JPS6437040U - - Google Patents

Info

Publication number
JPS6437040U
JPS6437040U JP13207087U JP13207087U JPS6437040U JP S6437040 U JPS6437040 U JP S6437040U JP 13207087 U JP13207087 U JP 13207087U JP 13207087 U JP13207087 U JP 13207087U JP S6437040 U JPS6437040 U JP S6437040U
Authority
JP
Japan
Prior art keywords
cylindrical portion
semiconductor chip
tip
vacuum
accommodates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13207087U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13207087U priority Critical patent/JPS6437040U/ja
Publication of JPS6437040U publication Critical patent/JPS6437040U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP13207087U 1987-08-28 1987-08-28 Pending JPS6437040U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13207087U JPS6437040U (fr) 1987-08-28 1987-08-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13207087U JPS6437040U (fr) 1987-08-28 1987-08-28

Publications (1)

Publication Number Publication Date
JPS6437040U true JPS6437040U (fr) 1989-03-06

Family

ID=31388701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13207087U Pending JPS6437040U (fr) 1987-08-28 1987-08-28

Country Status (1)

Country Link
JP (1) JPS6437040U (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019212801A (ja) * 2018-06-06 2019-12-12 株式会社デンソー 半導体装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019212801A (ja) * 2018-06-06 2019-12-12 株式会社デンソー 半導体装置およびその製造方法

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