JPS6380544A - Heater for ic wiring bonder - Google Patents

Heater for ic wiring bonder

Info

Publication number
JPS6380544A
JPS6380544A JP61225573A JP22557386A JPS6380544A JP S6380544 A JPS6380544 A JP S6380544A JP 61225573 A JP61225573 A JP 61225573A JP 22557386 A JP22557386 A JP 22557386A JP S6380544 A JPS6380544 A JP S6380544A
Authority
JP
Japan
Prior art keywords
temperature
bonding
heater
preheated
preheating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61225573A
Other languages
Japanese (ja)
Inventor
Tomoyuki Kobayashi
智之 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61225573A priority Critical patent/JPS6380544A/en
Publication of JPS6380544A publication Critical patent/JPS6380544A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7865—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

PURPOSE:To control to manage both a both part and a preheated part to become substantially ideal temperature distributions thereby to effectively bond an IC chip by providing individual heaters and temperature detectors at the bonded part and the preheated part to individually manage the temperatures. CONSTITUTION:A lead frame 1 and an IC chip 2 placed on the frame are conveyed from the left to the right of the drawing, preheated at positions A-E of preheaters, and bonded at positions F, G of bonding units. In a heater of an IC wiring bonder, the bonded part is heated, temperature-detected and temperature-controlled at positions F, G by a heater 3a, a thermocouple 6a and temperature controller 7a for the bonded part, as well as preheated part is heated, temperature-detected and temperature-controlled at positions A-E by a heater 3, a thermocouple 6b and a temperature controller 7b for a preheated part. Therefore, the preheated parts A-E can be heated, detected and controlled to become suitable preheating temperature, and so controlled that the temperatures of the parts become ideal temperatures.

Description

【発明の詳細な説明】 ［産業上の利用分野］ この発明は、熱圧着方式によるＩＣワイヤーボンダーに
おいて、対象ワークを加熱する装置に関するものである
５ ［従来の技術］ 第３図は、ＩＣワイヤーボンダー内における従来のワー
ク加熱装置の長手方向断面模式図である、図において、
１はＩＣリードフレーム、２はＩＣチップであり、ＩＣ
チップダイボンダーにてリードフレーム１上にはんだ付
けされてのせられている。３はヒーターであり、リード
フレーム１とリードフレーム１」ユのＩＣ千・ツブ２（
以下、この組合わせをｒｉ＝ｔｉワークｊという）を加
熱するための熱源である。４はヒートブロックであり、
ヒーター３を保持し、対象ワークを下方から支持し４加
熱する。５はフレーム押えであり、ボンディング部にて
、ヒーＩ・プロ・ツク４との１ｍで対象ワークを挟み込
み押えつけるものである。６は熱電対であり、ヒートプ
ロ・ツク・−１内の温度を検出する温度検出器である。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a device for heating a target workpiece in an IC wire bonder using a thermocompression method.5 [Prior Art] Fig. 3 shows an IC wire In the figure, which is a schematic longitudinal cross-sectional view of a conventional workpiece heating device in a bonder,
1 is an IC lead frame, 2 is an IC chip,
It is soldered and placed on the lead frame 1 using a chip die bonder. 3 is a heater, which includes lead frame 1 and lead frame 1'
Hereinafter, this combination is referred to as a heat source for heating the ri=ti work j). 4 is a heat block,
The heater 3 is held and the target workpiece is supported from below and heated. Reference numeral 5 denotes a frame presser, which is used to sandwich and press the target workpiece at a distance of 1 m from the Hee-I Pro-Tsuku 4 in the bonding section. 6 is a thermocouple, which is a temperature detector for detecting the temperature inside the heat protector-1.

７は温度コントローラである。7 is a temperature controller.

