JPS6372135A - Supersonic wire bonding - Google Patents

Supersonic wire bonding

Info

Publication number
JPS6372135A
JPS6372135A JP61215738A JP21573886A JPS6372135A JP S6372135 A JPS6372135 A JP S6372135A JP 61215738 A JP61215738 A JP 61215738A JP 21573886 A JP21573886 A JP 21573886A JP S6372135 A JPS6372135 A JP S6372135A
Authority
JP
Japan
Prior art keywords
wire
capillary
bonding
pellet
vibrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61215738A
Other languages
Japanese (ja)
Inventor
Toru Mita
三田　徹
Michiro Takahashi
道郎 高橋
Shinichi Arai
荒井　信一
Masakazu Ozawa
小沢　正和
Mitsukiyo Tani
光清 谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP61215738A priority Critical patent/JPS6372135A/en
Publication of JPS6372135A publication Critical patent/JPS6372135A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78743—Suction holding means
    • H01L2224/78745—Suction holding means in the upper part of the bonding apparatus, e.g. in the capillary or wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable bonding of a wire orientated in all directions, by using a flexible member to form a cavity oscillated by supersonic waves and vibrating a capillary so as to be deformed and converting the vertical vibration into the orthogonal vibration, so that the capillary is vibrated in all circumferential directions. CONSTITUTION:Against a bonding position of a pellet 19 on a frame 18 attracted by an attracting pad 15 on a table position-controlled by a controller, a supersonic oscillating device 3 is operated in a state where a capillary 9 touches the device through a wire 12, and the capillary 9 is vibrated through a horn 5 in the direction of an arrow B. A pointed end of the capillary 9 touches a pad 22 of the pellet 19 through the wire 12 and it is repeatedly deformed in the direction of an arrow C. Thus the wire 12 is vibrated by the capillary 9 aud a bonding operation is completed. Hence, using the capillary enables the vibration to be orthogonally changed in the circumferential directions and makes the wire be vibrated to perform the bonding operation, and so the wire can be connected in all directions and bonding-work hours can be shortened.

Description

【発明の詳細な説明】 〔座業上の利用分野〕 本発明は超音波ワイヤーボンディング装置に係り、特に
ボンディング位置精度向上および高速化に有効なワイヤ
ーボンディング方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of sedentary use] The present invention relates to an ultrasonic wire bonding device, and particularly to a wire bonding method effective for improving bonding position accuracy and increasing speed.

〔従来の技術〕[Conventional technology]

従来の装置は、「精密機械５１／７／１９８５　ｐ６７
〜ｐ６９」に記載のようにペレットに対して水平一定方
向にボンディングウェッジを振動させることによりて、
ワイヤーを加振し、ボンディングを行っていた。１本目
のワイヤーボンディングが完了すると、ペレットを旋回
しワイヤーボンディング位置とウェッジの振動方向を一
致させた後、次のワイヤーボンディングを行っていた。The conventional device is "Precision Machinery 51/7/1985 p67
~ By vibrating the bonding wedge in a constant direction horizontally with respect to the pellet, as described in page 69,
The wire was vibrated to perform bonding. When the first wire bonding was completed, the pellet was rotated to match the wire bonding position and the vibration direction of the wedge, and then the next wire bonding was performed.

しかし、この方法では１本のワイヤーをボンディングす
るたびにペレットを旋回させる必要があり、装置のタク
トボンディング位置相反向上の障害となっていた。However, with this method, it is necessary to rotate the pellet each time one wire is bonded, which has been an obstacle to improving the tact bonding positional reciprocity of the device.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記従来技術はボンディングウェッジが一方向しか振動
しないため、ペレットを旋回させながらボンディングを
行う必要がある。このためペレットを旋回するに要する
時間が無駄であ）、更に旋回位置決めによる誤差の増加
に伴う不良発生がボンディングの歩留シ低下を招いた。In the above conventional technology, the bonding wedge vibrates only in one direction, so it is necessary to perform bonding while rotating the pellet. For this reason, the time required to rotate the pellets was wasted), and furthermore, the occurrence of defects due to the increase in errors caused by the rotational positioning caused a decrease in the bonding yield.

本発明の目的はボンディングウェッジが円周方向に開閉
しながら振動することにより全ての方向にワイヤーをボ
ンディングできるようにすることにある。An object of the present invention is to enable bonding of wires in all directions by vibrating the bonding wedge while opening and closing in the circumferential direction.

