JP2013219223A - Vacuum package, sensor, and manufacturing method of vacuum package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum package which has a sealing body securely held on a through hole provided at the vacuum package and seals the through hole without causing sealing defects, and to provide a sensor and a manufacturing method of the vacuum package.SOLUTION: A vacuum package 1 has a decompressive-sealed cavity part and includes: a through hole 4 for exhausting the cavity part; and a sealing body sealing the through hole 4. The sealing body has a stepped shape composed of a base material part 6, having a sealing surface larger than the through hole 4, and a protruding part 7 that is provided on the sealing surface and is smaller than the through hole 4. The sealing body seals the through hole 4 in the state that a sealing material 8 is sandwiched between the sealing surface and a surface of the vacuum package 1 and the protruding part 7 is inserted into the through hole 4.

Description

  The present invention relates to a package in which functional elements are vacuum-sealed and a manufacturing method thereof.

  In order to improve the performance of functional devices such as an infrared sensor, a pressure sensor, and an acceleration sensor, it is desirable that they are housed in a vacuum sealed container to function.

  Taking an infrared sensor as an example, in a thermal infrared sensor, a light receiving portion of a detection element absorbs infrared light transmitted through an infrared transmission window, and detects a resistance change caused by a temperature change as a signal. For this reason, it is important to reduce the release of heat through the air in order to keep the sensor highly sensitive. An infrared sensor used in a night security camera or a thermography for indexing and displaying a temperature distribution employs a configuration in which a light receiving portion is thermally insulated in order to detect a signal with high sensitivity. Such thermal insulation can be obtained by floating the light-receiving part in the air or placing the infrared detection element itself in the vacuum package.

  As a method of sealing a vacuum package such as an infrared sensor, for example, in Patent Document 1, a through hole for exhaust is provided in an infrared transmitting window, a sealing material is placed in an opening of the through hole, and the inside of the package is There is a method of sealing a through-hole by heating and melting a sealing material after evacuation.

  In the vacuum package described in Patent Document 2, the through hole is tapered so that the sealing material is fixed to the through hole. The through hole has a first tapered surface that reduces the opening area of the through hole from the outer surface side to the inner surface side of the chamber, and a second tapered surface that reduces the opening area of the through hole from the inner surface side to the outer surface side of the chamber. The sealing material is disposed on the first tapered surface, and the through hole is sealed while heating and decompressing.

Japanese Patent Laid-Open No. 11-326037 JP 2009-135296 A

  In the sealing method described in Patent Document 1, a sealing material pad that is a metal coating is formed around the opening of the through hole, and a sealing material such as a solder ball is disposed in the through hole to perform pressure reduction and heating. Therefore, there is a problem in that the sealing material moves and is removed from the opening of the through hole when the internal gas is exhausted, and the sealing material is not held on the through hole. In addition, when the sealing material is heated and melted, there is a problem that the sealing material flows so as to avoid the opening, or falls through the through hole, so that the through hole cannot be completely sealed. Prone to occur.

  In the sealing technique described in Patent Document 2, it is necessary to perform taper processing from both the front and back surfaces of the opening surface of the through hole. In order to realize this taper processing, it is necessary to perform 180 ° inversion after processing one side with a machine, and to perform the same processing, which increases the processing time. In particular, materials such as silicon and germanium, which are often used for infrared transmission windows, light receiving element substrates, spacers, and the like, are very fragile materials. If a tapered through hole is formed in such a material, sealing due to cracks is caused. There is a tendency for problems to occur.

  An object of the present invention is to provide a vacuum package and a method for manufacturing the same, which are made to solve such a problem and realize a reduction in the processing time of a through hole without causing a sealing failure. .

  In order to solve the above problems, a vacuum package of the present invention has a through-hole for exhausting a cavity and a sealing body for sealing the through-hole, and the sealing body covers a top surface of the through-hole. It is a stepped shape consisting of a material part and a protrusion smaller than the through hole provided in the base part, and the protrusion is inserted into the through hole with a sealing material sandwiched between the base part and the vacuum package surface The through hole is sealed in the state.

