JPS6173343A - Wire bonding device - Google Patents
Wire bonding deviceInfo
- Publication number
- JPS6173343A JPS6173343A JP59194662A JP19466284A JPS6173343A JP S6173343 A JPS6173343 A JP S6173343A JP 59194662 A JP59194662 A JP 59194662A JP 19466284 A JP19466284 A JP 19466284A JP S6173343 A JPS6173343 A JP S6173343A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bonding
- hole
- wire
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78743—Suction holding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、ワイヤボンダに関し半導体装置の製造工程の
信鯨性を向上させる技術に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a technique for improving the reliability of a semiconductor device manufacturing process with respect to a wire bonder.
リードフレームを用いて製造される半導体装置、たとえ
ばエボキン樹脂等でパッケージがモールド形成される樹
脂封止半導体装置は、パッケージ形成前にリードフレー
ムのペレット取（を部にペレットを取り付ける作業、さ
らに該ペレットとリード内端部との電気的接続のための
ワイヤボンディング作業等の組立作業が行われる。Semiconductor devices manufactured using lead frames, such as resin-sealed semiconductor devices whose packages are molded with Evokin resin, require a process to attach pellets to the lead frame before forming the package. Assembly work such as wire bonding work for electrical connection between the lead and the inner end of the lead is performed.
前記ワイヤボンディング作業は、通常ベレット取り付け
が完了したリードフレームをフェイスアップ状態でワイ
ヤボンダのボンディングステージ上に載置し、内部リー
ド部を押さえ治具で固定して金またはアルミニウムワイ
ヤ等を用いて行われる。The wire bonding work is usually performed by placing the lead frame with the pellet attached on the bonding stage of a wire bonder in a face-up state, fixing the internal lead part with a holding jig, and using gold or aluminum wire, etc. .
このワイヤボンディング作業において、特にリード内端
部とワイヤとの接続は、超音波振動を加えて行うか、ま
たは、超音波振動を加えながら鎮圧着することが考えら
れる。そのため、リードフレームの内部リード部を確実
に固定することが必要とされる。In this wire bonding work, the connection between the inner end of the lead and the wire may be performed by applying ultrasonic vibration, or by applying pressure while applying ultrasonic vibration. Therefore, it is necessary to securely fix the internal lead portion of the lead frame.
ところが、半導体装置の高集積化に伴いリートの数が増
えるとともにリードが細くなる。それにしたがい、リー
ドが曲がり易くなり、該リードを治具で押さえ付けるだ
けでは、リード先端部がボンディングステージから浮き
上がる等により、確実に固定することが難しくなること
が本発明者により見い出された。However, as semiconductor devices become more highly integrated, the number of leads increases and the leads become thinner. Accordingly, the present inventors have found that the leads tend to bend, and that simply pressing the leads with a jig makes it difficult to securely fix the leads because the leading ends of the leads lift off from the bonding stage.
なお、ワイヤボンダについては工業調査会発行の「電子
材料」、■９８３年３月号、ｐＨ３〜ＰＩ １７に説明
されている。The wire bonder is explained in "Electronic Materials" published by Kogyo Kenkyukai, March 1983 issue, pH 3 to PI 17.
本発明の目的は、ワイヤボンダに関し、その作業性向上
に通用して有効な技術を提供することにある。An object of the present invention is to provide a generally effective technique for improving the workability of a wire bonder.
本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述および添付図面から明らかになるであろう
。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.
本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、次の通りである。A brief overview of typical inventions disclosed in this application is as follows.
すなわち、ワイヤボンダのボンディングステージについ
て、載置されるリードフレームのボンディングエリア近
傍の下方に位置する該ステージ部に開口部を有し、かつ
減圧装置に連通ずるスルーホールを形成することにより
、スルーホールからの吸収力でリード先端部を確実に固
定でき、ワイヤボンディングの作業性の向上を達成する
ものである。That is, the bonding stage of the wire bonder has an opening in the stage portion located below the bonding area of the lead frame to be mounted, and by forming a through hole that communicates with the pressure reducing device, it is possible to remove the wire from the through hole. The absorbing force of the wire securely fixes the lead tip and improves the workability of wire bonding.
