JP2019067833A - Light-emitting device - Google Patents

Abstract

To provide a manufacturing method of a light emitting module in which the occurrence of voids in an adhesive is suppressed.SOLUTION: A manufacturing method of a light emitting module includes a step of preparing a substrate having a light emitting device disposed on the top surface, a step of arranging a linear adhesive continuous in a straight line or a curve and a point adhesive separated from the linear adhesive on an outer peripheral portion surrounding the light emitting device on the upper surface of the substrate, a step of placing a lens member on the linear adhesive and on the point adhesive, and a step of pressing the lens member, bringing the linear adhesive into contact with the point adhesive to form an integrated ring adhesive, and curing the ring adhesive by heating or ultraviolet light.SELECTED DRAWING: Figure 4A

Description

  The present disclosure relates to a method of manufacturing a light emitting module.

  A light emitting module provided with a light emitting device and a lens is known. The lens is fixed using an adhesive (for example, Patent Documents 1 and 2).

JP-A-2017-516314 JP 2012-38999 A

  During curing of the adhesive to fix the lens, voids may occur.

The present embodiment includes the following configuration.
A step of preparing a substrate having a light emitting device disposed on the upper surface, a linear adhesive continuous in a straight line or a curve, and a point adhesive separated from the linear adhesive on the outer peripheral portion surrounding the light emitting device on the upper surface of the substrate And disposing the lens member on the linear adhesive and the point adhesive, and pressing the lens member to bring the linear adhesive and the point adhesive into contact with each other. And curing the annular adhesive by heating or ultraviolet light.

  By the above, it can be set as the manufacturing method of the light emitting module which suppressed generation | occurrence | production of the void in an adhesive agent.

It is a schematic top view of the light emitting module which concerns on embodiment. It is a schematic perspective view of a light emitting module concerning an embodiment. It is a schematic end elevation in the IC-IC line of FIG. 1A. It is a schematic perspective view of the light-emitting device used for a light emitting module. It is a schematic sectional drawing in the IIB-IIB line of FIG. 2A. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a schematic end elevation in the IVC-IVC line of FIG. 4A. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment. It is a figure explaining the manufacturing method of the light emitting module concerning an embodiment.

  The mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below illustrates the manufacturing method of the light emitting module for embodying the technical thought of this invention, and this invention does not limit the manufacturing method of a light emitting module to the following.

  Further, the present specification does not in any way specify the members described in the claims to the members of the embodiment. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the present invention to the embodiments only, as long as there is no specific description. Note that the sizes and positional relationships of members shown in each drawing may be exaggerated for the sake of clarity. Further, in the following description, the same names and reference numerals indicate the same or the same members, and the detailed description will be appropriately omitted. In addition, an annular adhesive, a linear adhesive, and a point adhesive use the same name before hardening and after hardening. In addition, the “linear adhesive” refers to an adhesive having a length ratio of 2.0 or more in two directions (for example, the X direction and the Y direction) orthogonal to each other on a plane. For example, it refers to an adhesive having a length of 4.0 mm in the X direction and a length of 5.5 mm in the Y direction. In addition, “point adhesive” refers to an adhesive whose ratio of lengths is smaller than 2.0 in two directions (for example, X direction and Y direction) orthogonal to each other on a plane. For example, it refers to an adhesive having a length of 0.3 mm in the X direction and a length of 0.3 mm in the Y direction. A linear adhesive can be linear or curved.

1A to 1C show a light emitting module 100 obtained by the method of manufacturing a light emitting module according to the embodiment. The light emitting module 100 includes a light emitting device 10, a substrate 20, a lens member 30, and an annular adhesive 40 as main constituent members. The light emitting device 10 is disposed on the substrate 20, and the lens member 30 is disposed so as to cover the light emitting device 10. The lens member 30 is bonded to the substrate 20 by an annular adhesive 40. A space formed by the substrate 20, the lens member 30, and the annular adhesive 40 is a hermetically sealed space. By being disposed in such a hermetically sealed space, the light emitting device 10 is less susceptible to the influence of external air, moisture, dust and the like. With such a configuration, the light emitting module 100 with excellent reliability can be obtained.
The method of manufacturing the light emitting module 100 will be described in detail below.

(Step of preparing a substrate on which the light emitting device is disposed)
FIG. 2A and FIG. 2B are diagrams showing an example of the light emitting device 10. The light emitting device 10 is a member serving as a light source of the light emitting module 100, and the light emitting device 10 having a light emitting surface mainly on the upper surface is suitably used.