  Moreover, the sealing body of the present invention has a stepped shape including a base material portion that covers the upper surface of the through hole and a projection portion that is smaller than the through hole provided in the base material portion, and the protrusion portion of the base material portion is provided. A sealing material is disposed on the surface.

  The sensor of the present invention includes an element for detecting electromagnetic waves, a main board on which the elements are mounted, a transmission board that faces the main board and transmits electromagnetic waves, and the main board and an edge of the transmission board. A through hole for exhausting the cavity surrounded by the main substrate, the transmissive substrate, and the spacer, and a seal that seals the through hole. The sealing body has a stepped shape including a base material portion covering the top surface of the through hole and a projection smaller than the through hole provided in the base material portion. The through hole is sealed in a state where the projecting portion is inserted into the through hole with a sealing material interposed therebetween.

  In addition, the manufacturing method of the vacuum package according to the present invention includes a stepped portion including a base portion covering the upper surface of the through hole and a protrusion smaller than the through hole provided in the base portion, in the through hole for exhausting the cavity portion. Inserting the projecting part into the through hole with the sealing material sandwiched between the base material part and the surface of the vacuum package and installing the projecting part, and sealing the through hole in the vacuum chamber The process of setting the package on which the body is installed, the process of depressurizing the inside of the vacuum chamber, the process of exhausting the cavity and the vacuum package are heated, the sealing material is dissolved, and the space between the base part and the surface of the vacuum package A step of sealing, and a step of cooling the vacuum package and solidifying the sealing material to seal the through hole.

  According to the present invention, the protrusion provided on the seal structure is inserted into the through-hole so that the seal structure does not move when the inside of the vacuum package is exhausted or when the sealing material is melted. Therefore, it is possible to prevent the occurrence of sealing failure.

  Further, the through hole may be a simple hole opened in the vertical direction, and the processing time can be shortened.

The schematic sectional drawing of the vacuum package using the seal structure concerning a 1st embodiment is shown. The schematic sectional drawing in the temporary sealing state under the pressure reduction conditions of the vacuum package which concerns on 2nd Embodiment is shown. The side view, bottom view, and perspective view of the sealing structure which seals the through-hole which concerns on 2nd Embodiment are shown. The schematic sectional drawing of the infrared sensor which concerns on 2nd Embodiment is shown. The schematic sectional drawing in the temporary sealing state under the pressure reduction conditions of the vacuum package which concerns on 3rd Embodiment is shown. The side view, bottom view, and perspective view of the seal structure body of 3rd Embodiment are shown. The schematic sectional drawing in the temporary sealing state under the pressure reduction conditions of the vacuum package which concerns on 4th Embodiment is shown. The side view, bottom view, and perspective view of the seal structure body of 4th Embodiment are shown. The schematic sectional drawing in the temporary sealing state under pressure reduction conditions of the vacuum package concerning a 5th embodiment is shown. The side view, bottom view, and perspective view of the seal structure body of 5th Embodiment are shown. The schematic sectional drawing in the temporary sealing state under the pressure reduction conditions of the vacuum package concerning 6th Embodiment is shown. The side view, bottom view, and perspective view of the seal structure body of 6th Embodiment are shown. The schematic sectional drawing in the temporary sealing state under the pressure reduction conditions of the vacuum package concerning 6th Embodiment is shown.

  Hereinafter, the vacuum package according to the first embodiment of the present invention will be described. FIG. 1 is a schematic sectional view of a vacuum package according to the first embodiment of the present invention.