次に動作について説明する。対象ワークであるＩｃチ・
ツブ２？のせたリードフレーム１は、図示しない搬送機
構によって、第３図に示すフし一ノ４搬送方向（図の左
から右へ）に、リードフレーム上のＩＣチ・ソ１の隣接
距離分毎に搬送される５この搬送の際、移動を妨げない
ように、Ｉ図示しない上下動機構によって、ヒートプロ
・ツク４は対象ワーク搬送面より下方に、フレーｌ＼押
え５は上方に退避しており、各個の搬送完了と同時に、
ヒートプロ・ツク４は上昇し、フレーム押え５は下降し
て対象ワークを挾み込むことにより対象ワークを固定し
、リードフレーム１上のＩｃチップ２を加熱しボンディ
ングする。以上の動作を繰り返してボンディングが行わ
れる。Next, the operation will be explained. The target work is Ic chi.
Tubu 2? The lead frame 1 placed on the lead frame is moved by a transport mechanism (not shown) in the direction of transport (from left to right in the figure) shown in FIG. During this transport, the heat processor 4 is retracted below the target workpiece transport surface, and the presser foot 5 is retracted above the target workpiece transport surface by a vertical movement mechanism (not shown) so as not to interfere with the movement. As soon as each piece is transported,
The heat protector 4 goes up, and the frame presser 5 goes down and clamps the target workpiece to fix the target workpiece, and heats and bonds the Ic chip 2 on the lead frame 1. Bonding is performed by repeating the above operations.

ここで、第３ＥＡにおいて、ヒートプロ・ツク４上のＩ
Ｃチップ２のうち、Ｆ、（」で示す位置のＩＣチップが
ボンディングされる位置にある。熱電対６はボンデイン
ク部Ｆ、Ｇの部分の下方のヒートプロ・ツク４内の温度
を検出し、温度コント１７−ラ７／＼伝達する。温度コ
ントローラ７は、熱電対６からの信号により、ボンディ
ング点Ｆ、Ｇの部分が予め設定されたボンディング適正
温度になるように、ヒータ３の発熱量を制御する。Here, in the 3rd EA, I
Of the C-chip 2, the IC chips at the positions indicated by F and The temperature controller 7 controls the amount of heat generated by the heater 3 based on the signal from the thermocouple 6 so that the bonding points F and G reach a preset appropriate temperature for bonding. do.

ヒートプロ・ツク４」ユのＡ〜Ｅの位置は、Ｆ、Ｇの位
置でボンディングが行われている間に、順次ボンディン
グされる対象ワークをある程度昇温させるために設けら
れた予熱部である。Positions A to E of Heat Pro 4 are preheating sections provided to raise the temperature of the workpieces to be sequentially bonded to some extent while bonding is being performed at positions F and G.

〔発明が解決りようとする問題点１ 従来の対象ワークを加熱する装置は、以」−のように、
１組のヒーター３．ヒートブロック１１　、温度検出器
（熱電対）６及びコントローラ７によって構成されてい
るために、ボンディング位置Ｆ。[Problem to be solved by the invention 1 The conventional device for heating the target workpiece is as follows.
1 set of heaters 3. Since the heat block 11 is composed of a temperature detector (thermocouple) 6 and a controller 7, the bonding position F is determined.

Ｇをボンディング適正温度に設定すると、フレーム押え
５からの放熱、ヒーター３自身の長手方向の発熱量の不
均一等の理由により、第４図のグラフに示すように、ボ
ンディング部Ｆ、Ｇの温度はボンディング適正温度にな
っているけれども、予熱部である例えばＤ点付近がはん
だ融解温度まで上昇してし渡うこともある。このため、
はんだの濡れ性が劣化したり、甚だしい場合は、ボンデ
ィング前にリードフし一ム１上でＩＣチ・ツブ２が移動
するといった不具合を生じていた。When G is set to the appropriate temperature for bonding, the temperature of bonding parts F and G will decrease as shown in the graph of FIG. Although the temperature is at the appropriate bonding temperature, the preheating area, for example, near point D, may rise to the solder melting temperature. For this reason,
The solder wettability deteriorates, or in severe cases, the IC chip 2 moves on the lead pad 1 before bonding.

