JPS6384956U - - Google Patents
Info
- Publication number
- JPS6384956U JPS6384956U JP17991686U JP17991686U JPS6384956U JP S6384956 U JPS6384956 U JP S6384956U JP 17991686 U JP17991686 U JP 17991686U JP 17991686 U JP17991686 U JP 17991686U JP S6384956 U JPS6384956 U JP S6384956U
- Authority
- JP
- Japan
- Prior art keywords
- encapsulating
- adhesive layer
- cap
- semiconductor device
- annular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 1
- 239000012945 sealing adhesive Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Description
第１図ａは、本考案の第一の実施例を示す平面
図、同図ｂは第１図ａを線Ａ―Ａに沿つて切断し
矢印の方向から見たときの断面図、第２図は、本
考案の第２の実施例を示す平面図である。
１……封止用絶縁部材、２……封止用接着剤層
、３……溝部、４……斜め溝部。
FIG. 1a is a plan view showing the first embodiment of the present invention, FIG. 1b is a cross-sectional view of FIG. The figure is a plan view showing a second embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Insulating member for sealing, 2... Adhesive layer for sealing, 3... Groove, 4... Diagonal groove.
Claims (1)
着剤層が環状に設けられた絶縁部材からなり、か
つ、前記環状の接着剤層の一箇所または数箇にお
いて環状を内外に横切る溝が形成されていること
を特徴とする半導体装置封止用キヤツプ。 (2) 該溝部が前記環状の接着剤層を斜めに横切
つて形成されていることを特徴とする実用新案登
録請求の範囲第１項記載の半導体装置封止用キヤ
ツプ。[Claims for Utility Model Registration] (1) An insulating member having an annular sealing adhesive layer provided on the surface to be bonded to the case to which it is to be adhered; 1. A cap for encapsulating a semiconductor device, characterized in that grooves are formed at several locations to cross the annular shape from inside to outside. (2) The cap for encapsulating a semiconductor device according to claim 1, wherein the groove is formed diagonally across the annular adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986179916U JP2564104Y2 (en) | 1986-11-21 | 1986-11-21 | Cap for semiconductor device sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986179916U JP2564104Y2 (en) | 1986-11-21 | 1986-11-21 | Cap for semiconductor device sealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6384956U true JPS6384956U (en) | 1988-06-03 |
| JP2564104Y2 JP2564104Y2 (en) | 1998-03-04 |
Family
ID=31123401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986179916U Expired - Lifetime JP2564104Y2 (en) | 1986-11-21 | 1986-11-21 | Cap for semiconductor device sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2564104Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019067833A (en) * | 2017-09-29 | 2019-04-25 | 日亜化学工業株式会社 | Light-emitting device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6365241U (en) * | 1986-10-17 | 1988-04-30 |
-
1986
- 1986-11-21 JP JP1986179916U patent/JP2564104Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6365241U (en) * | 1986-10-17 | 1988-04-30 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019067833A (en) * | 2017-09-29 | 2019-04-25 | 日亜化学工業株式会社 | Light-emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2564104Y2 (en) | 1998-03-04 |