  The vacuum package 1 includes a substrate 2 serving as a bottom surface and a sealing cover 3 that covers the substrate in a state where a space is secured above the substrate 2. The sealing cover is provided with a through-hole 4 that serves as an exhaust outlet when evacuating. In the vacuum package 1, the substrate 2 and the sealing cover 3 are placed in a vacuum, the gas in the sealing cover 3 is exhausted from the through hole 4, and then the through hole 4 is sealed with the seal structure 5. The package is airtight. The seal structure 5 seals the upper surface and inner diameter of the opening of the through hole 4. The seal structure 5 has a configuration in which a sealing member is disposed in a stepped integrated structure including a base material portion 6 that covers the upper surface of the through-hole 4 and a projection 7 that closes the inner diameter of the through-hole 6. In the seal structure 5, the protruding portion 7 is inserted into the through hole 4 in a state where the sealing material 8 is sandwiched between the base material portion 6 and the sealing cover 3. The sealing material 8 is disposed on the surface of the base member 6 on the side having the protrusions 7. The sealing material 8 has a property of melting by heating and solidifying by cooling.

  A vacuum package sealing method will be described below. First, the protrusion 7 of the seal structure 5 is inserted into the through hole of the sealing cover, and the through hole 4 is temporarily sealed with the seal structure 5.

  Next, the vacuum package 1 temporarily sealed with the seal structure 5 is set in a vacuum chamber, and the inside of the vacuum chamber is decompressed. After the pressure inside the vacuum package is reduced, this state is maintained and the vacuum package 1 is heated at a temperature equal to or higher than the melting point of the sealing material 8. The vacuum package 1 is cooled with the sealing material 8 melted and sealed with the sealing material 8 in which the gap between the base material portion 6 and the sealing cover 3 is dissolved. The sealing material 8 is solidified, and the seal structure 5 seals the vacuum package 1 in a reduced pressure state.

  As described above, by inserting the protruding portion of the stepped seal structure into the through hole, the seal structure can be stably fixed to the opening of the through hole even when the vacuum package is decompressed and heated. Subsequently, the vacuum package can be sealed.

  Hereinafter, a vacuum package according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 2 is a schematic cross-sectional view of the vacuum package according to the second embodiment in a temporarily sealed state under reduced pressure conditions.

  The vacuum package 21 includes a substrate 22 serving as a bottom surface and a sealing cover 23 that covers the substrate 22 in a state where a gap is secured above the substrate 22. The substrate 22 and the sealing cover 23 are bonded with bonding solder or the like. The sealing cover 23 is provided with a through-hole 24 that serves as an exhaust outlet when evacuating. The through hole 24 is formed in the sealing cover 23 using a drill or the like.

  The vacuum package 21 is obtained by placing the substrate 22 and the sealing cover 23 in a vacuum, exhausting the gas in the sealing cover 23 from the through hole 24, and then sealing the through hole 24 with the seal structure 25. The inside is evacuated. The seal structure 25 seals the upper surface and the inner diameter of the through hole 4.

  The seal structure 25 has a configuration in which a sealing member 28 is disposed in a stepped integrated structure including a base material portion 26 that covers the upper surface of the through hole 24 and a projection 27 that closes the inner diameter of the through hole 24. The sealing material 28 is joined to the surface of the base material portion 26 on the side where the protrusions 27 are connected so as to surround the periphery of the protrusions 27.

  In the sealing structure 25, the protruding portion 27 is inserted into the through hole 24 in a state where the sealing material 28 is sandwiched between the base material portion 26 and the sealing cover 23. FIG. 3 shows a side view, a bottom view, and a perspective view of a seal structure 25 that seals the through hole 24 according to the second embodiment.

  The base material part 26 and the protrusion part 27 are both cylindrical, and the protrusion part 27 is connected to the base part 26 in the vertical direction at the center of the circle on the bottom surface of the base material part 26. The diameter of the bottom surface of the base material portion 26 is larger than that of the through hole 24, and the diameter of the bottom surface of the projection portion 27 is smaller than that of the through hole 24. A gap between the protrusion 27 and the sealing cover 23 at the time of insertion becomes a gap when the inside of the package is exhausted at the time of decompression. However, the sealing material 28 that has been heated and melted is spaced by a surface tension so that it enters the gap but does not fall into the package. The base material part 26 and the protrusion part 27 are manufactured by casting or press molding as an integrated shape. In addition, it may be manufactured by machining a cylindrical material using a machine tool such as a lathe.

