JPS6362746A - Preparation of thermal head - Google Patents
Preparation of thermal headInfo
- Publication number
- JPS6362746A JPS6362746A JP20893086A JP20893086A JPS6362746A JP S6362746 A JPS6362746 A JP S6362746A JP 20893086 A JP20893086 A JP 20893086A JP 20893086 A JP20893086 A JP 20893086A JP S6362746 A JPS6362746 A JP S6362746A
- Authority
- JP
- Japan
- Prior art keywords
- lead conductor
- layer
- conductor layer
- lead
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 85
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 abstract description 16
- 239000007769 metal material Substances 0.000 abstract description 7
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 5
- 238000007639 printing Methods 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 238000009825 accumulation Methods 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- -1 for example Inorganic materials 0.000 abstract 1
- 239000010408 film Substances 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 2
- 238000005338 heat storage Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 210000001015 abdomen Anatomy 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
この発明は、サーマルプリンタにおいて、発熱部のプリ
ント用紙や転写リボン等に対する接触を良好にするため
に使用される、いわゆる２段構成のリード導体を有する
サーマルヘッドの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention relates to a so-called two-stage lead structure used in a thermal printer to improve the contact between the heat generating part and the print paper, transfer ribbon, etc. The present invention relates to a method of manufacturing a thermal head having a conductor.
（ロ）従来の技術
一般に、薄膜形のサーマルヘッドは、第２図に示すよう
に、絶縁基板１上に蓄熱層としてのグレーズＭ２を形成
し、このグレーズ層２の上面に抵抗体層３を積層し、さ
らにこの抵抗体Ｎ３の上面に、発熱体部４を構成する部
分を除いて、通電用のリード導体５が形成されてなるも
のであり、印字時には、発熱体部４がプリント用紙８を
介してプラテン９に押しつけられる。この種のサーマル
ヘッドでは、リード導体５の左右端縁がプリント用紙８
に接触し、発熱体部４が確実にプリント用紙８に接触し
ないおそれがある。このおそれをなくすため、リード導
体５の膜厚を小さくすればよいが、膜厚はリード導体５
の抵抗値を一定値以下に確保するという点から、小さく
するには限界があった。(b) Conventional technology Generally, as shown in FIG. 2, in a thin film thermal head, a glaze M2 is formed as a heat storage layer on an insulating substrate 1, and a resistor layer 3 is formed on the upper surface of this glaze layer 2. The resistor N3 is laminated, and a lead conductor 5 for energization is formed on the upper surface of the resistor N3 except for the part constituting the heating element 4. During printing, the heating element 4 is connected to the printing paper 8. is pressed against the platen 9 via. In this type of thermal head, the left and right edges of the lead conductor 5 are connected to the print paper 8.
There is a risk that the heating element portion 4 may not reliably contact the printing paper 8. In order to eliminate this fear, the film thickness of the lead conductor 5 can be made small;
There was a limit to how small the resistance value could be made from the point of view of ensuring that the resistance value was below a certain value.
そこで、リード導体の抵抗値を一定以下に確保し、しか
も発熱部の接触を良好にするために、近年、第３図や第
４図に示す、リード導体をいわゆる２段構造にしたサー
マルヘッドが提案されている。Therefore, in order to ensure the resistance value of the lead conductor below a certain level and also to improve the contact between the heat generating parts, in recent years thermal heads with a so-called two-stage structure of the lead conductor, as shown in Figs. 3 and 4, have been developed. Proposed.
第３図のサーマルヘッドは、抵抗体層３の上面に、発熱
体部４を構成する領域を除いて、膜厚の薄い第１のリー
ド導体５を形成し、さらにこの第１のリード導体５の上
面に、発熱体部４の領域を含む広い領域を除いて、第２
のリード導体６を形成したものであり、第１のリード導
体５と第２のリード導体６は互いに異なる金属材料で構
成している。The thermal head shown in FIG. 3 has a thin first lead conductor 5 formed on the upper surface of the resistor layer 3 except for the region constituting the heating element 4, and furthermore, this first lead conductor 5 On the upper surface of the second
The first lead conductor 5 and the second lead conductor 6 are made of different metal materials.