この発明はト、記のような問題点を解消するため（こな
されたもので、ヒー１−プロ・ツク４−ヒのボン子イン
グ位置ド、Ｇ点でボンディング適正温度に設定した場合
でも、予熱部であるＡ〜Ｅ点においてボンディング適正
温度以上に上昇することなく。This invention was made in order to solve the problems as described in (G) and (G). The temperature does not rise above the appropriate bonding temperature at points A to E, which are the preheating parts.

かつ、適当な予熱効果を得ることができる温度分布を実
現しうるＩＣワイヤーボンダーの加熱装置を得ることを
目的とする、 ［問題点を解決するための手段］ この発明に係るＩＣワイヤーボンダーの加熱装置は、ポ
ンディ〉′グ部と予熱部とにそれぞれ別個の加熱用ヒー
タ及び温度検出器を有し、それぞれ独立して温度管理が
行えるようにしたものである。[Means for Solving the Problem] Heating of an IC wire bonder according to the present invention aims to obtain a heating device for an IC wire bonder that can realize a temperature distribution that can obtain an appropriate preheating effect. The device has separate heaters and temperature detectors in the pumping section and the preheating section, so that the temperatures can be controlled independently.

［作用〕 この発明におけるＩＣワイヤーボンダーの加熱装置は、
ボンディング部と予熱部にそれぞれ別個のヒーターと温
度検出器を設けて、別個に温度管理を行うので、ボンデ
ィング部も予熱部もほぼ理想的な温度分布となるように
管理制御することが可能となる。[Function] The heating device for the IC wire bonder in this invention has the following features:
Separate heaters and temperature detectors are installed in the bonding area and preheating area, and the temperature is controlled separately, making it possible to manage and control both the bonding area and the preheating area so that the temperature distribution is almost ideal. .

「発明の実施例」 以下、この発明の一実施例を図について説明する。第１
図はこの考案の長平方向断面模式し間であるう図におい
て、１はリードフレーム−２はＩＣチヅプて′ある。ヒ
ーターはボンディング用ヒータ３　ａと予熱部用ヒータ
ー３ｂとに別個に設けられている。ヒーＩ・ブロック４
には、ボンディング部と−Ｆ熱部との間にエアギヤ・ツ
ブ９が形成されている。ボンディング部用ヒートプロ・
・？りと予熱部用ヒートブロックとに別個に設けてもよ
い　５はフレーム押えである。温度検出器はボンディン
グ部用熱電対６ａと予熱部用熱電対６ｂとが設けられて
いる。温度コントローラもボンディング部用温度コント
ローラ７ａと予熱部用温度コントローラ７ｂとが設けち
れている。この両温塵コントローラは１個の装置にまと
めて、１個の温度コントローラ内でボンデインク部と予
熱部との温度を別個にコントロールできるようにしても
よい２次に動作について説明する。第３図について説明
したように、第１図においても、リードフレー１、】と
その１に載ぜられたＩＣチップ２は、図の左から右へ搬
送され、予熱部であるＡ〜Ｅの位置で予熱され、ボ〉デ
ィジグ部であるＦ、Ｇの位置でボンディングが行われる
。第１図に示すこの発明によるＩＣワイヤーボンダーの
加熱装置では、ボンディング部であるＦ、Ｇの位置のカ
ロ熱、温度検出及び温度制御はボンディング部用のヒー
タ３ａ、熱電対６ａ及び温度コ〉′トローラ７ａで行い
、予熱部であるＡ−Ｅの位置の加熱、温度検出及び温度
制御は予熱部用のヒータ３ｂ、熱電対６ｂ及び温度コン
トローラ７ｂで行うので、ボンディング部Ｆ、Ｇはボン
ディング適正温度とし、かつ、予熱部Ａ〜Ｅは適正な予
熱温度となるように加熱。"Embodiment of the Invention" An embodiment of the invention will be described below with reference to the drawings. 1st
The figure is a schematic cross-sectional view of this invention in the longitudinal direction. In the figure, 1 is a lead frame and 2 is an IC chip. The heaters are separately provided as a bonding heater 3a and a preheating section heater 3b. Hee I block 4
An air gear knob 9 is formed between the bonding part and the -F heating part. Heat Pro for bonding part
・? 5 is a frame holder, which may be provided separately for the heating block and the heat block for the preheating section. The temperature detector is provided with a thermocouple 6a for the bonding part and a thermocouple 6b for the preheating part. The temperature controllers include a bonding section temperature controller 7a and a preheating section temperature controller 7b. A secondary operation will be described in which the two hot dust controllers may be combined into one device so that the temperatures of the bonding ink section and the preheating section can be controlled separately within one temperature controller. As explained with reference to FIG. 3, also in FIG. 1, the lead flakes 1, ] and the IC chip 2 mounted on the lead frames 1, 2 are transported from left to right in the figure, and are placed in preheating sections A to E. It is preheated at the position, and bonding is performed at positions F and G, which are the body jig parts. In the IC wire bonder heating device according to the present invention shown in FIG. The heating, temperature detection, and temperature control at the position A-E, which is the preheating section, are performed by the heater 3b, thermocouple 6b, and temperature controller 7b for the preheating section, so the bonding sections F and G are at the appropriate temperature for bonding. At the same time, preheating sections A to E are heated to the appropriate preheating temperature.

