JPS6381961A - Device for assembling semiconductor device - Google Patents

Abstract

PURPOSE:To remove the relative displacement of a semiconductor device and the outer frame of a lead frame, to prevent falling from the lead frame of the semiconductor device and to improve throughput in the assembly of the semiconductor device by interlocking and moving a push-up pin and a lead frame guide by an interlocking plate. CONSTITUTION:When a punch guide 15a is lowered, a lead frame guide 3 is pushed down to a lower section against the force of a spring 13 together with an interlocking plate 19 and a push-up pin 12. Punches 14 are brought down, and outer leads in a lead frame 2 are cut and bent and fabricated. The punches 14 are elevated, and the puch guide 15a is lifted. The interlocking plate 19 follows up to the punch guide 15a and rises until it is returned to a position where the interlocking plate 19 is brought into contact with the upper wall of an inserting hole 18 by the action of the spring 13 at that time, and is stopped. The lead frame guide 3 follows up to the punch guide 15a and elevates and is stopped. Large stress is not applied to a hanging head, thus preventing the cutting of the hanging lead, then obviating falling from the lead frame 2 of a semiconductor device 1.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a technique that is particularly effective when applied to the assembly of semiconductor devices using lead frames. It relates to techniques that are effective when processing or processing equipment.

[Prior art] For example, DIP (Dual Inline Pa
ckage) type or P L CC (Plastic
In assembling a loaded chip carrier (loaded chip carrier) type semiconductor device, a lead frame is generally used, and the semiconductor device is processed and processed while being supported by the outer frame of the lead frame. Furthermore, in the above semiconductor device, after the semiconductor chip mounting area is sealed with resin, the tie bars of the lead frame are cut and the external leads are bent.

Of these, FIG. 5 shows a lead frame processing apparatus (semiconductor device assembly apparatus) used in the bending process. Although this technique is not a publicly known technique, it is a technique studied by the present inventor, and the outline is as follows.

In the figure, 1 represents a semiconductor device formed by integrally molding a tab (chip mounting part) with a resin mold at the center of the outer frame of a lead frame 2 supported by a plurality of hanging leads. There is. 3 guides the outer frame of the lead frame 2 to the processing section.
1 depicts a lead frame guide that conveys the l.

Here, a plurality of rods 4 are installed vertically in the lower part of the lead frame guide 3, and the lower part of the rods 4 is fitted into a spring chamber 6 bored in the lower die head 5. The rod 4 is urged upward by a spring 7 inserted into the spring chamber 6.

Furthermore, a die holder 8 and a bending die 9 are mounted in this order on the lower die head 5, and these constitute a lower die. Here, a spring chamber 10 is bored in the center of the lower die head 5. On the other hand, a guide hole 11 communicating with the spring chamber 10 is provided in the die holder 8 and the bending die 9. A push-up pin 12 is fitted into the spring chamber 10 and the guide hole 11, and the push-up pin 12 is urged upward by a spring 13 inserted into the spring chamber 10.

In addition, an upper die is installed above the bending die 9. This upper mold has a punch 14 for bending the external leads.
and a punch guide 15a that guides this punch 14,
It is comprised of a knockout (knock out) 15b for holding down the lead frame 2 when bending the external lead.

In addition, in FIG. 5, 16 is a mold groove for lead bending;
Reference numeral 17 represents a housing portion for a semiconductor device formed at the joint portion of the lower mold and the upper mold.

Next, the operation of this lead frame processing device will be explained.

The semiconductor device N1 is transported to a position inside the mold by the lead frame guide 3, and when the semiconductor device N1 is positioned, the punch guide 15a, which is the upper mold, is lowered.

In this case, first, the punch guide 15a comes into contact with the lead frame guide 3 during its descent. At this time, at the same time,
The back surface of the semiconductor device 1 is also brought into contact with the lower surface of the knockout 15b. Furthermore, as the punch guide 15a further descends, the lead frame guide 3 is pushed down against the spring 7. Then, when the punch guide 15a further descends.