（実施例）
第１図は、本発明による一実施例であるワイヤボンダの
特徴であるボンディングステージを、その部品断面図で
示すものである。(Embodiment) FIG. 1 is a sectional view of a bonding stage, which is a feature of a wire bonder according to an embodiment of the present invention.
第２図は、本実施例のワイヤボンダの概略を、その正面
図で示すものである。FIG. 2 schematically shows the wire bonder of this embodiment in a front view.
本実施例のワイヤボンダは、ボンディングステージｌと
ボンディング機構部を搭載してなるＸＹテーブル２を備
えてなるものである。The wire bonder of this embodiment includes an XY table 2 on which a bonding stage 1 and a bonding mechanism are mounted.
ＸＹテーブル２上には、ボンディングヘッド３が立設さ
れ、該へラド３にはアーム４が軸支され、該アーム４は
その端部でばね５により上向きに係止され、またその中
央部でカム６に係合している。A bonding head 3 is erected on the XY table 2, and an arm 4 is pivotally supported on the head 3. The arm 4 is fixed upward by a spring 5 at its end, and is fixed upward at its center. It is engaged with cam 6.
カム６は駆動モータ７により回転運動を与えられ、その
結果アーム４に上下動を与える。The cam 6 is given rotational motion by the drive motor 7, and as a result gives the arm 4 a vertical motion.
アーム４の左端には、振動子８が取り付けられた超音波
工ぶルギ伝達部材（ホーン）９が連結され、該振動子８
は、超音波発振器１０に電気的に接続されている。An ultrasonic transmission member (horn) 9 to which a vibrator 8 is attached is connected to the left end of the arm 4.
is electrically connected to the ultrasonic oscillator 10.
前記ホーン９は、先端にボンディングツールであるキャ
ピラリ１１をほぼ垂直に取り付けた状態でほぼ水平に支
持されている。キャピラリ１１にはスプール１２に巻装
されているワイヤ１３がクランパ１４を経て挿通されて
いる。The horn 9 is supported substantially horizontally with a capillary 11, which is a bonding tool, attached substantially vertically to its tip. A wire 13 wound around a spool 12 is inserted through the capillary 11 via a clamper 14.
なお、ＸＹテーブル２、駆動モータ７、超音波発Ｓ器１
０は、それぞれ電気：し制御部Ｉ５と電気的に接続され
コントロールされている。また、ボンディングステージ
ｌには押さえ治具１６が備えられている。In addition, the XY table 2, drive motor 7, ultrasonic generator 1
0 are electrically connected to and controlled by the control unit I5, respectively. Further, the bonding stage l is equipped with a holding jig 16.
本実施例の特徴は、第１図に示す如くボンディングステ
ージｌの所定位置に減圧装置に連通されているスルーホ
ール１７が形成されていることにある。The feature of this embodiment is that, as shown in FIG. 1, a through hole 17 is formed at a predetermined position of the bonding stage l and communicates with a pressure reducing device.
すなわち、ボンディングステージｌ上に載置するリード
１８のボンディングエリア近傍下に前記スルーホール開
口部を位置せしめ、該リード１８を押さえ治具１６で８
１械的に固定すると当時に、該リード１８先端部を図中
矢印方向の吸引力により該ボンディングステージ上面に
吸引固定を行うものである。 。That is, the through-hole opening is positioned under the vicinity of the bonding area of the lead 18 placed on the bonding stage l, and the lead 18 is held down by the jig 16.
Once mechanically fixed, the leading end of the lead 18 is suctioned and fixed to the upper surface of the bonding stage by a suction force in the direction of the arrow in the figure. .
前記の如く、本実施例のワイヤボンダを使用することに
より、ボンディングステージ１上にり−ド１８の先端部
を確実に固定することが可能となるため、リード１８巾
の狭いリードフレームを用いる場合であっても、予め取
り付けられているペレット１９と該リード１８のボンデ
ィングエリアとの電気的接続を金等のワイヤ１３ａｔ’
＆電実に達成することができるものである。As mentioned above, by using the wire bonder of this embodiment, it is possible to reliably fix the tip of the lead 18 on the bonding stage 1, so it is possible to securely fix the tip of the lead 18 on the bonding stage 1. Even if there is a wire 13at' made of gold or the like, electrical connection between the pellet 19 attached in advance and the bonding area of the lead 18 is made.
