KR102331546B1 - Manufacturing apparatus and method of rear detective sensor for vehicle - Google Patents

Abstract

The invention relates to an apparatus for manufacturing a rear sensor for a vehicle is disclosed. The disclosed device for manufacturing a rear detection sensor for a vehicle includes a moving member for moving a measuring unit and a housing of the vehicle rear sensing sensor, and is located on one side of the moving member, and irradiates a laser to the housing to solder the measuring unit and the housing In a state in which the vehicle laser irradiation member and the printed circuit board of the vehicle rear detection sensor are seated in the housing, a flux application preheating member for applying flux to and heating the printed circuit board and irradiating a laser to the printed circuit board for soldering It is characterized in that it comprises a secondary laser irradiation member.

Description

Manufacturing apparatus and manufacturing method of a rear detection sensor for a vehicle

The present invention relates to an apparatus and method for manufacturing a rear sensor for a vehicle, and to an apparatus and method for manufacturing a rear sensor for a vehicle in which a soldering process is performed on a printed circuit board using a laser.

In general, one or a plurality of rear detection sensors used in a parking assistant system (PAS) are mounted on the rear of the vehicle to detect obstacles and distances at the rear of the vehicle and notify the driver, thereby improving parking convenience to provide.

In the electronic control device applied to the rear sensor, a printed circuit board is coupled to the inside of the housing, and the soldering process for the printed circuit board is mainly using a reflow soldering method, a wave soldering method, or an iron tip. It is performed by soldering method.

The reflow soldering process is a method of melting the lead by applying heat so that the leads of the elements mounted on the printed circuit board are soldered, and heat is continuously applied above the printed circuit board during soldering.

On the other hand, the wave soldering process is a method in which the printed circuit board is first preheated and then the lead of the element inserted into the printed circuit board is soldered by filling using capillary phenomenon. Heat is not applied to the printed circuit board during soldering. .

Since the general soldering process uses a contact heating method that melts the solder wire using the heat of the high-temperature iron tip, defects caused by lead drag, solder balls, and iron wear occur frequently. There is a problem in that the process time is increased to take measures against defects. Therefore, there is a need to improve it.

Background art of the present invention is disclosed in Korean Patent Application Laid-Open No. 10-2001-0088198 (published on September 26, 2001, title of the invention: Vehicle Electronic Control Unit Assembly).

The present invention has been devised to improve the above problems, and by applying laser soldering to the manufacturing process of the rear detection sensor for a vehicle, the process speed and energy efficiency can be increased, and the quality of the rear detection sensor for a vehicle can be prevented. An object of the present invention is to provide a manufacturing apparatus and a manufacturing method.

An apparatus for manufacturing a rear detection sensor for a vehicle according to the present invention includes: a moving member for moving a measuring unit and a housing of the vehicle rear detection sensor; a primary laser irradiation member located on one side of the moving member and irradiating a laser to the housing part to solder the measuring part and the housing part; a flux application preheating member for applying flux to the printed circuit board and heating the printed circuit board while the printed circuit board of the vehicle rear sensor is seated in the housing; and a secondary laser irradiation member for reheating the printed circuit board, correcting the position, and then irradiating the laser for soldering.

In the present invention, the moving member is characterized in that it rotates in an endless track method.

In the present invention, the housing unit, a housing body having a space in which the printed circuit board is accommodated on one side, and into which a measurement lead extending from the measuring unit is inserted on the other side; and a measurement lead connection part coupled to the housing body and electrically connected to the measurement lead part.

In the present invention, the laser irradiated from the primary laser irradiation member is moved along the length direction of the measurement lead connection portion, characterized in that the heating the measurement lead connection portion.

In the present invention, the printed circuit board includes: a base on which electronic components are mounted; and a land portion provided on the base portion, surrounding the lead portion protruding from the housing portion, and plated with tin.

In the present invention, the flux sprayed from the flux application preheating member covers the land portion.

In the present invention, the land portion is characterized in that the length between the inner diameter and the outer diameter is 0.5 ~ 2.0mm.