第４図のサーマルヘッドは、抵抗体層３の上面に、発熱
体部４を構成する領域を除いて、膜厚の薄い第１のリー
ド導体５を形成し、この第１のリード導体５の上面に、
リード導体５と同形・同面積の抵抗体層７を形成し、さ
らに、この抵抗体層７の上面に、発熱体部の領域を含む
広い領域を除いて、第２のリード導体６を形成したもの
である。In the thermal head shown in FIG. 4, a thin first lead conductor 5 is formed on the upper surface of the resistor layer 3 except for the region constituting the heating element 4. on the top,
A resistor layer 7 having the same shape and area as the lead conductor 5 was formed, and a second lead conductor 6 was further formed on the upper surface of the resistor layer 7 except for a wide area including the area of the heating element. It is something.
このサーマルヘッドでは、第１のリード導体５と第２の
リード導体６は同じ金属材料で構成されている。In this thermal head, the first lead conductor 5 and the second lead conductor 6 are made of the same metal material.
（ハ）発明が解決しようとする問題点
上記従来の２段構造のリード導体を備えたサーマルヘッ
ドを製造する場合に、第３図のものでは、絶縁基板１に
グレーズＮ２及び抵抗体層３を積層形成した後、先ず第
１のリード導体５を抵抗体層３の上面に製膜し、フォト
レジスト法により、発熱体部４に相当する領域のリード
導体を除去し、次に残存形成された第１のリード導体５
の上面に第２のリード導体６を製膜し、再びフォトレジ
スト法により発熱体部４に相当する領域のリード導体を
除去し、第２のリード導体６を形成するが、この場合、
第１と第２のリード導体は、異なる金属材料を使用する
ものであるため、両者のフォトレジスト法によるエツチ
ング処理は異なるエツチング槽で行わねばならず、ぞの
ため加工が煩雑になる上、設備費も増大するという問題
があった。(c) Problems to be Solved by the Invention When manufacturing the above-mentioned conventional thermal head equipped with a two-stage structure lead conductor, in the one shown in FIG. After forming the layers, first, the first lead conductor 5 is formed on the upper surface of the resistor layer 3, and the lead conductor in the area corresponding to the heating element part 4 is removed by a photoresist method, and then the remaining lead conductor 5 is removed. First lead conductor 5
A second lead conductor 6 is formed on the upper surface of the film, and the lead conductor in the region corresponding to the heating element portion 4 is removed again by photoresist method to form the second lead conductor 6. In this case,
Since the first and second lead conductors use different metal materials, the photoresist etching process for both must be performed in different etching baths, which complicates processing and requires additional equipment. There was also the problem of increased costs.
一方、第４図のサーマルヘッドを製造する場合には、第
３図のものに比し、第１のリード導体５と第２のリード
導体６は同じ材質の金属で構成されるため、リード導体
形成のためのエツチング槽は１種でよいので、設備が簡
略となり、この点で第３図のものに比べて改善されたが
、しかしフォトレジスト処理は、第１のリード導体５、
中間抵抗体Ｎ７、第２のリード導体６と３回行わねばな
らず、なお工程が複雑であるという問題があった。On the other hand, when manufacturing the thermal head shown in FIG. 4, the first lead conductor 5 and the second lead conductor 6 are made of the same metal material as compared to the one shown in FIG. Since only one type of etching tank is required for formation, the equipment is simplified and in this respect it is improved compared to the one shown in FIG.
This process had to be carried out three times for the intermediate resistor N7 and the second lead conductor 6, and there was a problem in that the process was complicated.
この発明は、上記に鑑み、より簡単な工程で２段構造の
リード導体を持つサーマルヘッドを製造する方法を提供
することを目的としている。In view of the above, an object of the present invention is to provide a method for manufacturing a thermal head having a two-stage structure of lead conductors using a simpler process.