& Dentsu is what can be achieved.
ｔｌ＋、ワイヤボンダのボンディングステージにおいて
、載置するリードフレームのリード内端部近傍下の位置
に開口部を有し、がっ減圧装置に連通してなるスルーホ
ールを形成することより、咳スルーホールの吸引力によ
りリード内情部を前ステージＥ面に確実に固定すること
ができるので、精密かつ確実なワイヤボンディングが可
能となる。tl+, in the bonding stage of the wire bonder, by forming a through hole that has an opening near and below the inner end of the lead of the lead frame to be mounted, and that communicates with the pressure reducing device, the through hole is Since the lead inner part can be securely fixed to the front stage E surface by the suction force, precise and reliable wire bonding is possible.
（２）、前記（１）により、リード巾が狭いために変形
し易いリードであっても、リード内端部の浮き上がりを
防止して固定できるので、精確かつ確実なワイヤポンデ
ィングが可能となる。(2) Due to (1) above, even if the lead is easily deformed due to its narrow lead width, the inner end of the lead can be fixed without lifting up, making it possible to perform accurate and reliable wire bonding. .
（３）、前記ｆｉ＋に示す如く、リード内端部を確実に
固定することができることにより、超音波振動をエネル
ギ源として使用する、または併用するワイヤボンディン
グに適用して特に有効である。(3) As shown in fi+ above, since the inner end of the lead can be securely fixed, it is particularly effective when applied to wire bonding that uses ultrasonic vibration as an energy source or in combination with it.
（４）、前記（１）〜（３）により、ワイヤボンディン
グ作業の能率向上を達成できる。(4) According to (1) to (3) above, it is possible to improve the efficiency of wire bonding work.
（５）、前記（１）〜（３）により、信頼性の高いワイ
ヤボンディングが達成できる。(5) Highly reliable wire bonding can be achieved by the above (1) to (3).
（６）、前記（５）により、信頼性の高い半導体装置を
提（共することができる。(6) According to (5) above, a highly reliable semiconductor device can be provided.
（７）、前記（５）により、半導体装置の歩留り向上を
達成できる。(7) According to (5) above, it is possible to improve the yield of semiconductor devices.
以上本発明者によってなされた発明を実施例に基づき具
体的に説明したが、本発明は前記実施例に限定されるも
のではなく、その要旨を逸脱しない範囲で種々変更可能
であることはいうまでもない。Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.
たとえば、装置の概略を第２図に示したが、これに限る
ものでなく、基本的措が共通するワイヤボンダであれば
如何なるものであっても良いこととはいうまでもない。For example, although the outline of the apparatus is shown in FIG. 2, the apparatus is not limited to this, and it goes without saying that any wire bonder having the same basic features may be used.
図面のｆｉ！Ｉ車な説明
第１図は、本発明による一実施例であるワイヤボンダの
ボンディングステージを、その使用７Ｂ ４ｐを含めて
示す部分断面図。Fi of the drawing! 1 is a partial cross-sectional view showing a bonding stage of a wire bonder according to an embodiment of the present invention, including its use 7B 4p.
第２図は、本実施例のワイヤボンダの概略を示す正面図
である。FIG. 2 is a front view schematically showing the wire bonder of this embodiment.
１・・・ボンディングステージ、２・・・ＸＹテーブル
、３・・・ボンディングヘッド、４・・・アーム、５・
・・ばね、６・・・カム、７・・・駆動モータ、８・・
振動子、９・・・ホーン、１０・・・超音波発振器、
１１・ ・キャピラリ、１２・・・スプール、１３．１
３ａ・・・ワイヤ、１４・・・クランパ、１５・・・電
気制御部、１６・・・押さえ治具、【７・・・スルーホ
ール、１日・・・リード、１９・ ・・ペレット。1... Bonding stage, 2... XY table, 3... Bonding head, 4... Arm, 5...
...Spring, 6...Cam, 7...Drive motor, 8...
Vibrator, 9... horn, 10... ultrasonic oscillator,
11. Capillary, 12... Spool, 13.1
3a... wire, 14... clamper, 15... electrical control section, 16... holding jig, [7... through hole, 1st... lead, 19... pellet.
