JPS638760Y2 - - Google Patents
Info
- Publication number
- JPS638760Y2 JPS638760Y2 JP19717583U JP19717583U JPS638760Y2 JP S638760 Y2 JPS638760 Y2 JP S638760Y2 JP 19717583 U JP19717583 U JP 19717583U JP 19717583 U JP19717583 U JP 19717583U JP S638760 Y2 JPS638760 Y2 JP S638760Y2
- Authority
- JP
- Japan
- Prior art keywords
- mask
- mask body
- plating
- parts
- receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 28
- 239000007921 spray Substances 0.000 claims description 5
- 239000013013 elastic material Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001084 poly(chloroprene) Polymers 0.000 description 2
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】
(イ) 考案の技術分野
この考案は噴射メツキ用のマスク装置、特に
ICリードフレームの如きプレート状のメツキ物
の複数の微小部分にメツキを施す噴射メツキ用の
マスク装置に関する。[Detailed explanation of the invention] (a) Technical field of the invention This invention is a mask device for spray plating, especially
The present invention relates to a spray plating mask device for plating a plurality of minute parts of a plate-shaped plated object such as an IC lead frame.
(ロ) 従来技術と問題点
従来のこの種のマスク装置としては例えば第１
図及び第２図に示すようなものがある。(b) Prior art and problems As a conventional mask device of this type, for example, the first
There are some as shown in Fig. 2 and Fig. 2.
即ち、このマスク装置１のベースとなる支持板
２には導通孔３が、ブレート状のメツキ物４のメ
ツキ対象部位４ａの間隔P1に相応する所定の導
通孔間隔P2を似て複数形成されており、該導通
孔３の平面形状は方形状、そして断面形状は下方
（矢印Ａ方向）に向けて拡開状とされている。そ
して支持板２の表面側２ａには後述するマスク体
６を嵌合して接着により固定するための長尺の受
部５が、長手方向（矢示Ｂ方向）に沿つて凹設さ
れている。 That is, a plurality of conductive holes 3 are formed in the support plate 2, which is the base of this mask device 1, at a predetermined conductive hole interval P2 corresponding to the interval P1 of the plating target portion 4a of the plate-like plated object 4. The planar shape of the through hole 3 is a rectangular shape, and the cross-sectional shape is expanded downward (in the direction of arrow A). On the front side 2a of the support plate 2, a long receiving part 5 is recessed along the longitudinal direction (direction of arrow B) into which a mask body 6, which will be described later, is fitted and fixed by adhesive. .
一方、上記受部５に嵌合・固定されるマスク体
６にマスク開口８が上記導通孔間隔P2に相応す
る開口間隔P3と、上記導通孔３に相応する平面
形状、サイズを以て形成されている。尚、このマ
スク体６は可撓弾性、耐薬品性を有する弾性材
〔例えばゴム、ネオブレン、テフロン等〕により
長尺状に形成されている。 On the other hand, a mask opening 8 is formed in the mask body 6 which is fitted and fixed to the receiving part 5 with an opening interval P 3 corresponding to the above-mentioned conduction hole interval P 2 and a planar shape and size corresponding to the above-mentioned conduction hole 3. ing. The mask body 6 is formed in a long shape from an elastic material (for example, rubber, neoprene, Teflon, etc.) having flexibility and chemical resistance.
プレート状のメツキ物４は図中長手方向（矢示
Ｂ方向）に、マスク体６上に載置され、上下動自
在な押圧手段９により押圧・固定されると共にカ
ソード化されるようにしてある。尚、プレート状
のメツキ物４がマスク体６に押圧・固定されるこ
とで、各メツキ対象部位４ａはマスク開口８内に
露呈され、このマスク開口８の輪郭が非メツキ部
位との境界を明瞭に区分けるものである。 The plate-shaped plated material 4 is placed on the mask body 6 in the longitudinal direction (in the direction of arrow B) in the figure, and is pressed and fixed by a vertically movable pressing means 9, and is turned into a cathode. . In addition, by pressing and fixing the plate-shaped plating object 4 to the mask body 6, each plating target area 4a is exposed in the mask opening 8, and the outline of this mask opening 8 clearly distinguishes the boundary with the non-plating area. It is divided into
そして支持板２の下方（矢示Ａ方向）に導通孔
３と対向して立設されているアノード兼用の各噴
射ノズル１０より噴射されたメツキ液が、導通孔
３、マスク開口８からプレート状のメツキ物４の
メツキ対象部位４ａに至りメツキ処理を施すもの
である。 Then, the plating liquid is sprayed from the injection nozzles 10 which also serve as anodes, which are installed vertically below the support plate 2 (in the direction of arrow A) and opposite the conduction holes 3, from the conduction holes 3 and the mask opening 8 into a plate shape. The plating process is applied to the plating target part 4a of the plating object 4.