  The light emitting device 10 includes the light emitting element 11 and further includes the light transmitting member 13 and the covering member 12. The light emitting element 11 includes a laminated structure 11 a including a semiconductor layer including a light emitting layer, and an element electrode 11 b. The stacked structure body 11 a includes a light emitting surface, an electrode forming surface, and a side surface. The light transmitting member 13 is disposed on the light emitting surface side of the light emitting element 11. The light transmitting member 13 may include a phosphor that converts the light from the light emitting element 11 into light of different wavelengths. The covering member 12 is disposed to cover the side surface of the light emitting element 11 and reflects light from the light emitting element 11. The light emitting device 10 may further include a light guide member 14 between the light emitting element 11 and the light transmitting member 13. The light guide member 14 may be provided on the side surface of the light emitting element 11. The light guide member 14 is a member for guiding the light from the light emitting element 11 to the light transmitting member 13.

  FIG. 3A is an example showing the substrate 20 on which the light emitting device 10 is disposed. In the example shown here, the substrate 20 is flat and one light emitting device 10 is disposed substantially at the center of the upper surface 21 thereof. The substrate 20 includes an outer peripheral portion 22 in a region surrounding the light emitting device 10. In other words, the area of the upper surface 21 of the substrate 20 is larger than the area of the light emitting device 10, and the outer peripheral portion 22 is located between the end of the upper surface 21 of the substrate 20 and the light emitting device 10.

  The outer peripheral portion 22 is also a region in which an annular adhesive described later is disposed. In the example shown by FIG. 3A-FIG. 3C, the outer peripheral part 22 as an example of the area | region which arrange | positions annular adhesive agent is shown in figure. Here, the top view shape of the outer peripheral portion 22 is a square ring. The top view shape of the outer peripheral portion 22 is not limited to this, and may be an annular shape surrounding the light emitting device 10, and can be a shape suitable for the shape of the lens member to be mounted. The top view shape of the outer peripheral portion 22 may be, for example, an annular shape, a square ring shape, or an irregular shape other than the square ring shape.

  Besides being able to arrange one light emitting device 10 as shown in FIG. 3A on one substrate 20, a plurality of light emitting devices 10 can be arranged as shown in FIGS. 3B and 3C. When the plurality of light emitting devices 10 are arranged, the outer peripheral portion 22 is located in an area surrounding the plurality of light emitting devices 10. The number of light emitting devices 10 disposed on the substrate 20, the position to be disposed, and the like can be appropriately selected depending on the purpose, application, and the like.

  The light emitting device 10 is disposed on the upper surface 21 of the substrate 20, and the wiring of the substrate 20 and the electrodes 15 of the light emitting device 10 are electrically connected via a conductive bonding member such as solder. Thus, the light emitting device 10 is fixed to the substrate 20.

(Step of arranging linear adhesive and point adhesive)
FIG. 4A and FIG. 4B are diagrams showing a state in which the linear adhesive 50 and the point adhesive 60 are disposed on the outer peripheral portion 22 of the substrate 20. FIG. Here, an example in which the linear adhesive 50 and the point adhesive 60 are disposed on the square annular outer peripheral portion 22 as shown in FIG. 3A will be described.

  In the example shown in FIG. 4A, the linear adhesive 50 is disposed continuously over the four sides and three corners of the outer periphery. In other words, the linear adhesive 50 connects the four straight lines and is arranged in one continuous line having three bends. Two ends of one linear adhesive 50 are disposed near one corner of the perimeter of the square.

  The point adhesive 60 is disposed at one corner of the outer periphery of the square, and at least a portion of the point adhesive 60 is disposed in a region sandwiched by the linear adhesive 50. In the example shown in FIG. 4A, one point adhesive 60 is disposed between both ends of one linear adhesive 50. Specifically, one linear adhesive 50 and one point adhesive 60 are disposed on one substrate 20, and the linear adhesive 50 and the point adhesive 60 are two. It is disposed via the gap S. Therefore, in the curing step described later, there are two portions where the linear adhesive 50 and the point adhesive 60 are in contact, that is, the portions where the gap S is filled and the both are integrated. The smaller the number of gaps S, the smaller the amount by which the linear adhesive 50 and the point adhesive 60 are spread by pressing, which is preferable. All of the point adhesive 60 may be disposed in an area sandwiched by the linear adhesives 50, and a part thereof may be disposed in an area sandwiched by the linear adhesives 50.

