JPS6370585U - - Google Patents
Info
- Publication number
- JPS6370585U JPS6370585U JP16462586U JP16462586U JPS6370585U JP S6370585 U JPS6370585 U JP S6370585U JP 16462586 U JP16462586 U JP 16462586U JP 16462586 U JP16462586 U JP 16462586U JP S6370585 U JPS6370585 U JP S6370585U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- region
- thermocompression bonding
- bonding sheet
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002788 crimping Methods 0.000 claims 1
- 230000007704 transition Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
第１図は、本考案の基本構成図、第２図は、本
考案の適用されるＬＣＤモジユールの斜視図、第
３図は、従来の熱圧着シートの接続部の平面図、
第４図は、従来の熱圧着シートの問題点を指摘す
るための説明図である。
１，２１…配線パターン、２，１１…被着体、
３…熱圧着シートの本体、４，１４，２４…導電
パターン、５，２５，２５′…熱圧着領域、１２
，３３…熱圧着シート、２０…ＬＣＤ、３０…制
御回路基板。
FIG. 1 is a basic configuration diagram of the present invention, FIG. 2 is a perspective view of an LCD module to which the present invention is applied, and FIG. 3 is a plan view of a connection part of a conventional thermocompression bonding sheet.
FIG. 4 is an explanatory diagram for pointing out problems with conventional thermocompression sheets. 1, 21... Wiring pattern, 2, 11... Adherent,
3... Body of thermocompression bonding sheet, 4, 14, 24... Conductive pattern, 5, 25, 25'... Thermocompression bonding area, 12
, 33... thermocompression bonding sheet, 20... LCD, 30... control circuit board.
Claims (1)
の本体３端部を熱圧着して、前記配線パターン１
と本体３の一面に形成される導電パターン４とを
電気的に接続するようにした熱圧着シートにおい
て、 本体３の熱圧着領域５を本体３の他の領域６よ
り幅広に形成すると共に、 熱圧着領域５の縁部７から前記他の領域６の縁
部８への移行部９を曲線形状としたことを特徴と
する熱圧着シートの接続部形状。[Claims for Utility Model Registration] The ends of the main body 3 are thermocompression bonded to the adherend 2 on which the wiring pattern 1 is formed, and the wiring pattern 1 is
In the thermocompression bonding sheet that electrically connects the conductive pattern 4 formed on one surface of the main body 3, the thermocompression bonding region 5 of the main body 3 is formed wider than the other region 6 of the main body 3, and A connecting portion shape of a thermocompression bonding sheet, characterized in that a transition portion 9 from an edge 7 of a crimping region 5 to an edge 8 of the other region 6 is curved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16462586U JPS6370585U (en) | 1986-10-27 | 1986-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16462586U JPS6370585U (en) | 1986-10-27 | 1986-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6370585U true JPS6370585U (en) | 1988-05-12 |
Family
ID=31093914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16462586U Pending JPS6370585U (en) | 1986-10-27 | 1986-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6370585U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0317660U (en) * | 1989-06-30 | 1991-02-21 | ||
| WO1998043227A1 (en) * | 1997-03-24 | 1998-10-01 | Seiko Epson Corporation | Wiring board, and display device and electronic equipment using the same |
-
1986
- 1986-10-27 JP JP16462586U patent/JPS6370585U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0317660U (en) * | 1989-06-30 | 1991-02-21 | ||
| WO1998043227A1 (en) * | 1997-03-24 | 1998-10-01 | Seiko Epson Corporation | Wiring board, and display device and electronic equipment using the same |