JPS638760Y2 - - Google Patents
Info
- Publication number
- JPS638760Y2 JPS638760Y2 JP19717583U JP19717583U JPS638760Y2 JP S638760 Y2 JPS638760 Y2 JP S638760Y2 JP 19717583 U JP19717583 U JP 19717583U JP 19717583 U JP19717583 U JP 19717583U JP S638760 Y2 JPS638760 Y2 JP S638760Y2
- Authority
- JP
- Japan
- Prior art keywords
- mask
- mask body
- plating
- parts
- receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 28
- 239000007921 spray Substances 0.000 claims description 5
- 239000013013 elastic material Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001084 poly(chloroprene) Polymers 0.000 description 2
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19717583U JPS60105658U (ja) | 1983-12-23 | 1983-12-23 | 噴射メツキ用のマスク装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19717583U JPS60105658U (ja) | 1983-12-23 | 1983-12-23 | 噴射メツキ用のマスク装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60105658U JPS60105658U (ja) | 1985-07-18 |
| JPS638760Y2 true JPS638760Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-03-16 |
Family
ID=30755279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19717583U Granted JPS60105658U (ja) | 1983-12-23 | 1983-12-23 | 噴射メツキ用のマスク装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60105658U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4647085B2 (ja) * | 2000-11-24 | 2011-03-09 | 株式会社三井ハイテック | リードフレームのめっき装置 |
-
1983
- 1983-12-23 JP JP19717583U patent/JPS60105658U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60105658U (ja) | 1985-07-18 |