しかしながら、このような従来のマスク装置１
にあつては、マスク体６が金属製のメツキ物４を
傷つけずに受止め且つメツキ対象部位４ａと非メ
ツキ対象部位との境界を明瞭とするためゴム、シ
リコンゴム、ネオプレン、テフロン等の可撓弾性
を有する弾性材にて長尺の一体物として成形され
るので、成形時の収縮による寸法誤差が避けられ
ず、支持板２に凹設した受部５内へ嵌合して接着
固定する際、マスク体６が伸びマスク開口８の開
口間隔P3がメツキ対象部位４ａの間隔P1や導通
孔間隔P2と寸法誤差により一致しなくなり、こ
の場合にはマスク装置１の製作が困難になるとい
う問題点があつた。 However, such a conventional mask device 1
In this case, the mask body 6 is made of rubber, silicone rubber, neoprene, Teflon, etc. in order to receive the metal plating object 4 without damaging it and to make the boundary between the plating target area 4a and the non-plating target area clear. Since it is molded as a long one-piece piece from an elastic material having flexural elasticity, dimensional errors due to shrinkage during molding are unavoidable, and it is fitted into the receiving part 5 recessed in the support plate 2 and fixed by adhesive. At this time, the mask body 6 expands and the opening interval P 3 of the mask openings 8 does not match the interval P 1 of the plating target area 4a or the interval P 2 of the conductive holes due to dimensional errors, and in this case, it becomes difficult to manufacture the mask device 1. There was a problem with that.
(ハ) 考案の目的
この考案は、このような従来の問題点に着目し
てなされたもので、製作が容易でマスク開口の間
隔に誤差の生じないマスク装置を提供することを
目的としている。(c) Purpose of the invention This invention was made by focusing on these conventional problems, and aims to provide a mask device that is easy to manufacture and does not cause errors in the spacing of mask openings.
(ニ) 考案の構成
この考案に係るマスク装置にあつては、上記の
目的を達成するため、マスク体を支持する支持板
の表面へ複数のメツキ対象部位に相応する間隔で
複数の受部を各々独立的に凹設し、各受部へマス
ク体を嵌合し、そして各受部の底面と各マスク体
の対応面に予め設けた凹凸部同士の係合を介し各
マスク体のマスク開口を上記複数のメツキ対象部
位と対応せしめたことを要旨としている。(d) Structure of the invention In order to achieve the above purpose, the mask device according to the invention includes a plurality of receiving parts on the surface of the support plate that supports the mask body at intervals corresponding to the plurality of parts to be plated. A mask opening is formed in each mask body through the engagement of the concave and convex portions provided in advance on the bottom surface of each receiving portion and the corresponding surface of each mask body. The gist is that the above corresponds to the plurality of plating target parts.
(ホ) 実施例
以下この考案を図面に基づいて説明する。第３
図〜第５図はこの考案の第１実施例を示す図であ
る。尚従来と共通する部分は同一符号を用いて示
し重複説明は省略する。(e) Examples This invention will be explained below based on the drawings. Third
Figures 5 to 5 are diagrams showing a first embodiment of this invention. It should be noted that parts common to the conventional one are indicated using the same reference numerals and redundant explanation will be omitted.