  The height of the linear adhesive 50 can be slightly higher than the height of the point adhesive 60, as shown in FIG. 4B. Thus, the bonding strength between the substrate 20 and the lens member 30 can be improved. Moreover, the height of the linear adhesive 50 can be made lower than the height of the point adhesive 60 not only this. Thereby, it can suppress that the linear adhesive agent 50 or the dotted | punctate adhesive agent 60 overflows excessively. Alternatively, the height of the linear adhesive 50 can be the same height as the height of the point adhesive 60. Thereby, the linear adhesive 50 and the point adhesive 60 can be applied under the same conditions. When the heights of the linear adhesive 50 and the point adhesive 60 are changed, the higher one is preferably 50% or more of the lower one, and 70% or more. Is more preferred. Thereby, the gap S between the two can be easily filled.

  FIG. 4A shows an example in which the point adhesive 60 is disposed at one corner of the outer periphery of the square, thereby suppressing the generation of voids and improving the bonding strength between the substrate 20 and the lens member 30. It is possible to However, the position of the point adhesive 60 is not limited to this, and the point adhesive 60 may be disposed on the side of the outer periphery of the square as shown in FIG. 5. This makes it possible to widen the space between the linear adhesive and the point adhesive, and connect the adhesive while suppressing the occurrence of voids.

  In the example shown in FIG. 5, the linear adhesive 51 is disposed at four sides and four corners of the outer periphery of the square. However, on one side, two ends of the linear adhesive 51 are disposed, and the two ends are spaced apart with a gap S therebetween. By thus arranging the linear adhesive 51 at all the four corner portions of the outer periphery of the square, the generation of voids can be efficiently suppressed.

  Further, in the example shown in FIG. 4A, the outer edge 60A of the point adhesive 60 is disposed outside the outer edge 50A of the linear adhesive 50. By doing so, since the distance between the point adhesive 60 and the linear adhesive 50 can be set to, for example, about 0.3 mm, the generation of voids can be efficiently suppressed. Furthermore, in FIG. 4A, the inner edge 60A of the point adhesive 60 is disposed inside the outer edge 50A of the linear adhesive 50. That is, a part of the point adhesive 60 is disposed in the area sandwiched by the two ends of the linear adhesive 50.

  In the example shown in FIG. 5, the inner edge 60 </ b> B of the point adhesive 60 is located outside the outer edge 51 </ b> A of the linear adhesive 51. In other words, the point adhesive 60 is not located in the area sandwiched by the linear adhesive 51. For example, in the case where the linear adhesive does not connect unless the spacing between the linear adhesives 50 is made short and a void is generated at that position, the point adhesive plays a role by connecting in such a configuration Therefore, the adhesive can be connected while suppressing the generation of voids.

  Further, in the example shown in FIG. 6, the outer edge of the point adhesive 60 is located inside the inner edge 51 B of the linear adhesive 51. In other words, the point adhesive 60 is not located in the area sandwiched by the linear adhesive 51. For example, a plurality of lens members 30 can be bonded to one light emitting module 100. In such a case, by positioning the outer edge of the point adhesive 60 inside the inner edge 51 B of the linear adhesive 51, as shown in FIG. It can be arranged without. Thereby, the plurality of lens members 30 can be easily arranged in close proximity.

  In addition, as shown in FIG. 5 and FIG. 6, to arrange the point adhesive 60 so as not to be positioned in the region sandwiched by the linear adhesive 51, the point adhesive 60 is a side of the outer periphery of the square. The present invention can be applied not only to the case of being disposed on the side, but also in the case of the point adhesive 60 being disposed on the corner as shown in FIG.

  7 to 9 show variations of the arrangement of the linear adhesive and the point adhesive. FIG. 7 shows an example in which two linear adhesives 52 and two point adhesives 60 are disposed on the outer periphery of a square. The linear adhesives 52 are respectively disposed at adjacent two sides and one corner, and are L-shaped in top view. The point adhesive 60 is disposed at two diagonally opposite corners, and is disposed in a region sandwiched by two linear adhesives 52, respectively. As described above, the two linear adhesives 52 and the two point adhesives 60 are respectively disposed via the gaps S, thereby providing four gaps S in one outer peripheral portion. Become. By increasing the number of the gaps S, the bonding strength between the substrate 20 and the lens member 30 can be improved in addition to suppressing the generation of the void. Further, in the example shown in FIG. 7, two gaps S are formed in the vicinity of two opposing corner portions in the outer peripheral portion of the quadrangle. In this manner, the gap S is disposed at each of the two corner portions with the light emitting device 10 as the center, thereby pressing the lens member to bring the linear adhesive 52 and the point adhesive 60 into contact with each other. It is easy to apply pressure uniformly. Therefore, in addition to efficiently suppressing the generation of the void, the lens member can be hardly inclined.

