JPH04273454A - Bonding tool - Google Patents

Abstract

PURPOSE:To perform a stable bonding treatment by absorbing an inclination even if there is the inclination on the side of a bonding tool or on the side of a material to be bonded. CONSTITUTION:A tool-holding hole 7 is provided in a shank 1 and a tool material 3 is held in this tool-holding hole in a movable manner with respect to the shank. By the usual way towards a parallel condition with respect to the side of a tool material to be bonded which is held in a movable manner with respect to this shank, a positioning shift of a parallel degree between the both is absorbed and mitigated. Thus, a uniform pressurizing heating condition ranging over the entire area to be bonded is obtained, whereby a stable bonding treatment can be performed.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a bonding tool suitable for use in semiconductor manufacturing equipment to perform batch bonding processing such as tape automated bonding (hereinafter referred to as TAB).

0002

2. Description of the Related Art A conventional bonding tool is shown in FIG.
is a hole made in this shank 1, and is a heater hole into which a cartridge heater or the like is inserted in order to apply heat. 2 is a handle used for fixing the bonding tool to the bonder and is joined or integrated with the shank;
Reference numeral 3 denotes a tool material for applying heat and pressure to bond the semiconductor element to be bonded to the lead frame or the lead of the carrier tape. Furthermore, Figures 5 and 6
4 is for showing the operating state of the bonding tool shown in FIG. The protruding electrodes 6 are leads of a lead frame or a carrier tape.

[0003] In the bonding tool having such a structure, first, the bonding tool is fixed to the bonder, and the cartridge heater is inserted and fixed into the heater hole 1a. At this time, the temperature is monitored by a thermocouple (not shown) (inserted and fixed to the bonding tool), and maintained at a set temperature by a temperature controller. Then, after a sufficient period of time has passed after heating and the device has become thermally stable, the surface of the tool material 3 and the S of the semiconductor element are heated.
Adjust the bonding tool so that the i-board 4 and the board are parallel to each other. To check this adjustment, attach a heat-resistant adhesive tape to a gap gauge, etc. with a constant thickness, and then actually bond to it and check the indentation of the tool material 3 to see if it is pressed evenly over the entire surface. Check to see if they are in a parallel state. Once it is confirmed that they are in a parallel state, the protruding electrodes 5 and leads 6 are actually aligned and bonded using heat and pressure. It is confirmed that all pins are bonded. If they are bonded, continue bonding. . Of course, if all pins are not connected, further adjustment may be necessary. Note that the shank 1 and the tool material 3 are bonded together by a brazing material, and since the melting point of the brazing material is higher than the heating temperature of the bonding tool, the shank 1 and the tool material 3 are always fixed.

0004

[Problem to be Solved by the Invention] Since the conventional bonding tool has the above-described configuration, when attempting to bond all the pins of the protruding electrode 5 and the lead 6 for any IC size, the Si substrate 4 and the tool material It is necessary to improve the parallelism with the surface of the tool material 3, and it takes a lot of time to adjust it. Also, due to the difference in thermal expansion coefficient between the material of the shank 1 and the material of the tool material 3, when heated, the surface of the tool material will have high and low heights. As shown in FIG. 6, the protruding electrode 5 and the lead may not come into contact with each other, or conversely, the protruding electrode 5 may be crushed by the lead 6 at a lower part of the tool material 3, even within the same plane. This had the problem of causing problems with different modes. In view of these circumstances, it is an object of the present invention to provide a bonding tool that can absorb the tilt even if the bonding tool or the Si substrate side to be bonded has a tilt.

[0005]

[Means for Solving the Problems] A bonding tool according to the present invention is such that a tool holding hole is provided in a bonding shank, and the tool material is held by the tool holding hole so as to be movable up and down with respect to the shank. .

[0006]

[Operation] According to the present invention, the tool material held movably up and down with respect to the shank follows the side of the Si substrate to be bonded, and alleviates and absorbs the inclination of the tool material or the Si substrate side during bonding. However, it is possible to apply pressure and heat evenly onto the Si substrate from the surface of the tool material, thereby making it possible to perform stable bonding processing.

