JPS5961952A - 半導体用部品の製造方法 - Google Patents
半導体用部品の製造方法Info
- Publication number
- JPS5961952A JPS5961952A JP17266082A JP17266082A JPS5961952A JP S5961952 A JPS5961952 A JP S5961952A JP 17266082 A JP17266082 A JP 17266082A JP 17266082 A JP17266082 A JP 17266082A JP S5961952 A JPS5961952 A JP S5961952A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- recession
- nickel
- lead rod
- lead bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 7
- 238000002844 melting Methods 0.000 claims abstract description 7
- 239000002344 surface layer Substances 0.000 claims abstract description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 230000008018 melting Effects 0.000 abstract description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 229910052750 molybdenum Inorganic materials 0.000 abstract description 4
- 239000011733 molybdenum Substances 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052721 tungsten Inorganic materials 0.000 abstract description 3
- 239000010937 tungsten Substances 0.000 abstract description 3
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000007789 gas Substances 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- 241000237858 Gastropoda Species 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17266082A JPS5961952A (ja) | 1982-09-30 | 1982-09-30 | 半導体用部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17266082A JPS5961952A (ja) | 1982-09-30 | 1982-09-30 | 半導体用部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5961952A true JPS5961952A (ja) | 1984-04-09 |
| JPS637027B2 JPS637027B2 (enrdf_load_stackoverflow) | 1988-02-15 |
Family
ID=15946010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17266082A Granted JPS5961952A (ja) | 1982-09-30 | 1982-09-30 | 半導体用部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5961952A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0792463A4 (en) * | 1994-11-15 | 1998-06-24 | Formfactor Inc | ASSEMBLY OF SPRING ELEMENTS ON SEMICONDUCTOR COMPONENTS AND WAFERTEST PROCEDURE |
| EP0859686A4 (en) * | 1995-05-26 | 1998-11-11 | Formfactor Inc | PRODUCTION OF CONNECTIONS AND FITTINGS WITH THE USE OF SACRED SUBSTRATE |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5420666U (enrdf_load_stackoverflow) * | 1977-07-14 | 1979-02-09 | ||
| JPS5550647A (en) * | 1978-10-03 | 1980-04-12 | Aaru Jii Toomasu Corp | Semiconductor member and method of assembling same |
-
1982
- 1982-09-30 JP JP17266082A patent/JPS5961952A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5420666U (enrdf_load_stackoverflow) * | 1977-07-14 | 1979-02-09 | ||
| JPS5550647A (en) * | 1978-10-03 | 1980-04-12 | Aaru Jii Toomasu Corp | Semiconductor member and method of assembling same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0792463A4 (en) * | 1994-11-15 | 1998-06-24 | Formfactor Inc | ASSEMBLY OF SPRING ELEMENTS ON SEMICONDUCTOR COMPONENTS AND WAFERTEST PROCEDURE |
| EP0859686A4 (en) * | 1995-05-26 | 1998-11-11 | Formfactor Inc | PRODUCTION OF CONNECTIONS AND FITTINGS WITH THE USE OF SACRED SUBSTRATE |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS637027B2 (enrdf_load_stackoverflow) | 1988-02-15 |
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