JPS6221065U - - Google Patents

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Publication number
JPS6221065U
JPS6221065U JP11208785U JP11208785U JPS6221065U JP S6221065 U JPS6221065 U JP S6221065U JP 11208785 U JP11208785 U JP 11208785U JP 11208785 U JP11208785 U JP 11208785U JP S6221065 U JPS6221065 U JP S6221065U
Authority
JP
Japan
Prior art keywords
thin films
housings
pair
target
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11208785U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11208785U priority Critical patent/JPS6221065U/ja
Publication of JPS6221065U publication Critical patent/JPS6221065U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は考案の一実施例であるスパツタリング
装置の概略を説明する構成図である。第2図は第
1図における回転板の底面図である。 10……ガラス基板(基板)、14……第一ハ
ウジング(ハウジング)、18……第二ハウジン
グ(ハウジング)、24,82……真空室、32
……回転板(ターゲット保持部材)、38,40
……ターゲツト、46,48……カソード電極、
60,62……モータ(ターゲツト駆動手段)、
76……電源装置、84……アノード電極。
FIG. 1 is a schematic diagram illustrating a sputtering apparatus as an embodiment of the invention. FIG. 2 is a bottom view of the rotating plate in FIG. 1. 10... Glass substrate (substrate), 14... First housing (housing), 18... Second housing (housing), 24, 82... Vacuum chamber, 32
... Rotating plate (target holding member), 38, 40
...Target, 46, 48...Cathode electrode,
60, 62...Motor (target driving means),
76...Power supply device, 84...Anode electrode.

Claims (1)

【実用新案登録請求の範囲】 基板の一部に複数の薄膜を多層に形成するスパ
ツタリング装置であつて、 前記基板の一部を挾んで相対向する状態で配設
され、それぞれ該基板と共に真空室を形成する一
対のハウジングと、 それら一対のハウジングのうち、前記薄膜を形
成すべき側に設けられた一方のハウジングの内部
に配設され、前記複数の薄膜を構成すべき複数の
ターゲツトを保持するターゲツト保持部材と、 該複数のターゲツトが前記基板の一部に対して
択一的に対向させられるように前記ターゲツト保
持部材を移動させるターゲツト駆動手段と、 前記ターゲツトの裏側に配設されたカソード電
極と前記一対のハウジングの他方の内部に配設さ
れたアノード電極との間に高電圧を印加する電源
装置と を有することを特徴とするスパッタリング装置。
[Claims for Utility Model Registration] A sputtering device for forming a plurality of thin films in multiple layers on a part of a substrate; a pair of housings that form a plurality of thin films, and one housing of the pair of housings that is provided on the side where the thin films are to be formed is disposed inside the housing and holds a plurality of targets that are to form the plurality of thin films. a target holding member; a target driving means for moving the target holding member so that the plurality of targets are selectively opposed to a part of the substrate; and a cathode electrode disposed on the back side of the target. and a power supply device that applies a high voltage between the anode electrode disposed inside the other of the pair of housings.
JP11208785U 1985-07-22 1985-07-22 Pending JPS6221065U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11208785U JPS6221065U (en) 1985-07-22 1985-07-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11208785U JPS6221065U (en) 1985-07-22 1985-07-22

Publications (1)

Publication Number Publication Date
JPS6221065U true JPS6221065U (en) 1987-02-07

Family

ID=30992624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11208785U Pending JPS6221065U (en) 1985-07-22 1985-07-22

Country Status (1)

Country Link
JP (1) JPS6221065U (en)

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