The knockout 15b presses the bottom surface of the semiconductor device 1 against the push-up bottle 12, and the push-up bottle 12 is pushed down against the spring 13. Then punch guide 1
5a and the bending die 9 are clamped.

Next, the punch 14 is lowered to bend the external leads of the lead frame 2.

Thereafter, as the punch 14 rises, the punch guide 1
5a rises. At this time, the lead frame guide 3 follows the punch guide 15a until it returns to the initial position due to the action of the spring 7. After the punch guide 15a returns to the initial position, only the punch guide 15a rises to a predetermined position.

Note that in this device, the bending die 9 of the lead frame 2 is
If the semiconductor device 1 is unable to follow the rise of the punch guide 3 due to adhesion to the punch guide 3, the push-up pin 13 pushes the semiconductor device 1 upward.

[Problems to be Solved by the Invention However, such a processing device has the following problems.

For example, when the punch guide 15a and the lead frame guide 3 come into contact during mold clamping, the semiconductor device 1
The lower surface of the knockout 15b must be formed so that the rear surface of the knockout 15b also comes into contact with the lower surface of the knockout 15b.
However, due to dimensional errors in the mold itself and the package of the semiconductor device, in reality, the punch guide 1
5a and the lead frame guide 3, there are many cases in which the back surface of the semiconductor device g11 does not come into contact with the lower surface of the knockout 15b.

In this case, the punch guide 15a further descends,
When the bottom surface of the semiconductor device 1 comes into contact with the push-up pin 13,
Due to the action of the spring 13, the back of the semiconductor device [1 is pressed against the lower surface of the knockout 15b, so that
Hanging leads (which cause relative movement between the outer frame of the lead frame 2 and the semiconductor device 1 and support the semiconductor device 1 on the outer frame)
Stress is applied to the suspension lead that supports the tab by the outer frame. In this case, the hanging lead breaks,
There is a risk that the semiconductor device 1 will fall off the lead frame 2.

In particular, bending the external leads of a lead frame of a PLCC type semiconductor device involves cutting and bending the leads in multiple steps as shown in Figure 6, which poses a great risk. .

Conversely, when the mold is clamped, the semiconductor device 1i1 is
1 may come into contact with the lower surface of the knockout 15b. Also in this case, relative movement occurs between the outer frame of the lead frame 2 and the semiconductor device 1, causing the above-mentioned problem.

As a result, there are problems such as the semiconductor device remaining inside the processing equipment, making it impossible to perform subsequent molding.

The present invention has been made in view of these difficulties, and an object of the present invention is to provide a semiconductor device assembly apparatus that can prevent semiconductor devices from falling off from lead frames and improve throughput in assembling semiconductor devices. do.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for Solving the Problems] Representative inventions disclosed in this application will be summarized as follows.

That is, it is provided with an interlocking plate that interlocks leads and frame guides that guide the outer frame of a lead frame that supports a semiconductor device, and push-up pins that push up the semiconductor device.

[Function] According to the above-described means, the interlocking plate moves the push-up pin up and down in conjunction with the lead frame guide, and works to prevent relative movement between the semiconductor device and the outer frame, thereby supporting the semiconductor device. No big stress is placed on the hanging lead,
Therefore, it is possible to prevent the semiconductor device from falling off the lead frame due to the cutting of the hanging leads, and it is possible to achieve the above object of improving the throughput in assembling the semiconductor device.

[Embodiment] FIG. 1 is a schematic cross-sectional view of a lead frame processing apparatus which is an embodiment of a semiconductor device assembly apparatus according to the present invention.

In the figure, 1 represents a semiconductor device supported by the outer frame of a lead frame 2. As shown in FIG. Further, 3 represents a lead frame guide that guides the outer frame of the lead frame 2 and transports the semiconductor device 1 to the processing section.

Here, a biasing means (not shown) is provided below the lead frame guide 3 to bias the lead frame guide 3 upward by a spring force or the like.