In the present invention, the flux application preheating member is provided in the shape of a chamber surrounding the movable member, and the printed circuit board is heated while the printed circuit board is surrounded.

In the present invention, the device for manufacturing a rear sensor for a vehicle includes a blocking member for blocking the laser irradiated from the primary laser irradiating member or the secondary laser irradiating member to prevent carbonization of the housing or the printed circuit board. characterized by including.

In the method of manufacturing a rear sensor for a vehicle according to the present invention, a measuring unit of the rear sensor for a vehicle, a space in which a printed circuit board is accommodated is provided on one side, and a measurement lead extending from the measuring unit is inserted in the other side of the housing assembling a housing portion including a body and a measurement lead connecting portion coupled to the housing body and electrically connected to the measurement lead portion to be seated on a moving member; a first laser irradiation step of soldering by irradiating a laser to the measurement lead connection portion electrically coupled to the measurement lead portion; after seating the printed circuit board in the housing, applying flux to the printed circuit board and preheating to a set temperature; and a secondary laser irradiation step of reheating the printed circuit board, correcting the position, and irradiating a laser to the printed circuit board preheated to a set temperature for soldering.

Since the manufacturing apparatus and manufacturing method of the rear sensor for a vehicle according to the present invention perform a soldering process using a laser, the process time is shortened, and quality defects such as lead drag, iron wear, and carbonization can be prevented.

In addition, since the present invention performs primary soldering by irradiating a laser along the length direction of the measurement lead connection part, the solder is prevented from flowing down and the housing part is prevented from being carbonized.

In addition, in the present invention, since the flux is applied to cover the land portion, it is possible to improve the durability of the product by increasing the spreadability of the solder.

In addition, the present invention can increase the process speed and energy efficiency by setting the width of the land portion within a set range.

In addition, the present invention can prevent carbonization of the housing portion or the base portion by applying the blocking member.

1 is a perspective view schematically illustrating an apparatus for manufacturing a rear sensor for a vehicle according to an embodiment of the present invention.
2 is a perspective view illustrating a printed circuit board, a housing, and a measurement unit of a rear sensor for a vehicle according to an embodiment of the present invention.
3 is a plan view illustrating a housing part of a rear detection sensor for a vehicle according to an embodiment of the present invention.
4 is a plan view illustrating a state in which a housing part of a vehicle rear detection sensor and a printed circuit board are coupled according to an embodiment of the present invention.
5 is a perspective view illustrating a state in which the housing unit is seated on the pallet unit according to an embodiment of the present invention.
6 is a view showing a process in which the primary laser irradiation member solders the measurement lead connection part according to an embodiment of the present invention.
7 is a diagram schematically illustrating a state in which the secondary laser irradiation member is soldered according to an embodiment of the present invention.
8 is a view showing a shape of a land portion and a flux application area according to an embodiment of the present invention.
9 is a view showing the reflectance of metal according to wavelength in the apparatus for manufacturing a rear sensor for a vehicle according to an embodiment of the present invention.
10 is a photograph showing a soldering state in an apparatus for manufacturing a rear sensor for a vehicle according to an embodiment of the present invention.
11 is a flowchart schematically illustrating a method of manufacturing a rear detection sensor for a vehicle according to an embodiment of the present invention.

Hereinafter, an embodiment of a manufacturing apparatus and a manufacturing method of a rear sensor for a vehicle according to the present invention will be described with reference to the accompanying drawings. In this process, the thickness of the lines or the size of the components shown in the drawings may be exaggerated for clarity and convenience of explanation.

In addition, the terms to be described later are terms defined in consideration of functions in the present invention, which may vary according to the intention or custom of the user or operator. Therefore, definitions of these terms should be made based on the content throughout this specification.