  FIG. 8 shows an example in which four linear adhesives 53 and four point adhesives 60 are disposed on the outer periphery of the square of the upper surface of the substrate 20. The point adhesive 60 is disposed at each of the four corners. The linear adhesive 53 is disposed on each of the four sides, and the top view shape is linear. With such an arrangement, the gap S is arranged in the vicinity of all four corners of the outer periphery of the quadrangle. Therefore, in addition to suppressing generation | occurrence | production of a void efficiently, a lens member can be made hard to incline.

  FIG. 9 comprises four linear adhesives 54 and four point adhesives 60 as shown in FIG. The linear adhesive 54 is formed by connecting a plurality of dot diameters (for example, the diameter of the dot 541 is 0.5 mm) in a row. By forming such a plurality of dots 541 as a linear adhesive 54 which is a continuous body, the generation of voids can be further suppressed.

  As shown in FIGS. 10A and 10B, the linear adhesive 50 to 54 and the point adhesive 60 exemplified above are applied to the outer peripheral portion of the adhesive member before curing using the dispense nozzle 70. It can be formed. Either of the linear adhesives 50 to 54 and the point adhesive 60 may be formed first. In addition, at the time of applying the adhesive member before curing, the substrate 20 may be fixed and the dispensing nozzle 70 may be moved, or the dispensing nozzle 70 may be fixed and the substrate 20 may be moved. The linear adhesive 50 to 54 and the point adhesive 60 may use the dispense nozzle 70 having the same discharge diameter, or may use the dispense nozzle 70 having a different discharge diameter. Also, the adhesive member before curing may be print-coated or spray-coated, for example, using a mask having a predetermined opening without using the dispense nozzle 70.

(Step of mounting the lens member)
Next, as shown in FIG. 11A, the lens member 30 is held by the lens holder 80, and as shown in FIG. 11B, the lens member 30 is placed on both the linear adhesive 50 and the point adhesive 60. Do. Specifically, the leg 33 of the lens member 30 is placed such that it is disposed on both the linear adhesive 50 and the point adhesive 60. Here, since the point adhesive 60 is about 0.1 mm higher than the linear adhesive 50, the lens member 30 is in contact with the point adhesive 60 first.

  (Step of curing the cyclic adhesive)

  By pressing the lens member 30 downward using the lens holder 80, the linear adhesive 50 and the point adhesive 60 are deformed so as to spread laterally. As a result, the linear adhesive 50 and the point adhesive 60 are brought into contact with each other and integrated to form an annular adhesive 40 as shown in FIG. In FIG. 12, the lens member 30 is omitted.

  The annular adhesive 40 cured by heating or irradiation with ultraviolet light is wider than the linear adhesive 50 and the point adhesive 60. Further, the gap S existing before pressing by the lens member 30 disappears by being filled with the deformed linear adhesive 50 and the point adhesive 60. Then, an airtight space surrounded by the upper surface of the substrate 20 and the lens member 30 and the annular adhesive 40 is formed.

  The linear adhesive and the point adhesive formed in FIGS. 5 to 9 become annular adhesives as shown in FIGS. 12 to 17, respectively.

  As described above, when integrating the linear adhesive 50 and the point adhesive 60, which are formed separately in advance, while pressing the point adhesive 60 with the lens member 30 to form the annular adhesive 40, the space of the lens member 30 By releasing the gas of the part from the gap S, generation of a void in the annular adhesive 40 can be suppressed. With a combination of a point adhesive and a point adhesive, or a combination of a linear adhesive and a linear adhesive, the gap S can not be expanded sufficiently, so that an annular adhesive can be formed without generating a void after pressing. Is difficult.

  By the steps described above, it is possible to make the light emitting module 100 in which the light emitting device 10 is hermetically sealed as shown in FIGS. 1A to 1C.

  Hereinafter, each component of the light emitting module will be described.