このマスク装置２０は支持板２１の表面に、複
数のメツキ対象部位４ａと相応する間隔P1で、
複数の受部２２が各々独立して凹設されている。
即ち、従来の一連のそして長尺の受部５に代え
て、メツキ対象部位４ａ毎にそれぞれ受部２２が
凹設されるものである。そして、この支持板２１
は熱変形の少ない材料、例えばガラスエポキシに
より形成され、各受部２２の底面２２ａの中央に
は、導通孔３が開孔されており、この開孔された
導通孔３の周囲を少しの距離を置いて囲むように
溝状の凹部２３が形成されている。 This mask device 20 has a plurality of plating target parts 4a on the surface of the support plate 21 at a distance P 1 corresponding to the plating target parts 4a.
A plurality of receiving portions 22 are each independently recessed.
That is, instead of the conventional series of long receiving parts 5, receiving parts 22 are recessed for each part 4a to be plated. And this support plate 21
are made of a material with little thermal deformation, such as glass epoxy, and a conduction hole 3 is formed in the center of the bottom surface 22a of each receiving portion 22. A groove-shaped recess 23 is formed so as to place and surround the groove.
マスク体２４は従来のマスク体６と異なり一連
の長尺のものではなく、これに代えて、メツキ対
象部位４ａ毎に対応せしめられるべく上記受部２
２のサイズに見合う図示の例では四角形状のもの
として各受部２２に対して一個当て形成され、そ
の裏面２４ａ即ち前記底面２２ａに対する「対応
面」に枠状の凸部２５が形成してある。マスク体
２４の中央には前記導通孔３に相応する形状、サ
イズのマスク開口２６が形成されている。 The mask body 24 is different from the conventional mask body 6 in that it is not a series of long pieces, but instead, the above-mentioned receiving portions 2 are arranged so as to correspond to each part 4a to be plated.
In the illustrated example corresponding to the size of No. 2, one piece is formed as a rectangular shape against each receiving portion 22, and a frame-shaped convex portion 25 is formed on the back surface 24a, that is, the "corresponding surface" to the bottom surface 22a. . A mask opening 26 having a shape and size corresponding to the conductive hole 3 is formed in the center of the mask body 24 .
尚、この支持板２１は熱変形の少ない合成樹脂
〔例えばガラスエポキシ〕により形成されている
が、これに限定されるものではない。 Although the support plate 21 is made of a synthetic resin (eg, glass epoxy) that is less susceptible to thermal deformation, it is not limited thereto.
次に作用を説明する。 Next, the action will be explained.
支持板２１の複数の受部２２にマスク体２４を
各々嵌合すると共に該受部２２の凹部２３とマス
ク体２４の凸部２５とを係合させ接着することな
く受部２２の各々にマスク体２４を個々に確実に
嵌合・固定する。 The mask body 24 is fitted into each of the plurality of receiving portions 22 of the support plate 21, and the concave portion 23 of the receiving portion 22 and the convex portion 25 of the mask body 24 are engaged, so that the mask is attached to each of the receiving portions 22 without bonding. The bodies 24 are individually and reliably fitted and fixed.
このようにして取付けられたマスク体２４上に
プレート状のメツキ物４が図中長手方向（矢印Ｂ
方向）に沿つて載置され、押圧手段９によつて押
圧・固定されると共にカソード化される。この
時、マスク体２４は押圧力により圧縮荷重が加え
られた状態となり、平面方向へ変形しようとする
が凹部２３と凸部２５の凹凸係合により変形が阻
止されるため、マスク開口２６も変形せず、その
平面形状、サイズ、シヤープな輪郭等は変化せず
非押圧時と同様に維持されることになる。またマ
スク体２４の取り外しは、個々のマスク体２４を
受部２２より抜き取るだけでよく、脱着は極めて
容易である。そしてこのマスク体２４はメツキ対
象部位４ａ当て一個毎に独立して形成されている
ため、異なる導通孔間隔P2が形成されている支
持板２１に対しても、受部２２の形状、サイズが
共通化されてありさえすれば、その受部２２内へ
一個当てマスク体２４を取付けるのみで導通孔間
隔P2の異なる新たなマスク装置２０とすること
ができるものである。 A plate-shaped plated material 4 is placed on the mask body 24 attached in this way in the longitudinal direction (arrow B) in the figure.