（ニ）問題点を解決するための手段及び作用この発明の
サーマルヘッドの製造方法は、上記問題点を解決するた
めに、絶縁基板上に、下方から順に発熱部を形成するた
めの抵抗体層、第１のリード導体層、酸化膜層及び前記
第１のリード導体層と同材料からなる第２のリード導体
層を積層形成し、発熱部類域を含み、発熱部類域の面積
よりも広い面積に亘り前記第２のリード導体層を除去し
、さらに発熱部類域と同領域に亘り、前記酸化膜層及び
第１のリード導体層を除去し、前記酸化膜層及び第１の
リード導体層の除去された領域の抵抗体層で発熱部を形
成するようにしている。(d) Means and operation for solving the problems In order to solve the above problems, the method for manufacturing a thermal head of the present invention includes a resistor layer for forming a heat generating part in order from the bottom on an insulating substrate. , a first lead conductor layer, an oxide film layer, and a second lead conductor layer made of the same material as the first lead conductor layer are laminated, including a heat generating area and having an area larger than the area of the heat generating area. The second lead conductor layer is removed over the area, and the oxide film layer and the first lead conductor layer are further removed over the same area as the heat generating area, and the oxide film layer and the first lead conductor layer are removed. The removed region of the resistor layer is used to form a heat generating section.
この方法では、同材質の第１のリード導体層と第２のリ
ード導体層間に、酸化膜層を介在させており、導体層と
酸化膜層のエツチングレートが相違するので、第２のリ
ード導体層を例えばエツチング処理により中央部を除去
するのに、第２のリード導体層のみを完全に除去でき、
その後、異なるパターンを用いて酸化１１１層及び第１
のリード導体層の発熱部相当領域を除去すればよい。従
って、この方法では、例えばリード導体形成のためのエ
ツチング等の除去処理は、２回となる。In this method, an oxide film layer is interposed between the first lead conductor layer and the second lead conductor layer made of the same material, and since the etching rates of the conductor layer and the oxide film layer are different, the second lead conductor layer is When removing the central portion of the layer by etching, for example, only the second lead conductor layer can be completely removed;
Then the oxide 111 layer and the first
What is necessary is to remove the area corresponding to the heat generating part of the lead conductor layer. Therefore, in this method, removal processing such as etching for forming lead conductors, for example, is performed twice.
（ホ）実施例
以下、実施例により、この発明をさらに詳細に説明する
。(E) Examples The present invention will be explained in more detail with reference to Examples below.
第１図は、この発明の一実施例方法を説明するための説
明図である。FIG. 1 is an explanatory diagram for explaining a method according to an embodiment of the present invention.
先ず、第１図（ａ）に示すように、例えばアルミナ等か
らなる絶縁基板１上の全面に、蓄熱層としてのグレーズ
層２を印刷形成し、さらにグレーズ層２の上に、下から
順に抵抗体層３、第１のリード導体層５、酸化膜層７及
び第２のリード導体Ｎ６を積層形成する。抵抗体層３は
、全面に印刷焼成され、第１のリード導体Ｎ５は、例え
ばスパッタリング法により、厚さ０．３μｍ程度にパタ
ーン形成される。この第１のリード導体層５の形成終了
時点で、その全面に亘り強制酸化して、酸化膜層７を形
成する。酸化法としては、例えば高温炉や０□プラズマ
を用いる。第２のリード導体層６も、例えばスパッタリ
ング法により厚さ１．５μ程度に形成される。なお、第
１のリード導体層５及び第２のリード導体層６は、同じ
金属、例えばＡｎで構成する。First, as shown in FIG. 1(a), a glaze layer 2 as a heat storage layer is printed on the entire surface of an insulating substrate 1 made of, for example, alumina, and then resistors are formed on the glaze layer 2 in order from the bottom. The body layer 3, the first lead conductor layer 5, the oxide film layer 7, and the second lead conductor N6 are laminated. The resistor layer 3 is printed and fired over the entire surface, and the first lead conductor N5 is patterned to have a thickness of about 0.3 μm by, for example, sputtering. When the formation of the first lead conductor layer 5 is completed, the entire surface thereof is forcibly oxidized to form an oxide film layer 7. As the oxidation method, for example, a high temperature furnace or 0□ plasma is used. The second lead conductor layer 6 is also formed to have a thickness of about 1.5 μm by, for example, sputtering. Note that the first lead conductor layer 5 and the second lead conductor layer 6 are made of the same metal, for example, An.