  The planar shape of the base material portion 26 and the projection portion 27 is circular if the projection portion 27 can be inserted into the opening portion of the through hole 24 and the upper side of the opening portion of the through hole 24 can be covered with the base material portion 26. Without limitation, various shapes can be adopted. For example, a square, an ellipse, a cross, a parallelogram, a triangle, a polygon, a rectangle, a flower, or the like may be applied. The height of the protrusion 27 in the vertical direction is long enough to penetrate the through hole 24 and prevent the tip of the protrusion 27 from reaching the substrate 22.

  The sealing material 28 has a hole in the center and has a C-shaped shape with a part missing. Note that the cutout portion may be not only a part but also a plurality. The notch is used as a vent for evacuation.

  The sealing material 28 is disposed on the surface of the base material portion 26 on the side having the protrusions 27. The sealing material 28 is solder, and after forming by printing, it is once melted and solidified to produce a C-shaped shape. In addition to manufacturing by melting and solidifying, a sealing member may be manufactured by pressing and punching a flat solder plate with a die. The sealing material 28 may be made of a material other than solder as long as it has a property of melting by heating and solidifying by cooling.

  A method for sealing the vacuum package 21 will be described below.

  First, the protrusion 27 of the seal structure 25 is inserted into the through hole 24 of the sealing cover 23, and the through hole 24 is temporarily sealed with the seal structure 25.

  Next, the package temporarily sealed with the seal structure 25 is set on the stage of the vacuum chamber.

The inside of the vacuum chamber is depressurized to 1 × 10 ⁻⁶ Pa. In order to maintain the stability of the device for a long time, the degree of vacuum is further increased. Here, the cutout portion 29 of the sealing material 28 serves as a vent for the sealing material 28, and the gas inside the package is exhausted to the outside through the gap between the protrusion 27 and the sealing cover 23 and the cutout portion 29. .

After the inside of the package ^reaches the same pressure as 1 × 10 ⁻⁶ Pa, this state is maintained and the inside of the package or the package itself is heated at 160 ° C. At this time, the sealing material 28 having a melting point of 140 ° C. is melted.

  The gap that is the cutout portion of the sealing material 28 disappears when the sealing material 28 melts. The seal structure 25 has a stepped shape with a base portion 26 larger than the through hole 24 and a projection 27 smaller than the through hole 24, and the projection 27 of the seal structure 25 is inserted into the through hole 24. The seal structure 25 does not move even when the inside is exhausted or when the sealing material 28 is melted. For this reason, the seal structure 25 can be reliably fixed on the opening of the through hole 24.

  After the gap disappears, the inside of the vacuum package 21 or the vacuum package 21 itself is cooled. When the sealing material 28 reaches the melting point or lower, the sealing material 28 is solidified, and the base material portion 26 and the sealing cover 23 are fixed together with the sealing material 28 without any gap. The seal structure 25 seals the vacuum package 21 in a vacuum state.

  In the case where high vacuum is not required, the notched portion of the sealing material 28 may be omitted. In this case, the seal structure 25 is lifted by the air flow while the vacuum package 21 is exhausted. However, since the protrusion 27 is inserted into the through hole 24 even when the seal structure 25 is lifted, the seal structure 25 is not detached from the through hole 24, and the seal structure 5 is placed on the opening of the through hole 24. Can be fixed.

  As described above, the protrusion 27 of the stepped seal structure 25 is inserted into the through hole 24 of the sealing cover 23, so that the seal structure 25 is stable even if the pressure is reduced and heated in the vacuum chamber. Thus, the vacuum package 21 can be hermetically sealed while being fixed to the opening of the through hole 24.