検出、制御をすることができ、各部の温度が第２図に示
すような理想的な温度となるように制オすることができ
る。なお、ヒートブロック１１には、ボンデインク部と
予熱部との間に切り欠き（エアーギヤ・ツブ）９が設け
らｉｌており、ボンディング部と予熱部との間の熱干渉
を減少させている。これにより、ボンディング部と予熱
部との熱的独立性を強め、温度制御を容易にしている１
、なお、土、記実施例では、ヒーター、熱電対及び温度
コントローラからなる加熱装置の構成をボンディング部
と予熱部とに分割したものを示したが、取付スペースと
コスト面の制限の許す限り、この分割数が多い稈より高
精度な温度管理が行えることは勿論である。It can be detected and controlled, and the temperature of each part can be controlled to an ideal temperature as shown in FIG. Note that the heat block 11 is provided with a notch (air gear protrusion) 9 between the bonding part and the preheating part to reduce thermal interference between the bonding part and the preheating part. This strengthens the thermal independence between the bonding section and the preheating section, making temperature control easier.
In addition, in the embodiment described above, the configuration of the heating device consisting of a heater, a thermocouple, and a temperature controller was shown divided into a bonding part and a preheating part, but as long as installation space and cost limitations permit, It goes without saying that more precise temperature control can be achieved than with a culm that has a large number of divisions.