direction), is pressed and fixed by the pressing means 9, and is turned into a cathode. At this time, the mask body 24 is in a state where a compressive load is applied due to the pressing force and tries to deform in the plane direction, but the deformation is prevented by the engagement of the concave and convex portions between the concave portions 23 and convex portions 25, so the mask opening 26 also deforms. The planar shape, size, sharp outline, etc. will not change and will remain the same as when not pressed. Furthermore, the mask body 24 can be removed by simply pulling out each mask body 24 from the receiving portion 22, and is extremely easy to attach and detach. Since this mask body 24 is formed independently for each patch of the plating target area 4a, the shape and size of the receiving part 22 can be adjusted even for the support plate 21 in which different conductive hole intervals P2 are formed. As long as they are standardized, a new mask device 20 with a different conduction hole interval P 2 can be created by simply attaching one mask body 24 into the receiving portion 22.
第６図はこの考案の第２実施例を示す図であ
る。 FIG. 6 is a diagram showing a second embodiment of this invention.
このマスク装置３０は、ベースとなる支持板２
１に形成されている受部３１の底面３１ａに、枠
状の凸部３２が導通孔３の周囲に形成されてお
り、該受部３１に嵌合されるマスク体３３の対応
面３３ａには、底面３１ａの凸部３２相当位置
に、該凸部３２と係合させる凹部３４が凹設され
ている。 This mask device 30 has a support plate 2 serving as a base.
A frame-shaped convex portion 32 is formed around the conduction hole 3 on the bottom surface 31a of the receiving portion 31 formed in the receiving portion 31, and a corresponding surface 33a of the mask body 33 fitted to the receiving portion 31 has a convex portion 32 formed in the shape of a frame around the conductive hole 3. A recess 34 that engages with the protrusion 32 is provided at a position corresponding to the protrusion 32 on the bottom surface 31a.
この凸部３２及び凹部３４の存在により押圧力
によるマスク体３３の変形が吸収されマスク開口
２６の平面形状、サイズが非押圧時と同様に維持
されることになるのである。 The presence of the convex portions 32 and the concave portions 34 absorbs the deformation of the mask body 33 due to the pressing force, and the planar shape and size of the mask opening 26 are maintained as they were when no pressing force was applied.
尚、その他の構成・作用については第１実施例
と同様であるので、重複説明を省略する。 Note that other configurations and operations are the same as those in the first embodiment, so repeated explanations will be omitted.
(ヘ) 考案の効果
この考案に係るマスク装置は、以上説明してき
たような内容のものなので、上記マスク体は各受
部に対応して一個毎に形成され取付けられるた
め、支持板へ取付ける際に伸びによる寸法誤差が
生ぜず、又取付けた状態に於いて各マスク体のマ
スク開口の開口間隔に誤差が生ぜず、マスク装置
の加工・製作が容易となり、しかもマスク体の受
部への「取付け」は接着せず嵌合によるのみなの
で、取付け・取外しが簡単でマスク体の取替えが
容易となり、他の支持板への転用、他のマスク装
置の形成が短時間で為し得るものである。更に各
受部の底面と該底面に対応するマスク体の対応面
とに予め形成した凹凸部同士の係合を介してマス
ク体の変形ひいてはマスク開口の変形を防止でき
るため、メツキ物のメツキ対象部位に対し常に正
確なシヤープな輪郭をもつてメツキ対象部位と非
対象部位との境界を設けることができ、噴射メツ
キの性能をより向上させ得るという効果がある。(f) Effect of the invention The mask device according to this invention has the contents as explained above, and since the mask body is formed and attached one by one corresponding to each receiving part, there is no problem when attaching it to the support plate. There is no dimensional error due to elongation, and there is no error in the spacing between the mask openings of each mask body in the attached state, making it easy to process and manufacture the mask device. Since the "attachment" is done only by fitting without adhesion, it is easy to attach and detach, making it easy to replace the mask body, and making it possible to use it for other support plates and form other mask devices in a short time. . Furthermore, the deformation of the mask body and the deformation of the mask opening can be prevented through the engagement of the uneven parts formed in advance on the bottom surface of each receiving part and the corresponding surface of the mask body corresponding to the bottom surface, so that it is possible to prevent the deformation of the mask body and the mask opening. This has the effect that the boundary between the plating target part and the non-plating target part can always be provided with an accurate sharp contour, and the performance of spray plating can be further improved.