〔問題点を解決するための手段〕[Means for solving problems]

上記目的は、超音波によって振動するキャビティーを柔
軟部材で作り、振動によって変形させ垂直方向の振動を
直角方向に変換し、円周全方向に振動させることにより
、全ての方向に向いたワイヤーをボンディングすること
が可能となる。The above purpose is to create a cavity that vibrates with ultrasonic waves using a flexible member, deform it by vibration, convert vertical vibration to right angle direction, and vibrate in all directions around the circumference, thereby bonding wires facing in all directions. It becomes possible to do so.

〔作用〕[Effect]

ワイヤーを引き出しボンディングを行う一筒状のキャビ
ティーを柔軟に変形する部材で作り、超音波発振器と振
動を伝達するホーンで構成し、一方向に振動するホーン
の先端に取付けたキャビティーが同一方向に振動する。A cylindrical cavity in which the wire is pulled out and bonded is made of a flexibly deformable material, and is composed of an ultrasonic oscillator and a horn that transmits vibrations. It vibrates.

そこで振動方向に直角に配置したベレット又はリードフ
レームにキャビティーの先端が接近することにより、ワ
イヤーをベレット又はリードフレームに押し付ける。こ
れによって、キャビィティーはフレアー状に変形しなが
ら、キャビィティーの先端は水平方向に放射状に振動し
、ワイヤーをボンディングする。このように千ヤピテイ
ーは放射状に振動するのでボンディングするワイヤーの
軸方向と無関係にボンディングすることが可能となる。Then, the tip of the cavity approaches a pellet or lead frame arranged at right angles to the vibration direction, thereby pressing the wire against the pellet or lead frame. As a result, the cavity deforms into a flared shape while the tip of the cavity vibrates radially in the horizontal direction, bonding the wire. Since the wire vibrates radially in this way, bonding can be performed regardless of the axial direction of the wire to be bonded.

〔実施列〕[Implementation row]

以下に本発明の一実施例を第１図、から第３図によシ説
明する。１はペースであり、ペース１の上面２には超音
波発振器置３がボルト４によって固定されている。５は
ホーンであり超音波発振装置３の下端部６に設けられた
ネジ穴７にホーン５に設けたオネジｓ８が締結されてい
る。An embodiment of the present invention will be described below with reference to FIGS. 1 to 3. 1 is a pace, and an ultrasonic oscillator device 3 is fixed to the top surface 2 of the pace 1 with bolts 4. Reference numeral 5 denotes a horn, and a male screw s8 provided in the horn 5 is fastened to a screw hole 7 provided in the lower end 6 of the ultrasonic oscillator 3.

ホーン５の先端には中ヤビラリ−９が接着されている。A middle hollow rally 9 is glued to the tip of the horn 5.

キャピラリー９の上方側面には、ペース１に取付けられ
回転可能なワイヤーリール１０よシワイヤークランプ１
１を介してワイヤー１２が送シ込まれる穴１３が設けら
れている。キャピラリー９内に設けられた穴１４を通し
て、ワイヤー１２が送シ出される。On the upper side of the capillary 9, there is a wire reel 10 attached to the pace 1 and rotatable, and a shear wire clamp 1.
A hole 13 is provided through which a wire 12 is fed. A wire 12 is fed out through a hole 14 provided in the capillary 9.

１５は真空吸着バットでありＸ、Ｙ、Ｚ、テープ。15 is a vacuum suction vat with X, Y, Z and tape.

ル（図示せず）に取付けられており、上下９前後左右、
の各動作を独立して行うことができる。１５の側面１６
には吸引用ホース１７が接続されておシ、真空ポンプ（
図示せず）により吸引されている。(not shown).
Each operation can be performed independently. 15 sides 16
A suction hose 17 is connected to the vacuum pump (
(not shown).

１８はフレームであり、中央に既にボンディングされた
ベレット１９がある。２０はフレーム上のリードである
。18 is a frame, and there is a beret 19 already bonded in the center. 20 is a lead on the frame.