1 is a perspective view schematically showing an apparatus for manufacturing a rear sensor for a vehicle according to an embodiment of the present invention, and FIG. 2 is a printed circuit board, a housing and a measurement part of the rear sensor for a vehicle according to an embodiment of the present invention 3 is a plan view showing a housing portion of the rear detection sensor for a vehicle according to an embodiment of the present invention, and FIG. 4 is a combination of a housing portion and a printed circuit board of the rear detection sensor for a vehicle according to an embodiment of the present invention. It is a plan view showing the state of being

1 to 4 , the apparatus 1 for manufacturing a rear detection sensor for a vehicle according to an embodiment of the present invention includes a moving member 100 , a primary laser irradiation member 200 , and a flux application preheating member 300 . ) and a secondary laser irradiation member 400 .

The moving member 100 moves the measuring unit 10 and the housing unit 30 of the vehicle rear detection sensor to predetermined positions. In the present embodiment, the moving member 100 rotates in an endless track manner. The pallet unit 70 may be applied to simultaneously move the plurality of measurement units 10 and the housing unit 30 .

5 is a perspective view showing a state in which the housing unit is seated on the pallet according to an embodiment of the present invention.

Referring to FIG. 5 , the pallet part 70 has a plurality of holes formed so that the housing part 30 can be mounted thereon, and the housing part 30 is coupled in such a way that the housing part 30 is inserted into the corresponding hole part. . In this embodiment, the pallet part 70 is formed in a plate shape, and corresponds to the shape of the pallet body 71 that is seated on the moving member 100 and moves, and the housing part 30, and is mounted on the pallet body 71. It includes a housing seating groove 73 formed to be concave.

The housing unit 30 is coupled to the measuring unit 10, the printed circuit board 50 is accommodated inside, and the printed circuit board 50 is prevented from being damaged or malfunctioning due to external impact, inflow of foreign substances, etc. . In this embodiment, the housing part 30 includes a housing body 31 and a measurement lead connection part 33 .

The housing body 31 is provided with a space part 32 in which the printed circuit board 50 is accommodated on one side, and the measurement lead part 11 extending from the measuring part 10 is inserted on the other side. In this embodiment, the housing body 31 is made of a synthetic resin material, and the space 32 is sealed by a cover or the like in a state in which the printed circuit board 50 is accommodated.

The measurement lead connection part 33 is coupled to the housing body 31 and is electrically connected to the measurement lead part 11 by soldering. In this embodiment, the measurement lead connection part 33 is made of a metal material, and is electrically connected to the measurement lead part 11 and the printed circuit board 50, so that the data measured by the measurement part 10 is a printed circuit. to be transferred to the substrate 50 .

6 is a view showing a process of soldering the primary laser irradiation member to the measurement lead connection portion according to an embodiment of the present invention.

1 and 6 , the primary laser irradiation member 200 is located on one side of the movable member 100 , and irradiates a laser to the housing part 30 , and the measurement part 10 and the housing part 30 ), specifically, the measurement lead part 11 and the measurement lead connection part 33 are soldered in a non-contact manner.

The flux application preheating member 300 applies flux to the printed circuit board 50 in a state in which the printed circuit board 50 of the vehicle rear sensor is seated on the housing unit 30 and heats it.

The printed circuit board 50 includes a base portion 51 and a land portion 53 . The base part 51 is made of a synthetic resin material, is formed in a substantially plate shape, and electronic components 55 such as resistors, transistors, and semiconductors are mounted thereon. The land part 53 is provided on the base part 51 , surrounds the lead part 34 protruding from the housing part 30 , and tin is plated on the surface.

7 is a view showing a shape of a land portion and a flux application area according to an embodiment of the present invention.

Referring to FIG. 7 , the flux sprayed from the flux application preheating member 300 is applied wider than the width of the land portion 53 to cover a portion of the land portion 53 and the base portion 51 with solder and the land portion 53 . ) to increase the binding force.

The flux sprayed from the flux application preheating member 300 has a solid content of 6 to 15%, and the land portion surrounding the lead portion 34 within a range that does not touch the housing portion 30 or the electronic component 55 . It is applied in the shape of a circle or oval with a diameter wider than the diameter of (53).