次に、第２のリード導体層６に、フォトレジスト法を採
用し、エツチング槽に入れて、第１図（′ｂ）に示すよ
うに、発熱部４よりも広い面積に亘る部分をエツチング
により除去し、第２のリード導体６ａ、６ｂを形成する
。この場合、Ａ１とその酸化膜層のエツチングレートが
相違するので、第２のリード導体層６にエツチングを施
し、やがて酸化膜Ｎ７に達すると、一旦エッチングが停
止する形となるので、第１のリード導体層５のみのエツ
チングが可能である。Next, a photoresist method is applied to the second lead conductor layer 6, the layer is placed in an etching bath, and as shown in FIG. Then, second lead conductors 6a and 6b are formed. In this case, since the etching rates of A1 and its oxide film layer are different, the second lead conductor layer 6 is etched, and when the oxide film N7 is reached, the etching is temporarily stopped. Etching only the lead conductor layer 5 is possible.
第２のリード導体６ａ、６ｂの形成が終了すると、異な
るフォトパターンを用いて、再度エツチング槽に入れて
、第２回目のエツチング処理に入る。これにより、第１
図（Ｃ）に示すように、酸化膜層７と第１のリード導体
Ｍ５について、発熱部に相当する部分５ｃ（７ｃ）を除
去し、第１のリード導体５ａ、５ｂを形成する。また、
リード導体５ａ、５ｂ間に抵抗体層３による発熱部４が
形成されることになる。When the formation of the second lead conductors 6a, 6b is completed, the substrate is placed into the etching bath again using a different photo pattern, and a second etching process begins. This allows the first
As shown in Figure (C), portions 5c (7c) corresponding to the heat generating portions of the oxide film layer 7 and the first lead conductor M5 are removed to form first lead conductors 5a and 5b. Also,
A heat generating portion 4 is formed by the resistor layer 3 between the lead conductors 5a and 5b.
以上の方法により得られたサーマルヘソＦの構造は、第
４図の抵抗体Ｎ７に代えて、酸化膜Ｎ７を設けたものと
なる。The structure of the thermal belly button F obtained by the above method has an oxide film N7 provided in place of the resistor N7 shown in FIG.
なお、上記実施例では、第１のリード導体Ｎ５の製膜の
終了前に０２を加えることにより、酸化膜層７を全面に
形成しているが、第１のリード導体層５の製膜終了後、
２段リードを形成する個所のみを強制酸化させて、その
部分のみ、酸化膜層を形成し、その後、第２のリード導
体層６を製膜してもよい。In the above embodiment, the oxide film layer 7 is formed on the entire surface by adding 02 before the film formation of the first lead conductor N5 is completed. rear,
It is also possible to forcibly oxidize only the portion where the two-stage lead is to be formed, form an oxide film layer only in that portion, and then form the second lead conductor layer 6.