以上の構成において、制御装置（図示せず）によって位
置決め制御されたテーブル上の吸着パット１５に吸涜さ
れたフレーム１８のベレット１９のボンティング位置に
対して、ワイヤー１２を介してギヤピラリ−９が接触し
た状態で超音波発振装置３を動作させ、ホーン５を介し
てキャピラリー９を矢印Ｂ方向に振動させる。キャピラ
リー９の先端２１はワイヤー１２を介してベレット１９
のパッド２２と接触し矢印Ｃ方向に変形を繰り返す。In the above configuration, the gear pillar 9 is connected via the wire 12 to the bonding position of the bellet 19 of the frame 18 which is sucked by the suction pad 15 on the table whose positioning is controlled by a control device (not shown). While in contact, the ultrasonic oscillator 3 is operated to vibrate the capillary 9 in the direction of arrow B via the horn 5. The tip 21 of the capillary 9 is connected to the pellet 19 via the wire 12.
It comes into contact with the pad 22 of , and is repeatedly deformed in the direction of arrow C.

これによって中ヤビラリ−９はワイヤー１２を加振し、
ボンディングが完成する。次に吸着パッド１５及びフレ
ーム１８が矢印り方向に降下しリール１０よりワイヤー
１２を引出した後、再圧上昇しながら前後左右に位置決
めすると同時に所定のリードとワイヤー１２が接触する
高さまで上昇し停止す′る。超音波発振装置５を動作さ
せ、ホーン５を介して中ヤピラリー９を矢印Ｂ方向に振
動させる。As a result, the Nakayabi Rally 9 excites the wire 12,
Bonding is completed. Next, the suction pad 15 and the frame 18 descend in the direction of the arrow, pull out the wire 12 from the reel 10, and then increase pressure again while positioning in the front, back, left and right directions, and at the same time rise to a height where the lead and wire 12 come into contact and stop. do. The ultrasonic oscillator 5 is operated to vibrate the middle pillar 9 in the direction of arrow B via the horn 5.

キャピラリー９の先端２１はワイヤー１２を介してベレ
ット１９のパッド２２と接触し矢印Ｃ方向に変形を繰り
返す。これによって午ヤビラリ−９はワイヤー１２を加
振し、ボンディングが完成する。この状態でワイヤーク
ランプ１１を動作させて、ワイヤー１２をクランプし、
矢印Ｅ方向に啓動させワイヤ−１２トポ／デイング個所
より引き切る。この時゛吸着パット１５の位置を制御し
、次のワイヤー１２の接続方向と一致する方向に引き切
る。The tip 21 of the capillary 9 contacts the pad 22 of the pellet 19 via the wire 12 and repeatedly deforms in the direction of arrow C. As a result, the wire 12 is vibrated by the wire 12, and bonding is completed. In this state, operate the wire clamp 11 to clamp the wire 12,
Rotate in the direction of arrow E and pull the wire 12 from the topo/deing point. At this time, the position of the suction pad 15 is controlled and the wire 12 is pulled in the same direction as the connection direction of the next wire 12.

上記の動作をａｂ返シ行うことによって、全てのパッド
２２とリード２０間をワイヤー１２によって１接続して
ボンディングを完了する。By repeating the above operations, all pads 22 and leads 20 are connected by wire 12, and bonding is completed.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、超音波発振器及びホーンより加えられ
た振動を変形する部材で作ったキャピラリーを用いて直
角に円周方向の振動に変換し、ワイヤーを加振しボンデ
ィングを行うため、全ての方向にワイヤーを接続するこ
とができるので、リードフレームを旋回させる必要がな
く、ボンディング作業の時間短縮が図れると共に、リー
ドフレームの旋回位置決め誤差分がキャンセルされるの
で、ボンディング位置精度の向上が図れる等の効果があ
る。According to the present invention, vibrations applied by an ultrasonic oscillator and a horn are converted into vibrations in the circumferential direction at right angles using a capillary made of a deformable member, and the wires are vibrated and bonded. Since wires can be connected in the same direction, there is no need to rotate the lead frame, which reduces bonding work time. At the same time, lead frame rotation positioning errors are canceled, improving bonding position accuracy. There is an effect.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例の超音波ワイヤーボングーの
ヘッド部分図、第２図は中ヤピラリー及びベレットの平
面図、第５図はボンディング中のリードフレームの断面
図である。 １・・・ペース　　　　　　　２・・・上面３・・・超
音波発振装置　　　４・・・ボルト５・・・ホーン　　
　　　　　６・・・下端部７・・・ネジ穴　　　　　　
　８由オネジ部９・・・キャビ２＋３−　　　　１０・
・・リール１１・・・クランプ　　　　　　１２・・・
ワイヤー１３・・・穴　　　　　　　　　１４・・・穴
１５・・・吸着パット１６・・・側面 １７・・・ホース　　　　　　　１８・・・フレーム１
９・・・ベレット　　　　　　　２０・・・リート２１
・・・先端　　　　　　　　２２・・・パッド。 ″で＼、FIG. 1 is a partial view of the head of an ultrasonic wire bong according to an embodiment of the present invention, FIG. 2 is a plan view of the middle pillar and pellet, and FIG. 5 is a sectional view of the lead frame during bonding. 1...Pace 2...Top surface 3...Ultrasonic oscillator 4...Bolt 5...Horn
6...Lower end 7...Screw hole
8 Male screw part 9...cabin 2+3- 10・
...Reel 11...Clamp 12...
Wire 13... Hole 14... Hole 15... Suction pad 16... Side 17... Hose 18... Frame 1
9... Beret 20... Liet 21
...Tip 22...Pad. "in\,

