JPS62170637U - - Google Patents
Info
- Publication number
- JPS62170637U JPS62170637U JP5819686U JP5819686U JPS62170637U JP S62170637 U JPS62170637 U JP S62170637U JP 5819686 U JP5819686 U JP 5819686U JP 5819686 U JP5819686 U JP 5819686U JP S62170637 U JPS62170637 U JP S62170637U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- push
- head
- sheet
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5819686U JPS62170637U (fr) | 1986-04-17 | 1986-04-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5819686U JPS62170637U (fr) | 1986-04-17 | 1986-04-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62170637U true JPS62170637U (fr) | 1987-10-29 |
Family
ID=30888564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5819686U Pending JPS62170637U (fr) | 1986-04-17 | 1986-04-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62170637U (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01109729A (ja) * | 1987-10-22 | 1989-04-26 | Fujitsu Ltd | 全面切断チップ剥離装置 |
JPH01158746A (ja) * | 1987-12-15 | 1989-06-21 | Matsushita Electron Corp | 半導体チップピックアップ装置 |
WO2022176076A1 (fr) * | 2021-02-17 | 2022-08-25 | 株式会社新川 | Dispositif de collecte et procédé de collecte pour puce de semi-conducteur |
-
1986
- 1986-04-17 JP JP5819686U patent/JPS62170637U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01109729A (ja) * | 1987-10-22 | 1989-04-26 | Fujitsu Ltd | 全面切断チップ剥離装置 |
JPH01158746A (ja) * | 1987-12-15 | 1989-06-21 | Matsushita Electron Corp | 半導体チップピックアップ装置 |
WO2022176076A1 (fr) * | 2021-02-17 | 2022-08-25 | 株式会社新川 | Dispositif de collecte et procédé de collecte pour puce de semi-conducteur |
JP7145557B1 (ja) * | 2021-02-17 | 2022-10-03 | 株式会社新川 | 半導体ダイのピックアップ装置及びピックアップ方法 |