  The vacuum package 1 of the second embodiment will be described by taking an infrared sensor in which an infrared light receiving element is vacuum-sealed as a functional element as an example. FIG. 4 is a schematic cross-sectional view of an infrared sensor according to the second embodiment of the present invention.

  An infrared sensor 10, an infrared light receiving element 11 for detecting infrared light, a substrate 12 on which the infrared light receiving element 11 is mounted, an infrared transmission window 13 that transmits infrared light so that the infrared light receiving element 11 can receive light, and the infrared light receiving element 11 are accommodated. And a chamber 14 to be provided.

The chamber 14 is formed on the infrared light receiving element 11 by covering the infrared light receiving element 11 with the substrate 12, the spacer 15, the bonding solder 16, the electrode pad 17, the infrared transmitting window 13, and the like. The inside of the chamber is depressurized from the atmospheric pressure (preferably up to 1 × 10 ⁻⁶ Pa) and is in an airtight state. An electrode pad 17 is disposed on the substrate 12. The infrared light receiving element 11 is electrically connected to the electrode pad 17. The electrode pad 17 has a shape that is drawn out of the chamber. Thereby, the signal detected by the infrared light receiving element 11 can be transmitted to the outside of the chamber via the bonding wire 18 and the electrode pad 17.

  A spacer 15 is bonded onto the electrode pad 17. The spacer 15 surrounds the infrared light receiving element 11 and secures a predetermined gap between the substrate 12 and the infrared transmission window 13. Further, an infrared transmission window 103 is bonded onto the spacer 15 by an adhesive solder 16. The infrared transmission window 13 covers the infrared light receiving element 11.

  The infrared transmitting window 13 has at least one through hole 19 used for exhausting the chamber 14. The through hole 19 is a through hole opened by a machine tool perpendicular to the infrared transmission window 13. The seal structure 100 seals the opening of the through hole 19 of the infrared transmission window 13 and the upper side of the opening.

  As in the second embodiment, the seal structure 100 is formed by forming a sealing member on a stepped integrated structure including a base portion 101 that covers the upper surface of the through hole 19 and a protrusion 102 that closes the inner diameter of the through hole 19. The arrangement is arranged. The base material 111 and the protrusion 112 are made of a metal having a melting point higher than that of the sealing material 103 and the bonding solder 16 or a material having similar hardness. As the material of the sealing material 113, solder having a melting point lower than that of the bonding solder 16 is used. Specifically, the bonding solder 16 is Kyosho solder having a melting point of 183 ° C., and the sealing material 113 is solder having a melting point of 140 ° C. to which bismuth is added. The reason why solder having a melting point lower than that of the bonding solder 16 is used as the sealing material 103 is to prevent the bonding solder used for bonding the infrared transmission window and the spacer from being re-melted by heating when vacuum-sealing. Because. Other configurations and the sealing method are the same as those in the second embodiment, and thus the description thereof is omitted.

  As described above, by inserting the protruding portion of the stepped seal structure into the through-hole, the seal structure is stably fixed to the opening of the through-hole even if the pressure is reduced and heated in the vacuum chamber. As a result, the infrared sensor can be hermetically sealed. In addition, a high vacuum infrared sensor can be manufactured by providing a cutout serving as a vent for exhaust in the sealing material.

  Next, the vacuum package 1 according to the third to seventh embodiments of the present invention will be described. Since other configurations other than the periphery of the seal structure 5 and the through hole 4 in the third to seventh embodiments are the same as those in the second embodiment, the description thereof is omitted.

A third embodiment in which the present invention is preferably implemented will be described. FIG. 5 shows a schematic cross-sectional view of the vacuum package 1 according to the third embodiment in a temporarily sealed state under a reduced pressure condition.
In the third embodiment, grooves are formed in the sealing material.

  The sealing material 38 has an O-shaped shape with a cylindrical hole at the center, and has a groove 39 penetrating from the outer edge to the inner edge. FIG. 6 shows a side view, a bottom view, and a perspective view of the seal structure 35 of the third embodiment.