第 １ 図 第 ２ 図Figure 1 Figure 2
Claims (1)
通するスルーホールが形成されているボンディングステ
ージを備えてなるワイヤボンダ。 ２、スルーホールが、載置されるリードフレームのリー
ド内端部近傍の下方位置に、その開口部を有して形成さ
れていることを特徴とする特許請求の範囲第１項記載の
ワイヤボンダ。 ３、ワイヤボンダが超音波をエネルギー源とすることを
特徴とする特許請求の範囲第１項または第２項記載のワ
イヤボンダ。[Claims] 1. A wire bonder comprising a bonding stage having an opening at a predetermined position on its upper surface and a through hole communicating with a pressure reducing device. 2. The wire bonder according to claim 1, wherein the through hole is formed with an opening at a lower position near the inner end of the lead of the lead frame on which it is placed. 3. The wire bonder according to claim 1 or 2, characterized in that the wire bonder uses ultrasonic waves as an energy source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59194662A JPS6173343A (en) | 1984-09-19 | 1984-09-19 | Wire bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59194662A JPS6173343A (en) | 1984-09-19 | 1984-09-19 | Wire bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6173343A true JPS6173343A (en) | 1986-04-15 |
Family
ID=16328226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59194662A Pending JPS6173343A (en) | 1984-09-19 | 1984-09-19 | Wire bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6173343A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01179336A (en) * | 1987-12-30 | 1989-07-17 | Sanken Electric Co Ltd | Wire bonding |
| JPH02244646A (en) * | 1987-04-29 | 1990-09-28 | Lsi Logic Corp | Method and device for bonding lead wire of integrated circuit device |
| JPH03206632A (en) * | 1990-01-08 | 1991-09-10 | Matsushita Electric Ind Co Ltd | Wire bonding apparatus |
-
1984
- 1984-09-19 JP JP59194662A patent/JPS6173343A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02244646A (en) * | 1987-04-29 | 1990-09-28 | Lsi Logic Corp | Method and device for bonding lead wire of integrated circuit device |
| JPH01179336A (en) * | 1987-12-30 | 1989-07-17 | Sanken Electric Co Ltd | Wire bonding |
| JPH0573343B2 (en) * | 1987-12-30 | 1993-10-14 | Sanken Electric Co Ltd | |
| JPH03206632A (en) * | 1990-01-08 | 1991-09-10 | Matsushita Electric Ind Co Ltd | Wire bonding apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4860128B2 (en) | Wire bonding method | |
| JPS61125062A (en) | Method and device for attaching pin | |
| KR100271995B1 (en) | An improved lead frame clamp for ultrasonic bonding | |
| JPS6173343A (en) | Wire bonding device | |
| US10692835B2 (en) | Ball bond attachment for a semiconductor die | |
| KR102411252B1 (en) | wire bonding device | |
| KR100413477B1 (en) | Bonderhead for Wire Bonder | |
| JPH11111750A (en) | Semiconductor device | |
| US6258621B1 (en) | Method of fabricating a semiconductor device having insulating tape interposed between chip and chip support | |
| JP2954109B2 (en) | Semiconductor device and manufacturing method thereof | |
| US20240290746A1 (en) | Ball bonding for semiconductor devices | |
| JPH06151525A (en) | Wire bonding apparatus | |
| JP3991649B2 (en) | Semiconductor device manufacturing method and semiconductor device | |
| KR200169834Y1 (en) | Semiconductor package | |
| KR200202058Y1 (en) | lead frame for small die pad package and heater block for a dsorbing the same | |
| JPS61189652A (en) | Semiconductor device | |
| JP3172471B2 (en) | Method for manufacturing semiconductor device | |
| JPH088285A (en) | Semiconductor device | |
| JP2000012598A (en) | Capillary, wire bonding method and apparatus using the same, and manufacture thereof | |
| JPS62156828A (en) | Wire bonding device | |
| KR19990026924A (en) | Capillary Structure | |
| KR200161954Y1 (en) | Package having bump | |
| JPH0621164A (en) | Ic wire bonder | |
| JPS58148432A (en) | Wire bonding | |
| JPH01315152A (en) | Ultrasonic wire bonding |