JPH0378057U - - Google Patents

Info

Publication number
JPH0378057U
JPH0378057U JP13817889U JP13817889U JPH0378057U JP H0378057 U JPH0378057 U JP H0378057U JP 13817889 U JP13817889 U JP 13817889U JP 13817889 U JP13817889 U JP 13817889U JP H0378057 U JPH0378057 U JP H0378057U
Authority
JP
Japan
Prior art keywords
substrate
substrates
substrate holder
holds
potential
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13817889U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13817889U priority Critical patent/JPH0378057U/ja
Publication of JPH0378057U publication Critical patent/JPH0378057U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す要部概略断面
図、第2図は従来例を示す第1図対応の断面図で
ある。 1……基板ホルダ、4……基板、8……RF電
源装置、A……放電領域。
FIG. 1 is a schematic sectional view of a main part showing an embodiment of the present invention, and FIG. 2 is a sectional view corresponding to FIG. 1 showing a conventional example. 1...Substrate holder, 4...Substrate, 8...RF power supply device, A...Discharge area.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数個の基板を保持する可動形基板ホルダを有
し、この基板ホルダの作動を通じて各基板を順次
に放電領域に臨ませることにより全ての基板に対
する逆スパツタリングを完了できるように構成さ
れたものにおいて、放電位置に配設される基板に
偏在的にRF電位を与え得るように設けたことを
特徴とするスパツタリング装置。
A movable substrate holder that holds a plurality of substrates, and is configured such that reverse sputtering for all substrates can be completed by sequentially bringing each substrate to the discharge area through operation of the substrate holder, A sputtering device characterized in that it is provided so as to be able to unevenly apply an RF potential to a substrate disposed at a discharge position.
JP13817889U 1989-11-28 1989-11-28 Pending JPH0378057U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13817889U JPH0378057U (en) 1989-11-28 1989-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13817889U JPH0378057U (en) 1989-11-28 1989-11-28

Publications (1)

Publication Number Publication Date
JPH0378057U true JPH0378057U (en) 1991-08-07

Family

ID=31685298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13817889U Pending JPH0378057U (en) 1989-11-28 1989-11-28

Country Status (1)

Country Link
JP (1) JPH0378057U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008057227A (en) * 2006-08-31 2008-03-13 Hitachi Housetec Co Ltd Bathroom unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008057227A (en) * 2006-08-31 2008-03-13 Hitachi Housetec Co Ltd Bathroom unit

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