  In the second embodiment, the gap in the cutout portion of the sealing material is used as a vent for exhausting air. In the third embodiment, the gap in the groove 39 of the sealing material 38 is used as a vent for exhausting air. To do.

  When the protruding portion 37 of the sealing structure 35 is inserted into the through hole 34, the surface other than the groove 39 of the sealing material 38 contacts the upper surface of the sealing cover 33, but the groove 39 of the sealing material 38 becomes a gap. . Vacuuming is performed through the gap between the protrusion 37 and the sealing cover 33 and the gap 39 in the groove 39 of the sealing material 38.

  Note that various shapes can be adopted as the shape, size, number, and the like of the grooves as long as an air gap that can be evacuated is secured. The sealing material 38 having the grooves 39 is manufactured by punching a flat solder plate with a die press. Since other configurations are the same as those of the second embodiment, description thereof is omitted.

  A fourth embodiment in which the present invention is preferably implemented will be described. FIG. 7 shows a schematic cross-sectional view of the vacuum package 41 according to the fourth embodiment in a temporarily sealed state under reduced pressure conditions. In the fourth embodiment, the surface of the sealing material 48 on the protrusion 47 side has an uneven shape.

  In the second embodiment, the gap in the cutout portion of the sealing material is used as a vent for exhausting air. However, in the fourth embodiment, the gap corresponding to the concave portion without the sealing material whose surface is uneven is provided. Use as a vent to exhaust. An example is a sealing material having a corrugated surface. FIG. 8 shows a side view, a bottom view, and a perspective view of the seal structure 45 of the fourth embodiment.

  When the sealing structure 45 is inserted into the through hole 44, the wave shape apex of the sealing material 48 contacts the upper surface of the sealing cover 43, and a gap is provided between the sealing material 48 and the sealing cover 43. . The gas in the chamber is exhausted through the gap between the protrusion 47 and the sealing cover 43 and the gap corresponding to the recess without the sealing material 48. In addition, if the space | gap which can evacuate is ensured in the surface where the sealing cover 43 and the sealing material 48 contact | abut, the waveform of the surface by the side of the protrusion 47 of the sealing material 48 will have amplitude, a wavelength, a number, etc. Various shapes can be employed. Further, even if it is not particularly corrugated, the surface on which the sealing cover 43 and the sealing material 48 come into contact has irregularities, and various shapes of the surface can be adopted as long as a space that can be evacuated is secured. Since other configurations are the same as those of the second embodiment, description thereof is omitted.

  A fifth embodiment in which the present invention is preferably implemented will be described. FIG. 9 shows a schematic cross-sectional view of the vacuum package 51 according to the fifth embodiment in a temporarily sealed state under a reduced pressure condition. In the fifth embodiment, the sealing material is composed of several solder balls.

  The base material portion 56 has a hole enough for a solder ball hemisphere to enter. The solder ball 58 is fixed to the hemispherical groove of the base material portion 56 and does not fall off. FIG. 10 shows a side view, a bottom view and a perspective view of the seal structure 55 of the fifth embodiment. When the protruding portion 57 is inserted into the through hole 54 of the sealing cover 53, the apex of the solder ball contacts the upper surface of the sealing cover 53, and a gap is provided in a portion without the solder ball. The gas in the chamber is exhausted through the gap between the protrusion 57 and the sealing cover 53 and the gap in the portion without the solder ball.

In addition, in order to make the base material part 56 and the sealing cover 53 oppose substantially parallel with a space | interval, it is preferable to arrange | position three or more solder balls at equal intervals. However, as long as an air gap that can be evacuated is secured on the surface where the sealing cover 53 and the sealing material 58 abut, various numbers and sizes and shapes of solder balls can be employed.
Since other configurations are the same as those in the first embodiment, description thereof is omitted.