In this embodiment, the length of the land portion 53 between the inner diameter and the outer diameter (width) corresponds to 0.5 to 2.0 mm. When the width of the land part 53 is less than 0.5 mm, the laser is irradiated to the outside of the land part 53 or the hole into which the lead part 34 protruding from the housing part 30 is inserted, resulting in energy loss. and the base part 51 or the housing part 30 may be carbonized.

In addition, it is difficult to manufacture the land part 53 to satisfy the corresponding width (less than 0.5 mm), and when the cross-sectional area of laser irradiation is reduced according to the width of the land part 53, the heating rate of the land part 53 is slowed down. , there is a problem in that the soldering process speed is lowered.

In addition, when the width of the land portion 53 is greater than 2.0 mm, the cross-sectional area of the land portion 53 is wide, and the time to heat the land portion 53 above the melting temperature of the solder wire (W) is increased, and the land portion (53) The temperature of the land part 53 drops during heating, so soldering failure may occur, and there is a problem in that the area in which the electronic component 55 mounted on the printed circuit board 50 can be mounted is significantly narrowed. .

Therefore, when the width of the land portion 53 is maintained within the range of 0.5 to 2.0 mm, the efficiency of heating the land portion 53 can be improved and the process speed can be increased. The shape of the land part 53 is not only circular, but also an ellipse shape is applied depending on the distance from the electronic component 55 or the housing part 30 located around the land part 53, thereby expanding the laser irradiation area. , it is possible to increase the bonding strength with the solder.

8 is a view showing the reflectance of metal according to wavelength in the manufacturing apparatus of the rear sensor for a vehicle according to an embodiment of the present invention.

Referring to FIG. 8 , tin (Sn) is plated on the surface of the land part 53 in this embodiment. Since tin corresponds to a metal having a relatively low reflectance compared to other metals in a laser wavelength band for performing soldering, energy absorption efficiency can be improved when irradiated with a laser.

In this embodiment, the flux application preheating member 300 is provided in the shape of a chamber surrounding the movable member 100, and the printed circuit board 50 is surrounded by a heater, a blower, etc. provided inside the printed circuit board. (50) is heated.

9 is a diagram schematically illustrating a soldering state of a secondary laser irradiation member according to an embodiment of the present invention, and FIG. 10 is a soldering state in an apparatus for manufacturing a rear sensor for a vehicle according to an embodiment of the present invention It's a photo.

1, 9 and 10, the secondary laser irradiation member 400 is soldered by irradiating a laser to the printed circuit board (50). In order to accurately control the area irradiating the laser on the printed circuit board 50, before soldering using the secondary laser irradiation member 400, the housing unit 30 or printing using a positioning member (not shown) The position of the circuit board 50 is measured.

In this embodiment, the position measuring device, an optical measuring sensor for measuring the XY-axis position of the printed circuit board 50, and measuring the height of the printed circuit board 50, the head of the secondary laser irradiation member 400 It is measured using a fiber sensor mounted on the , and the measured information is transmitted to the control unit (90).

The control unit 90 determines whether the measured position falls within the set position range, and if it does not fall within the set range, moves the printed circuit board 50 to correct the position. Since the configuration for moving the printed circuit board 50 corresponds to contents that can be easily performed by a person skilled in the art, a detailed description thereof will be omitted.

In this embodiment, the primary laser irradiating member 200 is soldered in such a way that the measurement lead connection part 33 is heated by moving and irradiating a laser along the longitudinal direction of the measurement lead connection part 33 .

When the measurement lead connection part 33 is heated while the measurement lead part 11 is inserted into the measurement lead connection part 33 while moving the laser irradiation area in the longitudinal direction of the measurement lead connection part 33, the solder in a molten state As it moves toward the measurement lead part 11 , the viscosity increases and the fluidity decreases, so that it can be prevented from flowing down through the gap between the measurement lead connection parts 33 .

In addition, since the measurement lead connection part 33 is heated by a moving irradiation method, the laser reflected in the process of heating the measurement lead connection part 33 is prevented from continuously heating a partial area, and the housing part 30 and the base part (51) can be prevented from being carbonized.