Furthermore, a die holder 8 and a bending die 9 are mounted in this order on a lower die head S located below the lead frame guide 3, and these constitute a lower die. Here, a spring chamber 10 extending from the lower mold head 5 to the die holder 8 is bored in the center portion of the lower mold head 5 and the die holder 8 . On the other hand, the bending die 9 is provided with a fitting hole 18 that passes through the bending die 9 in the horizontal direction and communicates with the spring chamber 10 . Also, bending die 9
A guide hole 11 communicating with the insertion hole 18 is provided. An interlocking plate 19 is fitted into the fitting hole 18. Further, a push-up pin 12 that engages with the interlocking plate 19 is fitted into the spring chamber 10 and the guide hole 11.
3 is biased upward. As a result, spring 13
As a result, the interlocking plate 19 is also urged upward.

In addition, an upper die is installed above the bending die 9. This upper mold includes a punch 14 for bending the outer frame of the external lead, and a punch guide 15 for supporting the punch 14.
a, and a knockout 15b for holding down the lead frame 2 when bending the external lead.

In addition, in FIG. 1, 16 is a mold groove for lead bending;
Reference numeral 17 represents a housing portion for a semiconductor device formed at the joint portion of the lower mold and the upper mold.

Further, as shown in FIG. 2, the lead frame processing apparatus includes, for example, a light emitting element 20 that emits a laser beam and a light receiving element 2 that receives the laser beam at a position sandwiching the bending die 9.
1 is provided. In this case, the optical path of the laser beam formed between the first light emitting element 20 and the light receiving element 21 is made to be approximately at the same height as the upper surface of the bending die 9. In this way, it is possible to detect dropping of the semiconductor device 1 from the outer frame of the lead frame 2 by the photodetecting device composed of the light emitting element 20 and the light receiving element 21.

Next, the operation of this lead frame processing device will be explained.

When the semiconductor device 1 is transported to a position inside the mold by the lead frame guide 3 and positioned, the punch guide 15a, which is an upper mold, is lowered.

In this case, first, the punch guide 15a is brought into contact with the lead frame guide 3. Further, when the punch guide 15a further descends, the lead frame guide 3 moves to the interlocking plate 18.
and is pushed down together with the push-up bottle 12 against the spring 13. In this way, the punch guide 15a and the bending die 9 are clamped together.

Next, the punch 14 is lowered to cut and bend the external leads of the lead frame 2.

After that, the punch 14 rises and then the punch guide 1
5a rises. At this time, the interlocking plate 19 is moved to the initial position (the interlocking plate 19 is attached to the earthen wall of the insertion hole 18 by the action of the spring 13).
The punch guide 15a follows the punch guide 15a until it returns to the position where it abuts, and stops when it returns to the initial position. Furthermore, even after the interlocking plate 19 returns to the initial position, the punch guide 15a
will rise further. At this time, lead frame guide 3
The punch guide 1 is moved by the action of a biasing means (not shown).
5a, rises to a predetermined position, and stops. From there, the punch guide 15a further rises, returns to a predetermined position, and then stops.

The lead frame that has been processed in this way is sent to the next process. At this time, from the light emitting element 20 to the light receiving element 2
A laser beam is irradiated toward the semiconductor device 1, and dropping of the semiconductor device is detected. If the semiconductor device falls off, the driving of the processing device is stopped.

Note that in this processing apparatus, when the punch guide 15a and the lead frame guide 3 come into contact with each other, it is not always necessary that the back surface of the semiconductor device 1 comes into contact with the knockout 15b at the same time.

This is because, in the device shown in FIG. 5 studied by the present inventor, the lead frame guide 3 is
Since the lead frame guide 3 does not work in conjunction with the push-up pin 12, it was necessary to always push the semiconductor device Ill upward during processing of the lead frame. This is because the semiconductor device 1 can be pushed up, so there is no need to always urge the semiconductor device 1 upward.