〔発明の効果］ 以上のように、この発明では、予熱部とボンディング部
とをそれぞれ別個のヒータ、温度検出器及び温度コント
ローラを設け、別個に温度制御を行うようにしたため、
第２ＵＡに示すように、ボンディング部はボンディング
適正温度とし、予熱部は予熱適正温度とするように制御
することが可能である。これによって、Ｉｃチ・ツブの
確実なボンディングを行うことができる。[Effects of the Invention] As described above, in this invention, separate heaters, temperature detectors, and temperature controllers are provided for the preheating section and the bonding section, and the temperatures are controlled separately.
As shown in the second UA, it is possible to control the bonding part to have an appropriate temperature for bonding and the preheating part to have an appropriate temperature for preheating. This allows reliable bonding of the IC chips.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの発明の一実施例によるＩＣワイヤーボンダ
ーの加熱装置の縦断面模式図、第２図は第１図のヒート
プロ・ツクの表面温度のグラフの図、第３図は従°来例
の縦断面模式図、第４図は従来例のヒートブロックの表
面温度のグラフの図である。 ＩＡにおいて、１はリードフレーム、２はＩＣ千ツブ、
３ａはボ〉ディング部用ヒーター、３ｂは予熱部用ヒー
ター、１１はヒートブロック、５はフレーノ、押え、６
ａはポンディ〉′グ部用熱電対、６ｂは予熱部用熱電対
、７ａはボンディング部用温度コントローラ、７ｂは予
熱部用温度コントローラ、９はエアギヤ・ツブである。 なお、図中、同−符一号は同−一または相当部分を示ず
２Fig. 1 is a schematic vertical cross-sectional view of a heating device for an IC wire bonder according to an embodiment of the present invention, Fig. 2 is a graph of the surface temperature of the heat protector shown in Fig. 1, and Fig. 3 is a conventional example. FIG. 4 is a graph of the surface temperature of a conventional heat block. In IA, 1 is a lead frame, 2 is an IC chip,
3a is a heater for the boarding section, 3b is a heater for the preheating section, 11 is a heat block, 5 is a fleno, presser, 6
Reference numeral a designates a thermocouple for the bonding section, 6b a thermocouple for the preheating section, 7a a temperature controller for the bonding section, 7b a temperature controller for the preheating section, and 9 an air gear knob. In addition, in the figures, the same reference numeral 1 does not indicate the same or equivalent part.

Claims (1)

【特許請求の範囲】[Claims] はんだ付されたＩＣチップをのせたリードフレームが搬
送される途中で加熱されボンディングが行われるＩＣワ
イヤーボンダーの加熱装置において、ボンディングが行
われる過程にある対象ワークを加熱する部分と、ボンデ
ィング前の対象ワークを予熱する部分とにそれぞれ別個
の加熱用ヒーター及び温度検出器を有し、それぞれ独立
して温度管理が行える装置を設けたことを特徴とするＩ
Ｃワイヤーボンダーの加熱装置。In the heating device of an IC wire bonder, where a lead frame carrying a soldered IC chip is heated and bonded while it is being transported, there is a part that heats the target work in the process of bonding, and a part that heats the target work before bonding. I is characterized in that the part for preheating the workpiece has a separate heating heater and temperature detector, and is provided with a device that can independently control the temperature.
C wire bonder heating device.
JP61225573A 1986-09-24 1986-09-24 Heater for ic wiring bonder Pending JPS6380544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61225573A JPS6380544A (en) 1986-09-24 1986-09-24 Heater for ic wiring bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61225573A JPS6380544A (en) 1986-09-24 1986-09-24 Heater for ic wiring bonder

Publications (1)

Publication Number Publication Date
JPS6380544A true JPS6380544A (en) 1988-04-11

Family

ID=16831423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61225573A Pending JPS6380544A (en) 1986-09-24 1986-09-24 Heater for ic wiring bonder

Country Status (1)

Country Link
JP (1) JPS6380544A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6530512B2 (en) 2000-12-05 2003-03-11 Mitsubishi Denki Kabushiki Kaisha Wire bonding apparatus and wire bonding method
WO2008155013A1 (en) * 2007-06-19 2008-12-24 Ultrasonics Steckmann Gmbh Ultrasonic welding station
US9205631B2 (en) 2013-08-14 2015-12-08 Globalfoundries Inc Controlling the melt front of thin film applications

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6530512B2 (en) 2000-12-05 2003-03-11 Mitsubishi Denki Kabushiki Kaisha Wire bonding apparatus and wire bonding method
WO2008155013A1 (en) * 2007-06-19 2008-12-24 Ultrasonics Steckmann Gmbh Ultrasonic welding station
US9205631B2 (en) 2013-08-14 2015-12-08 Globalfoundries Inc Controlling the melt front of thin film applications

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