  A sixth embodiment in which the present invention is preferably implemented will be described. FIG. 11 is a schematic cross-sectional view of the vacuum package 61 according to the sixth embodiment in a temporarily sealed state under a reduced pressure condition.

  In the sixth embodiment, a groove 69 penetrating from the outer edge to the inner edge is provided on the lower surface of the base material portion 66. The sealing material 68 is joined to the surface of the base member 66 on the side where the protrusion 67 is connected so as to surround the periphery of the protrusion 67. FIG. 12 shows a side view, a bottom view and a perspective view of the seal structure 65 of the sixth embodiment. In the sixth embodiment, the sealing material 68 does not need to have a C-shaped shape with a partially cutout, a groove on the side surface, a concave-convex shape on the lower surface, or the like. When the protruding portion 67 is inserted into the through hole 64 of the sealing cover 63, a gap is provided between the base material portion 66 and the sealing material 68 by the groove 69 of the base material portion 66. The groove 69 of the base material portion 66 and the gap between the protrusion 7 and the sealing cover 3 serve as a vent for vacuuming.

  When the vacuum package 61 is decompressed and heated, the groove 69 of the base member 66 is filled with the dissolved sealing material 68.

  Note that various shapes can be adopted as the shape, size, number, and the like of the grooves as long as an air gap that can be evacuated is secured. Since other configurations are the same as those of the second embodiment, description thereof is omitted.

  A seventh embodiment in which the present invention is preferably implemented will be described. FIG. 13 shows a schematic cross-sectional view of the vacuum package 1 according to the seventh embodiment in a temporarily sealed state under a reduced pressure condition. In the seventh embodiment, the vacuum package 71 has a protruding portion around the through hole 74 on the top surface of the sealing cover 73.

  When the protruding portion 77 of the seal structure 75 is inserted into the through hole 74, the protruding portion 79 of the sealing cover 73 contacts the lower surface of the sealing material 78. For this reason, a gap is formed between the sealing cover 73 and the sealing material 78. Vacuuming is performed through the gap between the protrusion 77 and the sealing cover 73 and the gap between the sealing cover 73 and the sealing material 78.

  When the vacuum package 71 is depressurized and heated, the gap is filled with the dissolved sealing material 78 between the sealing cover 73 and the sealing material 78 by the protrusions. Note that the shape, size, number, and the like of the protrusions can be various shapes as long as an air gap that can be evacuated is secured and the base material portion 76 and the sealing cover 73 are arranged substantially parallel to each other with a gap therebetween. Can be adopted. Since other configurations are the same as those of the second embodiment, description thereof is omitted.

  In addition, although this invention was demonstrated based on the said embodiment, it cannot be overemphasized that various changes, a deformation | transformation, improvement, etc. are included in the scope of the present invention, without being limited to the said embodiment. Further, various combinations, substitutions or selections of the disclosed elements are possible within the scope of the present invention.

  In the above embodiment, the vacuum package related to the infrared sensor using the infrared light receiving element as the functional element has been described. However, the functional element of the present invention is not limited to the infrared light receiving element, and a vacuum such as a piezoelectric element or a vibration element is used. Various functional elements that require sealing can be applied to the present invention. That is, it goes without saying that the vacuum package of the present invention can be applied to a pressure sensor and an acceleration sensor in addition to the infrared sensor.

1, 21, 31, 41, 51, 61, 71 Vacuum package
2, 22, 32, 42, 52, 62, 72 Board
3, 23, 33, 43, 53, 63, 73 Sealing cover
4, 24, 34, 44, 54, 64, 74 Through hole
5, 25, 35, 45, 55, 65, 75 Seal structure
6, 26, 36, 46, 56, 66, 76 Base material
7, 27, 37, 47, 57, 67, 77 Projection
8, 28, 38, 48, 58, 68, 78 Sealing material
29 Notch
38, 69 groove
79 Protrusion
10 Infrared sensor
11 Infrared detector
12 Board
13 Infrared transmission window
14 chambers
15 Spacer
16 Adhesive solder
17 Electrode pad
18 Bonding wire
19 Through hole
100 Seal structure
101 Base material
102 Protrusion
103 Sealing material