(Light-emitting device)
The light emitting device 10 which is a light source of the light emitting module 100 is not limited to the shape shown in FIG. 2A or the like, and a known light emitting device can be used. In addition, with respect to luminescent colors, light-emitting devices of white, blue, green, red, and various luminescent colors combining these can be used.

(substrate)
The substrate is a plate-like member provided with wiring and the like, and has an upper surface on which the light emitting device and the lens member can be mounted. The substrate includes, for example, a base material such as ceramic, glass epoxy, or resin, and a wiring such as copper, iron, aluminum, or the like formed on the upper surface of the base material.

(Point-like adhesive, linear adhesive, annular adhesive)
The point adhesive and the linear adhesive are members for bonding the substrate and the lens member, and are integrated at the time of bonding to form an annular adhesive. As a point adhesive agent and a linear adhesive agent, resin materials, such as a thermosetting resin, a thermoplastic resin, and an ultraviolet curable resin, can be used, for example. Specifically, for example, silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, etc. can be used. Titanium oxide, silica, alumina, zirconia, zinc oxide, etc. can be added to these resin materials. The point adhesive and the linear adhesive may use the same material or different materials. The annular adhesive is formed with a width wider than the width of the leg of the lens member, as shown in FIG. 1C.

(Lens member)
The lens member is a member for controlling light distribution and the like of light emitted from the light emitting device, and is joined onto the substrate via an annular adhesive. The lens member includes a lens portion and a lens holding portion disposed around the lens portion. The lens holding portion includes a leg that protrudes to the lower surface side. The bottom of the leg of the lens member is a portion to be bonded onto the substrate.

  The lens portion of the lens member is a portion provided with various lens functions such as a convex lens, a concave lens, a Fresnel lens and the like, and can be appropriately selected according to the size, the arrangement, the desired light distribution characteristic and the like of the light emitting device. In the example shown to FIG. 1A-FIG. 1C, the lens part of a lens member is a Fresnel lens. It is preferable that the lens unit be disposed such that the optical axis of the lens unit coincides with the optical axis of the light emitting device.

  The leg portions of the lens member are disposed around the lens portion, and are disposed at such a height and size that the light emitting device can be disposed in an area surrounded by the leg portions.

  The light emitting module according to the embodiment of the present invention can be used for various lighting fixtures, light sources for various indicators, light sources for vehicles, light sources for displays, light sources for backlight of liquid crystals, light sources for sensors, light sources for sensors, etc. it can.

100 ... light emitting module 10 ... light emitting device 11 ... light emitting element (11 a ... laminated structure, 11 b ... element electrode)
12 coating member 13 light transmitting member 14 light guide member 15 electrode 20 substrate 21 upper surface of substrate 22 outer peripheral portion 30 lens member 31 lens portion 32 lens holding portion 33 leg portion 40 annular bonding Agents 50, 51, 52, 53: linear adhesive 50A, 51A, 52A: outer edge of linear adhesive 50B, 52B: inner edge 541: dot 60: point adhesive 60A: outer edge of point adhesive 60B: point Adhesive inner edge S ... gap 70 ... dispense nozzle 80 ... lens holder

Claims (7)

Preparing a substrate having a light emitting device disposed on the top surface;
Arranging a linear adhesive continuous in a straight line or a curve and a point adhesive separated from the linear adhesive on an outer peripheral portion surrounding the light emitting device on the upper surface of the substrate;
Placing a lens member on the linear adhesive and on the point adhesive;
A step of pressing the lens member to form an annular adhesive in which the linear adhesive and the point adhesive are brought into contact and integrated, and curing the annular adhesive by heating or ultraviolet light;
Method of manufacturing a light emitting module comprising:   The method according to claim 1, wherein the outer edge of the point adhesive is disposed outside the outer edge of the linear adhesive.   The method for manufacturing a light emitting module according to claim 1 or 2, wherein at least a part of the point adhesive is disposed in a region sandwiched by the linear adhesive.   The method for manufacturing a light emitting module according to claim 1, wherein an inner edge of the point adhesive is disposed outside an area sandwiched by the linear adhesive.   The method for manufacturing a light emitting module according to any one of claims 1 to 4, wherein the point adhesive and the linear adhesive have the same height.   The method for manufacturing a light emitting module according to any one of claims 1 to 4, wherein the point adhesive and the linear adhesive have different heights.   The method for manufacturing a light emitting module according to claim 6, wherein the height of the dot adhesive and the linear adhesive is 50% or more of the height of the lower one.

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