JPS6372184A - Manufacture of single-sided through-hole printed board - Google Patents
Manufacture of single-sided through-hole printed boardInfo
- Publication number
- JPS6372184A JPS6372184A JP21572386A JP21572386A JPS6372184A JP S6372184 A JPS6372184 A JP S6372184A JP 21572386 A JP21572386 A JP 21572386A JP 21572386 A JP21572386 A JP 21572386A JP S6372184 A JPS6372184 A JP S6372184A
- Authority
- JP
- Japan
- Prior art keywords
- sided
- catalyst
- copper
- hole
- masking material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000003054 catalyst Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 230000000873 masking effect Effects 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は片面プリント基板に係り、特に部品はんだ付作
業の効率向上に有用な片面スルホールプリント基板の製
造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a single-sided printed circuit board, and more particularly to a method for manufacturing a single-sided through-hole printed circuit board useful for improving the efficiency of component soldering work.
従来の製造方法は、特公昭５５−１７５０６号公報にｂ
己載のように回路面をマスキングし、穴あけし、触媒付
与後マスキング材を剥離して回路面の触媒を除去してい
る。The conventional manufacturing method is described in Japanese Patent Publication No. 55-17506 b
As shown in the photo, the circuit surface is masked, holes are made, and after applying the catalyst, the masking material is peeled off to remove the catalyst on the circuit surface.
上記従来技術はマスキング材の剥離作業や非回路面の触
媒除去作業に多くの時間が必要であった。The above conventional technology requires a lot of time to remove the masking material and remove the catalyst from non-circuit surfaces.
本発明の目的は、非回路面の触媒除去を間単にし、片面
スルホールプリント基板を間単に製造することにある。An object of the present invention is to simplify the removal of a catalyst from a non-circuit surface and to easily manufacture a single-sided through-hole printed circuit board.
上記目的は、片面鋼張り積層板の銅箔のない面をマスキ
ング材で被覆し、尺あけ後触媒を付与しその後マスキン
グ材を剥すことＫより触媒を除去し、銅箔面に回路を形
成後ランド部を残して回路面にソルダーレジストを印刷
し、化学銅めっきすることＫよりランド部及び穴内壁に
のみ鋼を析出させることにより達成される。The above purpose is to cover the side without copper foil of a single-sided steel-clad laminate with a masking material, apply a catalyst after opening, and then peel off the masking material. This is achieved by printing a solder resist on the circuit surface leaving the land portions and then chemically plating the copper so that steel is deposited only on the land portions and the inner walls of the hole.
なお、非回路面を被膜したマスキング材を剥離するとき
に同時に触媒も除去される。Note that when the masking material covering the non-circuit surface is removed, the catalyst is also removed at the same time.
以下１本発明の一実施例を第１〜第９図により説明する
。An embodiment of the present invention will be described below with reference to FIGS. 1 to 9.
第２図において片面銅張り積層板が示しである。In FIG. 2, a single-sided copper-clad laminate is shown.
１ｑ基材で２は銅箔である。まず、マスキング材３（テ
ープ、アルカリタイプドライフィルムなどが考えられる
）を貼る（第３図）。次に穴あけ後触媒４を付与する（
第４図）。次にマスキング材６を剥す（第５図）。印刷
法又は露光法によりライン部及びランド部をエツチング
レジスト５，６により被覆する（第６図）。エツチング
を行ないランド７及びライン８を形成する（第７図）。1q is the base material and 2 is copper foil. First, apply masking material 3 (possibly tape, alkaline dry film, etc.) (Figure 3). Next, after drilling, apply catalyst 4 (
Figure 4). Next, the masking material 6 is removed (FIG. 5). The line portions and land portions are covered with etching resists 5 and 6 by a printing method or an exposure method (FIG. 6). Etching is performed to form lands 7 and lines 8 (FIG. 7).
ランド部を残してめっきレジスト兼用ソルダーレジスト
９を印刷する（第８図）。化学銅めっきを行ないランド
部及び穴内壁に銅１０を析出させる（第９図）。本実施
例によれば、非回路面の触媒を簡単に除去でき、簡単に
片面スルホールプリント基板を製造できる（第１図）。A solder resist 9 that also serves as a plating resist is printed leaving the land portion (FIG. 8). Chemical copper plating is performed to deposit copper 10 on the land portion and the inner wall of the hole (FIG. 9). According to this embodiment, the catalyst on the non-circuit surface can be easily removed, and a single-sided through-hole printed circuit board can be manufactured easily (FIG. 1).
本発明によれば簡単に非回Ｉ１１面の触媒を除去でき、
藺単に片面スルホールプリント基板が製造できる。According to the present invention, the catalyst on the non-rotating I11 surface can be easily removed,
Single-sided through-hole printed circuit boards can be manufactured easily.
第１図は本発明の一実施例の片面スルホールプリント基
板の断面図、第２〜第９図は本発明による片面スルホー
ルプリント基板の製造工程における断面図である。
２・・・銅箔
４・・・触媒
７・・・ランド
８・・・ライン、。
／−二
代咥人弁理士小 川 勝 男゛FIG. 1 is a cross-sectional view of a single-sided through-hole printed circuit board according to an embodiment of the present invention, and FIGS. 2 to 9 are cross-sectional views of the manufacturing process of the single-sided through-hole printed circuit board according to the present invention. 2...Copper foil 4...Catalyst 7...Land 8...Line. /-Katsuo Ogawa, second generation patent attorney
Claims (1)
成後ランド部を残してソルダーレジストを印刷し化学銅
めつきを行うことによりスルホールを形成するプリント
板製造プロセスにおいて、片面銅張積層板を用い銅箔の
ない面をマスキング材で被覆したのち穴あけ、触媒付与
を行ない、次にマスキング材を剥離することにより銅箔
のない面の触媒を除去したのち回路形成を行ない、そし
てランド部を残して回路面にソルダーレジストを印刷し
化学銅めつきをすることによりランド部及び穴内壁に銅
を析出させスルホールを形成することを特徴とする片面
スルホールプリント基板の製造方法。1. Single-sided copper-clad laminates are used in the printed board manufacturing process, in which through-holes are formed by drilling holes in double-sided copper-clad laminates, applying a catalyst, printing solder resist leaving land areas after circuit formation, and performing chemical copper plating. After covering the surface without copper foil with masking material using a masking material, holes are drilled and catalyst is applied.Next, the masking material is peeled off to remove the catalyst on the surface without copper foil, circuit formation is performed, and the land portion is 1. A method for producing a single-sided through-hole printed circuit board, characterized in that a solder resist is printed on the circuit surface, and copper is deposited on the land portion and the inner wall of the hole to form a through-hole by chemical copper plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21572386A JPS6372184A (en) | 1986-09-16 | 1986-09-16 | Manufacture of single-sided through-hole printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21572386A JPS6372184A (en) | 1986-09-16 | 1986-09-16 | Manufacture of single-sided through-hole printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6372184A true JPS6372184A (en) | 1988-04-01 |
Family
ID=16677113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21572386A Pending JPS6372184A (en) | 1986-09-16 | 1986-09-16 | Manufacture of single-sided through-hole printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6372184A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008143290A (en) * | 2006-12-08 | 2008-06-26 | Kenji Yamamura | Heater and vehicle |
-
1986
- 1986-09-16 JP JP21572386A patent/JPS6372184A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008143290A (en) * | 2006-12-08 | 2008-06-26 | Kenji Yamamura | Heater and vehicle |
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