JPS6373356U - - Google Patents
Info
- Publication number
- JPS6373356U JPS6373356U JP16786286U JP16786286U JPS6373356U JP S6373356 U JPS6373356 U JP S6373356U JP 16786286 U JP16786286 U JP 16786286U JP 16786286 U JP16786286 U JP 16786286U JP S6373356 U JPS6373356 U JP S6373356U
- Authority
- JP
- Japan
- Prior art keywords
- holder
- target
- frequency sputtering
- high frequency
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図は本考案に係る高周波スパツタ装置の概
略構成図、第２図は基板ホルダーを移動可能とし
た高周波スパツタ装置の要部拡大図、第３図は従
来の高周波スパツタ装置の概略図である。
尚、図面中１はチヤンバー、４は基板ホルダー
、５は基板、８は高周波電源、９はバツキングプ
レート、１０はターゲツト、１１はターゲツト押
え、１２はカソードシールド、１３は導電部材で
ある。
Fig. 1 is a schematic diagram of a high-frequency sputtering device according to the present invention, Fig. 2 is an enlarged view of the main parts of a high-frequency sputtering device with a movable substrate holder, and Fig. 3 is a schematic diagram of a conventional high-frequency sputtering device. . In the drawings, 1 is a chamber, 4 is a substrate holder, 5 is a substrate, 8 is a high frequency power source, 9 is a backing plate, 10 is a target, 11 is a target holder, 12 is a cathode shield, and 13 is a conductive member.
Claims (1)
レートにターゲツト押えによつて保持されたター
ゲツトとをチヤンバー内にて対向配置せしめると
ともに、ターゲツト押えをカソードシールドで覆
うようにした高周波スパツタ装置において、前記
カソードシールドと基板ホルダーとは導電部材を
介して電気的に直接接続されていることを特徴と
する高周波スパツタ装置。 In a high frequency sputtering apparatus in which a substrate held by a substrate holder and a target held by a target holder on a backing plate are disposed facing each other in a chamber, and the target holder is covered with a cathode shield, the cathode shield A high frequency sputtering device characterized in that the and substrate holder are directly electrically connected via a conductive member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16786286U JPH033574Y2 (en) | 1986-10-31 | 1986-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16786286U JPH033574Y2 (en) | 1986-10-31 | 1986-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6373356U true JPS6373356U (en) | 1988-05-16 |
| JPH033574Y2 JPH033574Y2 (en) | 1991-01-30 |
Family
ID=31100195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16786286U Expired JPH033574Y2 (en) | 1986-10-31 | 1986-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033574Y2 (en) |
-
1986
- 1986-10-31 JP JP16786286U patent/JPH033574Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH033574Y2 (en) | 1991-01-30 |
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