（へ）発明の効果
この発明によれば、２段リード導体を形成するのに、第
１のリード導体層と第２のリード導体層に同一金属材料
を使用すると共に、第１の第２の両リード導体層間に酸
化膜層を製膜し、それぞれ発熱部より広い窓部及び発熱
部に相当する窓部をエツチング等に除去処理で形成する
ものであるから、従来のものに比し、必要とする設備が
少なくてよい上、工数も削減されるので、２段リード導
体を有するサーマルヘッドの製造が容易となり、かつ高
品質・低価格のものを提供できる。(F) Effects of the Invention According to the present invention, in forming a two-stage lead conductor, the same metal material is used for the first lead conductor layer and the second lead conductor layer, and the same metal material is used for the first lead conductor layer and the second lead conductor layer. An oxide film layer is formed between both lead conductor layers, and a window wider than the heat-generating part and a window corresponding to the heat-generating part are formed by etching or other removal processing, so compared to conventional methods, it requires less etching. Since less equipment is required and the number of man-hours is also reduced, it is easy to manufacture a thermal head having two-stage lead conductors, and it is possible to provide high quality and low cost thermal heads.
第１図（ａ） （ｂ） （Ｃ）は、この発明の一実施例
を説明するための説明図、第２図は、一般的なサーマル
ヘッドの断面図、第３図、第４図は、従来提案されてい
る２段リードを有するサーマルヘッドの断面図である。
１：′４ｆＡ縁基板、 ３：抵抗体層、４：発熱部、
５：第１のリード導体層、６：第２のリード導
体層、
７：酸化膜層。FIGS. 1(a), (b), and (C) are explanatory diagrams for explaining one embodiment of the present invention, FIG. 2 is a sectional view of a general thermal head, and FIGS. 3 and 4 are , is a sectional view of a conventionally proposed thermal head having two-stage leads. 1: '4fA edge board, 3: Resistor layer, 4: Heat generating part,
5: first lead conductor layer, 6: second lead conductor layer, 7: oxide film layer.
Claims (1)
めの抵抗体層、第１のリード導体層、酸化膜層及び前記
第１のリード導体層と同材料からなる第２のリード導体
層を積層形成し、発熱部領域を含み、発熱部領域の面積
よりも広い面積に亘り前記第２のリード導体層を除去し
、さらに発熱部領域と同領域に亘り前記酸化膜層及び第
１のリード導体層を除去し、前記酸化膜層及び第１のリ
ード導体層の除去された領域の抵抗体層で発熱部を形成
するようにしたサーマルヘッドの製造方法。(1) On an insulating substrate, a resistor layer, a first lead conductor layer, an oxide film layer, and a second lead conductor made of the same material as the first lead conductor layer for forming a heat generating part in order from the bottom. The second lead conductor layer is removed over an area including the heat generating part region and larger than the area of the heat generating part region, and the oxide film layer and the first lead conductor layer are removed over the same area as the heat generating part region. A method for manufacturing a thermal head, in which the lead conductor layer is removed, and a heat generating portion is formed by the resistor layer in the region where the oxide film layer and the first lead conductor layer are removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20893086A JP2550327B2 (en) | 1986-09-04 | 1986-09-04 | Method of manufacturing thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20893086A JP2550327B2 (en) | 1986-09-04 | 1986-09-04 | Method of manufacturing thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6362746A true JPS6362746A (en) | 1988-03-19 |
| JP2550327B2 JP2550327B2 (en) | 1996-11-06 |
Family
ID=16564479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20893086A Expired - Fee Related JP2550327B2 (en) | 1986-09-04 | 1986-09-04 | Method of manufacturing thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2550327B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6770564B1 (en) * | 1998-07-29 | 2004-08-03 | Denso Corporation | Method of etching metallic thin film on thin film resistor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111361295B (en) * | 2020-04-16 | 2021-03-16 | 山东华菱电子股份有限公司 | Organometallic compound resistor thermal print head substrate and manufacturing method thereof |
-
1986
- 1986-09-04 JP JP20893086A patent/JP2550327B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6770564B1 (en) * | 1998-07-29 | 2004-08-03 | Denso Corporation | Method of etching metallic thin film on thin film resistor |
| US6809034B2 (en) | 1998-07-29 | 2004-10-26 | Denso Corporation | Method of etching metallic thin film on thin film resistor |
| US7223668B2 (en) | 1998-07-29 | 2007-05-29 | Denso Corporation | Method of etching metallic thin film on thin film resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2550327B2 (en) | 1996-11-06 |
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