In the present embodiment, the apparatus 1 for manufacturing the rear sensor for a vehicle further includes a blocking member 500 . The blocking member 500 blocks the laser irradiated from the primary laser irradiating member 200 or the secondary laser irradiating member 400 to prevent the housing 30 or the printed circuit board 50 from being carbonized.

In this embodiment, the blocking member 500 is made of a metal material, the housing 30 or the base part by the laser reflected directly from the secondary laser irradiation member 400 or through the land part 53, etc. (51) to prevent carbonization.

11 is a flowchart schematically illustrating a method of manufacturing a rear detection sensor for a vehicle according to an embodiment of the present invention. 1 and 11, the manufacturing method (S1) and the effect of the rear detection sensor for a vehicle according to an embodiment of the present invention will be described as follows.

The housing unit 30 and the measurement unit 10 temporarily assembled by an operator or an assembly robot are seated on the moving member 100 and moved. In this embodiment, the housing unit 30 is seated on the moving member 100 in a state in which a plurality of the housing units are coupled to the pallet unit 70, thereby reducing the processing time and energy required per single unit (S100).

When the position of the housing part 30, specifically, the measurement lead connection part 33 is measured by the position measuring member, soldering is performed using the primary laser irradiation member 200 . The primary laser irradiation member 200 heats the measurement lead connection part 33 while the irradiated laser moves along the longitudinal direction of the measurement lead connection part 33, so that the measurement lead connection part 33 and the measurement lead part 11) It prevents the solder from flowing down and prevents carbonization of the housing part 30 and the like (S200).

When the soldering of the measurement lead connection part 33 and the measurement lead part 11 is finished, the printed circuit board 50 is seated on the housing part 30 using a vacuum adsorption method. The printed circuit board 50 may be pressed once in the vertical direction so that it can be seated in an accurate position.

In a state in which the printed circuit board 50 is seated on the housing unit 30 , the housing unit 30 is guided to the inside of the flux application preheating member 300 . The flux application preheating member 300 applies flux so as to cover the entire land portion 53 to be soldered, and then heats the entire surface of the printed circuit board 50 using a heater, a blower, or the like.

By heating the printed circuit board 50 to a predetermined temperature, about 80 to 100 degrees Celsius, the printed circuit board 50 is damaged due to a rapid temperature rise in the soldering process, or defects such as the electronic component 55 are prevented from occurring. do (S300).

When the preheating of the printed circuit board 50 is completed, the housing unit 30 and the printed circuit board 50 are moved to the secondary laser irradiation member 400 by the moving member 100 . A blocking member 500 is mounted on the printed circuit board 50 entering the inside of the secondary laser irradiation member 400 to prevent carbonization of the housing 30 and the like. The mounting position and shape of the blocking member 500 may vary depending on the laser irradiation position and direction, the shape of the printed circuit board 50 , and the like.

Before irradiating the laser to the printed circuit board 50, the secondary laser irradiation member 400 sprays hot air on the printed circuit board 50 to raise the temperature of the printed circuit board 50 to about 90 to 110 degrees Celsius, and , and correcting the printed circuit board 50 to the set position using a position measuring member.

When the position of the printed circuit board 50 is corrected, a laser is irradiated to the printed circuit board 50 to perform non-contact soldering, and the soldered printed circuit board 50 is carried out by the moving member 100 (S400) .

In the present embodiment, the manufacturing apparatus 1 and the manufacturing method S1 of the rear sensor for a vehicle perform a soldering process using a laser, so the process time is shortened, and quality defects such as lead drag, iron wear, and carbonization are prevented. can do.

In addition, in the present embodiment, the manufacturing apparatus 1 and the manufacturing method S1 of the rear sensor for a vehicle perform primary soldering by irradiating a laser along the longitudinal direction of the measurement lead connection part 33, so that the solder flows It blocks the falling, and prevents the housing part 30 and the like from being carbonized.

