JPS6380844U - - Google Patents
Info
- Publication number
- JPS6380844U JPS6380844U JP1986174812U JP17481286U JPS6380844U JP S6380844 U JPS6380844 U JP S6380844U JP 1986174812 U JP1986174812 U JP 1986174812U JP 17481286 U JP17481286 U JP 17481286U JP S6380844 U JPS6380844 U JP S6380844U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- insulating film
- mounting structure
- bonded
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986174812U JPS6380844U (enFirst) | 1986-11-14 | 1986-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986174812U JPS6380844U (enFirst) | 1986-11-14 | 1986-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6380844U true JPS6380844U (enFirst) | 1988-05-27 |
Family
ID=31113549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986174812U Pending JPS6380844U (enFirst) | 1986-11-14 | 1986-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6380844U (enFirst) |
-
1986
- 1986-11-14 JP JP1986174812U patent/JPS6380844U/ja active Pending
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