JPS6384950U - - Google Patents

Info

Publication number
JPS6384950U
JPS6384950U JP17991486U JP17991486U JPS6384950U JP S6384950 U JPS6384950 U JP S6384950U JP 17991486 U JP17991486 U JP 17991486U JP 17991486 U JP17991486 U JP 17991486U JP S6384950 U JPS6384950 U JP S6384950U
Authority
JP
Japan
Prior art keywords
protrusions
suction hole
familiar
collection
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17991486U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17991486U priority Critical patent/JPS6384950U/ja
Publication of JPS6384950U publication Critical patent/JPS6384950U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP17991486U 1986-11-21 1986-11-21 Pending JPS6384950U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17991486U JPS6384950U (fr) 1986-11-21 1986-11-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17991486U JPS6384950U (fr) 1986-11-21 1986-11-21

Publications (1)

Publication Number Publication Date
JPS6384950U true JPS6384950U (fr) 1988-06-03

Family

ID=31123397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17991486U Pending JPS6384950U (fr) 1986-11-21 1986-11-21

Country Status (1)

Country Link
JP (1) JPS6384950U (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275664A (ja) * 1993-03-22 1994-09-30 Rohm Co Ltd 半導体チップピックアップ装置
JP2004087677A (ja) * 2002-08-26 2004-03-18 Nitto Denko Corp コレットおよびそれを用いてチップ部品をピックアップする方法
WO2005112537A1 (fr) * 2004-05-17 2005-11-24 Matsushita Electric Industrial Co., Ltd. Dispositif supérieur de fourniture de pièces et dispositif supérieur de montage de pièces
JP2012028594A (ja) * 2010-07-26 2012-02-09 Shinko Electric Ind Co Ltd 電子部品実装装置及び電子部品の実装方法
JP2020053457A (ja) * 2018-09-25 2020-04-02 株式会社東芝 ピックアップツール、および半導体モジュールの製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275664A (ja) * 1993-03-22 1994-09-30 Rohm Co Ltd 半導体チップピックアップ装置
JP2004087677A (ja) * 2002-08-26 2004-03-18 Nitto Denko Corp コレットおよびそれを用いてチップ部品をピックアップする方法
WO2005112537A1 (fr) * 2004-05-17 2005-11-24 Matsushita Electric Industrial Co., Ltd. Dispositif supérieur de fourniture de pièces et dispositif supérieur de montage de pièces
JP2012028594A (ja) * 2010-07-26 2012-02-09 Shinko Electric Ind Co Ltd 電子部品実装装置及び電子部品の実装方法
JP2020053457A (ja) * 2018-09-25 2020-04-02 株式会社東芝 ピックアップツール、および半導体モジュールの製造方法

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