In the lead frame processing apparatus of this embodiment, the following effects can be obtained.

That is, since the push-up pin and the lead frame guide are moved in conjunction with each other by the interlocking plate, there is no relative movement between the semiconductor device 1 and the outer frame supporting it when the lead frame guide is raised or lowered.

The effect of not applying a large stress to the suspension lead prevents the suspension lead from being cut and prevents the semiconductor device 1 from falling off the lead frame 2.

Further, since the detection device is provided, even if the semiconductor device 1 falls off, the processing equipment can be detected and immediately stopped, which has the effect of preventing damage to the processing equipment. can.

The synergy of the above effects makes it possible to improve the throughput in assembling semiconductor devices.

Note that the light emitting element 2'0 and the light receiving element 21 of the above embodiment
As shown in FIG. 3, the installation position may be such that its optical path is at approximately the same height as the transport path surface of the lead frame 2 (initial position a of the lead frame guide 3).

Further, the installation positions of the light emitting element 20 and the light receiving element 21 in the above embodiment may be such that the optical path thereof is oblique to the conveyance path of the lead frame 2, as shown in FIG. .

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. For example, a plurality of springs for lifting the interlocking plate 18 may be provided.

In the above explanation, the invention made by the present inventor was mainly applied to the field of application, which is the field of application, which is the bending processing technology for external leads. However, the present invention is not limited thereto. It can also be used for cutting tie bars and other semiconductor processing.

[Effects of the Invention] The effects obtained by typical inventions disclosed in this application are briefly explained below.

The push-up pin and lead frame guide are moved in conjunction with each other by the interlocking plate.

When the lead frame guide moves up and down, there is no relative movement between the semiconductor device and the outer frame that supports it, and no large stress is applied to the suspension leads, which prevents the suspension leads from breaking and prevents the semiconductor device's lead frame from moving. is prevented from falling off.

Further, since a detection device is provided, even if a semiconductor device falls off, the processing device can be detected and immediately stopped, thereby preventing damage to the processing device.

That is, when processing the lead frame, there is no relative movement between the semiconductor device and the outer frame of the lead frame that supports the semiconductor device, so the semiconductor device is prevented from falling off the lead frame, and as a result, the assembly of the semiconductor device is prevented. Throughput can be improved.

[Brief explanation of the drawing]

FIG. 1 is a vertical sectional view of the upper and lower mold portions of an embodiment of the semiconductor device assembly apparatus according to the present invention, FIG. 2 is a side view of the detection device in FIG. 1, and FIG. 3 is a side view of the detection device. FIG. 4 is a side view of another modification of the detection device; FIG. 5 is a sectional view of an assembly device considered by the inventor; FIG. 6 is an assembly device for a PLCC type semiconductor device. FIG. 1... Semiconductor device, 2... Lead frame, 3
...Lead frame guide, 5...Lower die head. 12...Push-up pin, 13...Spring, 19...
... Interlocking plate, 2o... Light emitting element, 21... Light receiving element.

Claims (1)

[Claims] 1. A lead frame guide that guides the outer frame of a lead frame that supports a semiconductor device to transport the semiconductor device to the vicinity of the processing section, and a lead frame guide that transports the semiconductor device to the vicinity of the processing section by the lead frame guide. An upper die and a lower die for processing a semiconductor device, and a biasing means for moving the semiconductor device in a direction away from the processing section by a push-up pin and moving the outer frame in a direction away from the processing section by the lead frame guide. and an interlocking plate that interlocks the push-up pin and the lead frame guide. 2. The semiconductor device assembly apparatus according to claim 1, further comprising a detection means for detecting the falling of the semiconductor device from the lead frame in the vicinity of the processing section. 3. The semiconductor device assembly apparatus according to claim 1 or 2, wherein the biasing means comprises a spring. 4. The apparatus for assembling a semiconductor device according to claim 2, wherein the detecting means comprises a light emitting element and a light receiving element which are arranged opposite to each other with the processed portion interposed therebetween.