JPS5983971U - Ion plating device - Google Patents
Ion plating deviceInfo
- Publication number
- JPS5983971U JPS5983971U JP17966782U JP17966782U JPS5983971U JP S5983971 U JPS5983971 U JP S5983971U JP 17966782 U JP17966782 U JP 17966782U JP 17966782 U JP17966782 U JP 17966782U JP S5983971 U JPS5983971 U JP S5983971U
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- ion plating
- choke coil
- evaporation source
- plating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
添付図は本考案の一実施例を示した高周波イオンブレー
ティング装置の概略図である。
1:被排気室、9A、 9B:熱電子用電極、10:
放電開始電源、11:チョークコイル、12:バイメタ
ルスイッチ。The attached figure is a schematic diagram of a high frequency ion blating device showing an embodiment of the present invention. 1: Exhaust chamber, 9A, 9B: Thermionic electrode, 10:
Discharge starting power supply, 11: Choke coil, 12: Bimetal switch.
Claims (1)
電を発生させ、蒸発源からの蒸発粒子をイオン化させる
様になした装置において、1対の電極、該電極にチョー
クコイルを介して電力を印加する為の電源、及び該電極
に流れる電流によって瞬時前記チョークコイルで発生し
た逆起電力を前記電極間に印加させる様に作動するスイ
ッチから成る放電開始装置を具備したイオンプレーティ
゛ング装置。In an apparatus that generates glow discharge between an evaporation source and a substrate placed in an evacuated chamber and ionizes evaporated particles from the evaporation source, a pair of electrodes is connected to the electrode via a choke coil. Ion plating equipped with a discharge starting device consisting of a power source for applying electric power, and a switch that operates so as to apply a back electromotive force instantaneously generated in the choke coil between the electrodes due to the current flowing through the electrodes. Device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17966782U JPS5983971U (en) | 1982-11-27 | 1982-11-27 | Ion plating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17966782U JPS5983971U (en) | 1982-11-27 | 1982-11-27 | Ion plating device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5983971U true JPS5983971U (en) | 1984-06-06 |
Family
ID=30389768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17966782U Pending JPS5983971U (en) | 1982-11-27 | 1982-11-27 | Ion plating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5983971U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01201470A (en) * | 1988-02-04 | 1989-08-14 | Shinko Seiki Kk | Ionizing device and ion plating device |
-
1982
- 1982-11-27 JP JP17966782U patent/JPS5983971U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01201470A (en) * | 1988-02-04 | 1989-08-14 | Shinko Seiki Kk | Ionizing device and ion plating device |
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