[0007]

[Embodiment] Figures 1 to 3 show an embodiment of the bonding tool according to the present invention, and in these figures, parts that are the same as or corresponding to those in Figure 4 and subsequent figures described above are designated by the same numbers. Explanation will be omitted. Now, according to the bonding tool according to the present invention, it has the function of holding the tool material 3 within the bonding shank 1 and the function of forming a relief part for the tool material 3 when the bonding tool pressurizes the Si substrate 4. A feature is that a tool holding hole 7 is provided, and the tool material 3 is held in a vertically movable state with respect to the shank 1 through the tool holding hole 7. According to such a configuration, the bonding tool is attached and fixed to the bonder, the cartridge heater is attached and fixed to the heater hole 1a, and the bonding tool is heated. Then, after a sufficient period of time has elapsed after heating and the device has become thermally stable, the bonding tool is adjusted so that the surface of the tool material 3 and the Si substrate 4, which is a semiconductor element, are parallel to each other. This adjustment method is the same as that of conventional bonding tools, but according to the present invention, since the tool material 3 has a degree of freedom, the surface of the shank 1 on the tool material 3 side with respect to the Si substrate 4 is completely The Si substrate 4 side may not be parallel to the shank 1 but may be inclined to some extent. That is,
The tool material 3 held by the shank 1 in a vertically movable manner moves to follow the side of the Si substrate 4 which is the side to be bonded, and as a result, the inclination on the tool material 3 or the Si substrate 4 side is alleviated. , and as shown in Figure 3,
It is possible to apply pressure and heat evenly onto the Si substrate 4 from the surface of the tool material 3. Therefore, the bonding tool according to the present invention allows stable bonding processing. Furthermore, with this configuration, there are no bonding defects due to uneven contact of the surface of the tool material 3 to the bonding target side, microcracks in the Si substrate 4 due to uneven heating or pressure, and tilting, which have been problems in the past. It became. Further, the time required for parallelizing the bonding tool and for parallelizing the Si substrate 4 can be reduced, which is effective in terms of workability.

[0008]

As explained above, according to the bonding tool according to the present invention, a tool holding hole is provided in the shank, and the tool holding hole holds the tool material so that it can move up and down with respect to the shank. Despite the simple structure, even if the parallelism between the surface of the tool material and the Si substrate, etc. to be bonded, is not completely adjusted, the vertical movement of the tool material will cause The surface of the tool material moves in accordance with the Si substrate, etc., and as a result, uniform pressure and heating can be performed on the bonding target side of the Si substrate, protruding electrodes, leads, etc., and various excellent effects such as stable bonding processing can be achieved. be. Furthermore, according to the present invention, since pressure can be applied evenly, there is no problem such as uneven contact of the surface of the tool material due to inclination, etc., and there is no adverse effect on the Si substrate etc. due to uneven pressure. This has the advantage of reducing bonding defects and improving reliability. Furthermore, according to the present invention,
It is possible to shorten the work time for parallelizing the bonding tool and the side to be bonded, and it can be effective in improving work efficiency.

[Brief explanation of the drawing]

FIG. 1 is a partial front view showing an embodiment of a bonding tool according to the present invention.

FIG. 2 is a partial cross-sectional view of FIG. 1;

FIG. 3 is a partial cross-sectional view showing the operating state of the bonding tool of FIG. 1;

FIG. 4 is a partial front view showing a conventional bonding tool.

FIG. 5 is an explanatory diagram showing the operating state of the bonding tool of FIG. 4;

FIG. 6 is an explanatory diagram showing the operating state of the bonding tool of FIG. 4;

[Explanation of symbols]

1 Shank 1a Heater hole 2 Pattern 3 Tool material 4 Silicon substrate (Si substrate) 5 Protruding electrode 6 Lead 7 Tool holding hole

Claims (1)

[Claims] Claim 1: In a bonding tool used for batch bonding processing, heating the side to be bonded,
A bonding shank having a tool material for applying pressure is provided, a tool holding hole is provided in the shank, and the tool material is held by the tool holding hole in a vertically movable state with respect to the shank. Featured bonding tools.