第１図は従来のマスク装置の一例を示す概略斜
視説明図、第２図は第１図中矢示−線に沿う
拡大断面図、第３図はこの考案に係るマスク装置
の第１実施例を示す概略斜視説明図、第４図は第
３図中矢示−線に沿う拡大断面図、第５図は
マスク体と支持板の組付説明図、そして第６図は
この考案に係るマスク装置の第２実施例を示す第
４図相当の拡大断面図である。
１，２０，３０……マスク装置、２，２１……
支持板、２ａ……表面側、４……メツキ物、４ａ
……メツキ対象部位、６……マスク体、８，２６
……マスク開口、２２，３１……受部、２２ａ，
３１ａ……底面、２３，３４……凹部、２４，３
３……マスク体、２５，３２……凸部。
Fig. 1 is a schematic perspective view showing an example of a conventional mask device, Fig. 2 is an enlarged sectional view taken along the arrow line in Fig. 1, and Fig. 3 shows a first embodiment of the mask device according to the invention. 4 is an enlarged sectional view taken along the arrow line in FIG. 3, FIG. 5 is an explanatory view of the assembly of the mask body and the support plate, and FIG. FIG. 4 is an enlarged sectional view corresponding to FIG. 4 showing a second embodiment. 1, 20, 30... mask device, 2, 21...
Support plate, 2a... surface side, 4... plating, 4a
...Metsuki target area, 6...Mask body, 8,26
...Mask opening, 22, 31... Receiving part, 22a,
31a... Bottom surface, 23, 34... Recessed portion, 24, 3
3...Mask body, 25, 32... Convex portion.
Claims (1)
ツキ物を弾性材製マスク体で受け止め、マスク体
に形成したマスク開口より露出するメツキ対象部
位へメツキ液を施す噴射メツキ用のマスク装置に
於いて、 上記マスク体を支持する支持板の表面へ複数の
メツキ対象部位に相応する間隔で複数の受部を
各々独立的に凹設し、 各受部へマスク体を嵌合し、そして 各受部の底面と各マスク体の対応面に予め設け
た凹凸部同士の係合を介し各マスク体のマスク開
口を上記複数のメツキ対象部位と対応せしめてな
る噴射メツキ用のマスク装置。[Scope of Claim for Utility Model Registration] For spray plating, in which a plate-shaped object to be plated having a plurality of parts to be plated is received by a mask body made of an elastic material, and a plating liquid is applied to the parts to be plated exposed through a mask opening formed in the mask body. In the mask device, a plurality of receiving parts are independently recessed into the surface of the support plate that supports the mask body at intervals corresponding to the plurality of plating target parts, and the mask body is fitted into each receiving part. and a spray plating mask in which the mask openings of each mask body are made to correspond to the plurality of plating target areas through the engagement of the concave and convex portions provided in advance on the bottom surface of each receiving portion and the corresponding surface of each mask body. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19717583U JPS60105658U (en) | 1983-12-23 | 1983-12-23 | Mask device for spray plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19717583U JPS60105658U (en) | 1983-12-23 | 1983-12-23 | Mask device for spray plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60105658U JPS60105658U (en) | 1985-07-18 |
| JPS638760Y2 true JPS638760Y2 (en) | 1988-03-16 |
Family
ID=30755279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19717583U Granted JPS60105658U (en) | 1983-12-23 | 1983-12-23 | Mask device for spray plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60105658U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4647085B2 (en) * | 2000-11-24 | 2011-03-09 | 株式会社三井ハイテック | Lead frame plating equipment |
-
1983
- 1983-12-23 JP JP19717583U patent/JPS60105658U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60105658U (en) | 1985-07-18 |
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