Claims (10)

In a vacuum package having a cavity sealed under reduced pressure,
A through hole for exhausting the cavity,
A sealing body that seals the through-hole, and the sealing body includes a base material that covers the top surface of the through-hole and a projection that is smaller than the through-hole provided in the base material. The vacuum is characterized in that the through hole is sealed in a state where the projection is inserted into the through hole with a sealing material sandwiched between the base portion and the surface of the vacuum package package. In a sealing body for sealing a through hole of a vacuum package sealed under reduced pressure,
The sealing body has a stepped shape including a base part that covers the upper surface of the through hole and a protrusion smaller than the through hole provided in the base part, and the protrusion of the base part is provided. A sealing body, wherein a sealing material is disposed on the provided surface. The surface of the base material portion provided with the protrusion is a flat surface,
The sealing material is formed so as to have a surface substantially parallel to a surface of the base material portion provided with the protrusion portion around the protrusion portion, and at least partially from the outer edge of the base material portion to the protrusion portion. The sealing body according to claim 2, further comprising a notch penetrating to the end. The surface of the base material portion provided with the protrusions is a flat surface, and the sealing material has a surface substantially parallel to the surface of the base material portion provided with the protrusions of the base material portion. The sealing body according to claim 2, wherein the sealing body is formed and has a groove penetrating from an outer edge of the base material portion to the projection portion at least partially. The surface of the base material portion provided with the protrusions is a flat surface, and the sealing material has an uneven shape on the entire surface with respect to the surface of the base material portion provided with the protrusions of the base material portion. The sealing body according to claim 2, wherein the sealing body is formed. The sealing material according to claim 2, wherein the sealing material is a spherical body, and the base portion has a hole for accommodating a part of the spherical body. The said base material part has a groove | channel penetrated from the outer edge of the said base material part to the periphery of the said projection part in at least one part in the surface in which the projection part of the said base material part was provided. Sealed body. The vacuum package has a main substrate and a sealing cover that has a hollow portion on the main substrate and covers the main substrate,
The through hole is provided in the sealing cover,
The vacuum package according to claim 1, wherein the sealing cover has a protrusion around the through hole. A sensor having a cavity sealed under reduced pressure,
An element for detecting electromagnetic waves;
A main board on which the elements are mounted;
A transmission substrate facing the main substrate and transmitting electromagnetic waves;
A spacer that is provided at an edge of the main substrate and the transmission substrate, and is disposed so that the main substrate and the transmission substrate are opposed to each other with a space;
A through-hole for exhausting the cavity provided in the transmission substrate and surrounded by the main substrate, the transmission substrate and the spacer;
A sealing body that seals the through-hole, and the sealing body includes a base part that covers an upper surface of the through-hole and a projection that is smaller than the through-hole provided in the base part. The through hole is sealed in a state in which the protrusion is inserted into the through hole with a sealing material sandwiched between the base material portion and the surface of the vacuum package. Sensor. In a manufacturing method of a vacuum package having a cavity sealed under reduced pressure,
A stepped shaped sealing body comprising a base part covering the upper surface of the through hole and a projection smaller than the through hole provided in the base part, in the through hole for exhausting the hollow part, Inserting the protruding portion into the through-hole in a state in which a sealing material is sandwiched between the base material portion and the surface of the vacuum package, and installing it;
Setting a package in which the sealing body is installed in the through hole in a vacuum chamber;
Depressurizing the inside of the vacuum chamber, evacuating the cavity through a gap between the surface of the vacuum package and the sealing material, heating the vacuum package, dissolving the sealing material, and Sealing between the part and the vacuum package surface;
Cooling the vacuum package, and solidifying the sealing material to seal the through hole.

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