In addition, in the present embodiment, in the manufacturing apparatus 1 and the manufacturing method S1 of the vehicle rear sensor, the flux is applied to cover the land part 53, so the spreadability of the solder can be increased to improve the durability of the product. , by making the width of the land part 53 within the set range, the process speed and energy efficiency can be increased.

In addition, the present invention can prevent carbonization of the housing part 30 or the base part 51 by applying the blocking member 500 .

Although the present invention has been described with reference to the embodiment shown in the drawings, this is merely an example, and it is understood that various modifications and equivalent other embodiments are possible by those of ordinary skill in the art. will understand Therefore, the technical protection scope of the present invention should be defined by the following claims.

1: Manufacturing device for vehicle rear detection sensor 10: Measuring unit
11: measurement lead part 30: housing part
31: housing body 32: space part
33: measurement lead connection part 50: printed circuit board
51: base part 53: land part
55: electronic component 70: pallet part
71: pallet body 73: housing seating groove
90: control unit 100: moving member
200: primary laser irradiation member 300: flux application preheating member
400: secondary laser irradiation member 500: blocking member
W: solder wire

Claims (10)

a moving member for moving the measuring unit and the housing unit of the rear sensing sensor for a vehicle;
a primary laser irradiation member located on one side of the moving member and irradiating a laser to the housing part to solder the measuring part and the housing part;
a flux application preheating member for applying flux to and heating the printed circuit board while the printed circuit board of the vehicle rear sensor is seated in the housing; and
a secondary laser irradiation member for reheating the printed circuit board, correcting the position, and then irradiating a laser for soldering;
including,
The housing part,
a housing body provided with a space portion accommodating the printed circuit board on one side, and into which a measurement lead portion extending from the measurement portion is inserted on the other side; and
a measurement lead connection part coupled to the housing body and electrically connected to the measurement lead part;
A device for manufacturing a rear detection sensor for a vehicle, characterized in that it comprises a.
The apparatus of claim 1, wherein the moving member rotates in an endless track method.
delete The apparatus of claim 1, wherein the laser irradiated from the primary laser irradiating member moves along a longitudinal direction of the measurement lead connection part to heat the measurement lead connection part.
According to claim 1, wherein the printed circuit board,
a base on which electronic components are mounted; and
a land portion provided on the base portion, surrounding the lead portion protruding from the housing portion, and plated with tin;
A device for manufacturing a rear detection sensor for a vehicle, characterized in that it comprises a.
The method according to claim 5, wherein the flux sprayed from the flux application preheating member comprises:
An apparatus for manufacturing a rear detection sensor for a vehicle, characterized in that it covers the land portion.
According to claim 5, The land portion,
A device for manufacturing a rear detection sensor for a vehicle, characterized in that the length between the inner diameter and the outer diameter is 0.5 ~ 2.0mm.
[Claim 8] The method according to any one of claims 1, 2, and 4 to 7, wherein the flux application preheating member comprises:
It is provided in the shape of a chamber surrounding the moving member, the manufacturing apparatus of the rear sensor for a vehicle, characterized in that the heating of the printed circuit board in a state surrounding the printed circuit board.
8. The method according to any one of claims 1, 2, 4 to 7,
Manufacturing of a rear detection sensor for a vehicle, characterized in that it further comprises; Device.
A housing body having a measuring unit for a vehicle rear detection sensor, a space in which a printed circuit board is accommodated on one side, and a measuring lead extending from the measuring unit on the other side is inserted, and the measurement lead unit coupled to the housing body and assembling a housing part including a measurement lead connection part electrically connected to and seated on the moving member;
a first laser irradiation step of soldering by irradiating a laser to the measurement lead connection portion electrically coupled to the measurement lead portion;
after the printed circuit board is seated in the housing, applying a flux to the printed circuit board and preheating to a set temperature; and
a secondary laser irradiation step of reheating the printed circuit board, correcting the position, and irradiating a laser to the printed circuit board preheated to a set temperature for soldering;
A method of manufacturing a rear detection sensor for a vehicle, characterized in that it comprises a.

Images