 U JPS6387826 U JP S6387826U
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- power
- sample
- self
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Description
第1図は本考案の一実施例を示す概略図、第2
図はコントローラの機能を示すブロツク図、第3
図は同実施例の動作を示すフローチヤートである
。
2……反応室、8―1〜8―5……試料、10
―1〜10―5……電極、12―1〜12―5…
…高周波発振器、14―1〜14―5……直流電
圧測定器、16……コントローラ。
Fig. 1 is a schematic diagram showing an embodiment of the present invention;
The figure is a block diagram showing the functions of the controller.
The figure is a flowchart showing the operation of the same embodiment. 2...Reaction chamber, 8-1 to 8-5...Sample, 10
-1 to 10-5...electrode, 12-1 to 12-5...
...High frequency oscillator, 14-1 to 14-5... DC voltage measuring device, 16... Controller.
Claims (1)
設置し、前記チヤンバ内にガスを導入し、前記各
電極に交流電力を印加して前記試料をエツチング
する装置において、前記各電極に個別に交流電力
印加手段を設けるとともに、前記各電極に個別に
自己バイアス測定器を設け、前記全自己バイアス
測定器の出力が均一になるように前記各交流電力
印加手段の出力を調整するコントローラを設けた
ことを特徴とするエツチング装置。 In an apparatus in which a sample is placed on each of a plurality of electrodes in a chamber, a gas is introduced into the chamber, and AC power is applied to each of the electrodes to etch the sample, the AC power is individually applied to each of the electrodes. In addition to providing an applying means, a self-bias measuring device is provided for each of the electrodes individually, and a controller is provided for adjusting the output of each of the alternating current power applying means so that the outputs of all the self-bias measuring devices are uniform. Characteristic etching equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986182367U JPH0513007Y2 (en) | 1986-11-26 | 1986-11-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986182367U JPH0513007Y2 (en) | 1986-11-26 | 1986-11-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6387826U true JPS6387826U (en) | 1988-06-08 |
JPH0513007Y2 JPH0513007Y2 (en) | 1993-04-06 |
Family
ID=31128100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986182367U Expired - Lifetime JPH0513007Y2 (en) | 1986-11-26 | 1986-11-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0513007Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001077035A (en) * | 1999-09-07 | 2001-03-23 | Nec Kyushu Ltd | Device and method for manufacturing semiconductor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55118637A (en) * | 1979-03-06 | 1980-09-11 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Plasma etching apparatus |
-
1986
- 1986-11-26 JP JP1986182367U patent/JPH0513007Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55118637A (en) * | 1979-03-06 | 1980-09-11 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Plasma etching apparatus |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001077035A (en) * | 1999-09-07 | 2001-03-23 | Nec Kyushu Ltd | Device and method for manufacturing semiconductor |
Also Published As
Publication number | Publication date |
---|---|
JPH0513007Y2 (en) | 1993-04-06 |
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