Claims (1)

【特許請求の範囲】[Claims] １、超音波発振器と振動伝達するホーンとワイヤーを加
振するキヤピラリーより成る超音波ワイヤーボンディン
グ装置において、キヤピラリーに変形する部材を用いて
振動、加圧によつて変形することを利用して、ペレット
に対して垂直方向に振動するキヤピラリーの先端をフレ
アー状に円周方向に変形させ、ペレットに対し水平方向
の振動に変換し、ワイヤーをボンデイングすること、お
よびワイヤー引き切り方向を次に接続するワイヤーの方
向が一致するよう制御することを特徴とする超音波ワイ
ヤーボンディング方法。1. In an ultrasonic wire bonding device consisting of an ultrasonic oscillator, a horn that transmits vibrations, and a capillary that excites the wire, the capillary is made of a deformable member that deforms due to vibration and pressure. The tip of the capillary, which vibrates perpendicularly to the pellet, is deformed in the circumferential direction into a flared shape, converting it into vibration in the horizontal direction to the pellet, bonding the wire, and changing the wire cutting direction to the next wire. An ultrasonic wire bonding method characterized by controlling the directions of the wires to match.
JP61215738A 1986-09-16 1986-09-16 Supersonic wire bonding Pending JPS6372135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61215738A JPS6372135A (en) 1986-09-16 1986-09-16 Supersonic wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61215738A JPS6372135A (en) 1986-09-16 1986-09-16 Supersonic wire bonding

Publications (1)

Publication Number Publication Date
JPS6372135A true JPS6372135A (en) 1988-04-01

Family

ID=16677377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61215738A Pending JPS6372135A (en) 1986-09-16 1986-09-16 Supersonic wire bonding

Country Status (1)

Country Link
JP (1) JPS6372135A (en)

Similar Documents

Publication Publication Date Title
US4789095A (en) Method of controlling a wire bonding apparatus
US5494207A (en) Wire bonder transducer arrangement and method
JPS6372135A (en) Supersonic wire bonding
US5223063A (en) Method for bonding semiconductor elements to a tab tape
JPS59208844A (en) Face-down bonder
JP3351303B2 (en) Method of bonding electronic components with bumps
JPS62156828A (en) Wire bonding device
JPS63293844A (en) Wire bonding head
CN218414504U (en) Mini-LED multi-head die bonder
JPS5919463B2 (en) wire bonding method
JP2998195B2 (en) Bump bonding apparatus and bump bonding method
JP3221191B2 (en) Bonding apparatus and bonding method
JPH0153508B2 (en)
JPS6173343A (en) Wire bonding device
JP2940259B2 (en) Bonding method
JPH0228339A (en) Method and apparatus for wire bonding
KR100384398B1 (en) Bonder head of apparatus for bonding wire
JPH04184948A (en) Supporting base of wire-bonding substrate
JPH1056034A (en) Bonding device
JP2682701B2 (en) Scrub method and apparatus
JP2586679B2 (en) Wire bonding method
JPH08111428A (en) Die bonder
JPS63141327A (en) Fine wire feeder for bonder
JP2000340601A (en) Wire bonding equipment
JPS5921167B2 (en) Ultrasonic wire bonding equipment