JPS637027B2 - - Google Patents
Info
- Publication number
- JPS637027B2 JPS637027B2 JP57172660A JP17266082A JPS637027B2 JP S637027 B2 JPS637027 B2 JP S637027B2 JP 57172660 A JP57172660 A JP 57172660A JP 17266082 A JP17266082 A JP 17266082A JP S637027 B2 JPS637027 B2 JP S637027B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- lead rod
- recess
- manufacturing
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17266082A JPS5961952A (ja) | 1982-09-30 | 1982-09-30 | 半導体用部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17266082A JPS5961952A (ja) | 1982-09-30 | 1982-09-30 | 半導体用部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5961952A JPS5961952A (ja) | 1984-04-09 |
| JPS637027B2 true JPS637027B2 (enrdf_load_stackoverflow) | 1988-02-15 |
Family
ID=15946010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17266082A Granted JPS5961952A (ja) | 1982-09-30 | 1982-09-30 | 半導体用部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5961952A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1441232A3 (en) * | 1994-11-15 | 2009-11-04 | FormFactor, Inc. | Method for connecting electronic components |
| JP3058919B2 (ja) * | 1995-05-26 | 2000-07-04 | フォームファクター，インコーポレイテッド | 犠牲基板を用いた相互接続部及び先端の製造 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5756530Y2 (enrdf_load_stackoverflow) * | 1977-07-14 | 1982-12-04 | ||
| JPS5550647A (en) * | 1978-10-03 | 1980-04-12 | Aaru Jii Toomasu Corp | Semiconductor member and method of assembling same |
-
1982
- 1982-09-30 JP JP17266082A patent/JPS5961952A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5961952A (ja) | 1984-04-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4857411A (en) | Composite body and method of manufacturing the same | |
| JPS637027B2 (enrdf_load_stackoverflow) | ||
| US4706383A (en) | Electrical contact assembly with composite contact construction | |
| US3893226A (en) | Method of making semi-conductor mounts | |
| US3970235A (en) | Method of anchoring metallic coated leads to ceramic bodies and lead-ceramic bodies formed thereby | |
| US4254548A (en) | Method of fabricating electrode plate for supporting semiconductor device | |
| JPS637028B2 (enrdf_load_stackoverflow) | ||
| KR102633361B1 (ko) | 복합 구조를 가지는 리벳형 접점구 | |
| JP2696395B2 (ja) | 電極の製造方法 | |
| US3214651A (en) | Semiconductor device base electrode assembly and process for producing the same | |
| US3768342A (en) | Connecting metal elements and products thereof | |
| JPS5993803A (ja) | 複合焼結鍛造方法 | |
| JP3346372B2 (ja) | ランプ用傾斜機能材料製封止部材 | |
| US3612940A (en) | Lamp filament structure | |
| JPS622771Y2 (enrdf_load_stackoverflow) | ||
| JP3774241B2 (ja) | 電子部品用セラミック体の製造方法 | |
| JPH0230131B2 (enrdf_load_stackoverflow) | ||
| JPH06104027A (ja) | 圧着用スリーブ材および接続体 | |
| JP2987740B2 (ja) | ろう付け用リング | |
| JPS60218861A (ja) | セラミツクスレイヤ−パツケ−ジ用端子 | |
| CA1278709C (en) | Method for producing a tungsten carbide tip punch | |
| JPS63207076A (ja) | 端子の製造方法 | |
| JPS6391986A (ja) | 端子の製造方法および端子 | |
| JPS6220645B2 (enrdf_load_stackoverflow) | ||
| JPS6216551B2 (enrdf_load_stackoverflow) |