JPS6373966U - - Google Patents
Info
- Publication number
- JPS6373966U JPS6373966U JP16798386U JP16798386U JPS6373966U JP S6373966 U JPS6373966 U JP S6373966U JP 16798386 U JP16798386 U JP 16798386U JP 16798386 U JP16798386 U JP 16798386U JP S6373966 U JPS6373966 U JP S6373966U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- plates
- heat dissipating
- metal plate
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 229910001369 Brass Inorganic materials 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000010951 brass Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16798386U JPS6373966U (enExample) | 1986-10-31 | 1986-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16798386U JPS6373966U (enExample) | 1986-10-31 | 1986-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6373966U true JPS6373966U (enExample) | 1988-05-17 |
Family
ID=31100433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16798386U Pending JPS6373966U (enExample) | 1986-10-31 | 1986-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6373966U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4427994C2 (de) * | 1993-08-06 | 2000-10-26 | Mitsubishi Electric Corp | Metallkernsubstrat, insbesondere zur Verwendung für elektronische Schaltungen |
| JP2012004323A (ja) * | 2010-06-16 | 2012-01-05 | Nhk Spring Co Ltd | 回路基板用積層板及び金属ベース回路基板並びにそれらの製造方法 |
| JP2017100324A (ja) * | 2015-11-30 | 2017-06-08 | 東洋アルミニウム株式会社 | 積層構造体及びその製造方法 |
-
1986
- 1986-10-31 JP JP16798386U patent/JPS6373966U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4427994C2 (de) * | 1993-08-06 | 2000-10-26 | Mitsubishi Electric Corp | Metallkernsubstrat, insbesondere zur Verwendung für elektronische Schaltungen |
| JP2012004323A (ja) * | 2010-06-16 | 2012-01-05 | Nhk Spring Co Ltd | 回路基板用積層板及び金属ベース回路基板並びにそれらの製造方法 |
| JP2017100324A (ja) * | 2015-11-30 | 2017-06-08 | 東洋アルミニウム株式会社 | 積層構造体及びその製造方法 |
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