JPH0592595A - Manufacture of thermal head - Google Patents

Manufacture of thermal head

Info

Publication number
JPH0592595A
JPH0592595A JP25253891A JP25253891A JPH0592595A JP H0592595 A JPH0592595 A JP H0592595A JP 25253891 A JP25253891 A JP 25253891A JP 25253891 A JP25253891 A JP 25253891A JP H0592595 A JPH0592595 A JP H0592595A
Authority
JP
Japan
Prior art keywords
common electrode
layer
individual
insulating substrate
thermal head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25253891A
Other languages
Japanese (ja)
Other versions
JP3261145B2 (en
Inventor
Ryoichi Shiraishi
良一 白石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP25253891A priority Critical patent/JP3261145B2/en
Publication of JPH0592595A publication Critical patent/JPH0592595A/en
Application granted granted Critical
Publication of JP3261145B2 publication Critical patent/JP3261145B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To improve image print quality and dimensional precision in manufacture by a method wherein a metal layer is made on an insulating substrate, it is etched so as to form a common electrode member and individual electrode members, thereafter, these are etched so as to form a plurality of heating elements and a common electrode. CONSTITUTION:In a thermal head 17, a glazed layer 12, a heat generating resistor layer 13, an electrode layer consisting of a plurality of individual electrodes 14a and a common electrode 14b partitioned by a notch 26, and a protective layer 15 for covering these members are formed in sequence on an insulating substrate 11. In this case, at manufacturing, a metallic layer 22 is firstly formed on the insulating substrate 11. The metal layer 22 is etched so as to form a common electrode member 25 and a plurality of individual electrode members 28 which are in parallel with each other are formed, respectively. The individual electrode members 28 and the common electrode member 25 are etched. The heat generating resistor layer 13 is exposed at an area 27 of the individual electrode members 28 so as to form a plurality of heating elements 16. Further, the common electrode 14b having a predetermined width is formed on the common electrode member 25.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、たとえばワードプロセ
ッサの印字出力装置などとして広く使用されているサー
マルプリンタに搭載されるサーマルヘッドの製造方法に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a thermal head mounted on a thermal printer which is widely used as, for example, a print output device of a word processor.

【0002】[0002]

【従来の技術】図6は典型的な先行技術の断面図であ
る。サーマルヘッド7において、セラミック製電気絶縁
性基板1上にグレーズ層2が形成され、基板1とグレー
ズ層2との上に発熱抵抗体層3が形成され、その上にフ
ォトエッチングの手法によって複数の個別電極4aと共
通電極4bとが間隔をあけて形成され、これらの電極4
a,4b間で発熱抵抗体層3が露出して印画素子6が形
成される。電極4a,4bと、発熱抵抗体層3の印画素
子6との印画時の摩耗を防ぐため、および印画素子6に
おける発熱抵抗体層3の発熱による酸化を防ぐために、
保護膜5が形成される。印画素子6における発熱抵抗体
層3の選択的な発熱によって、その熱が保護膜5を伝わ
り、インクリボンに熱を加え、あるいはまた感熱紙に熱
を伝え、これによって印画が行われる。
2. Description of the Related Art FIG. 6 is a typical prior art cross section. In the thermal head 7, the glaze layer 2 is formed on the ceramic electrically insulating substrate 1, the heating resistor layer 3 is formed on the substrate 1 and the glaze layer 2, and a plurality of layers are formed by photoetching on the heating resistor layer 3. The individual electrode 4a and the common electrode 4b are formed with a space between them, and these electrode 4
The heating resistor layer 3 is exposed between a and 4b, and the printing element 6 is formed. In order to prevent abrasion of the electrodes 4a and 4b and the printing element 6 of the heating resistor layer 3 during printing, and to prevent oxidation of the heating resistor layer 3 in the printing element 6 due to heat generation,
The protective film 5 is formed. Due to the selective heat generation of the heating resistor layer 3 in the printing element 6, the heat is transmitted through the protective film 5 to add heat to the ink ribbon or heat to the thermal paper, thereby printing is performed.

【0003】このようなサーマルヘッド7の製造工程
は、前記基板1上にグレーズ層2が形成され、さらに基
板1上に発熱抵抗体層3と電極4a,4bを形成する金
属層4とをスパッタリングなどにより成膜する。つぎに
図7に示すように、前記発熱抵抗体層3と金属層4との
2層に及び、相互に平行な複数の切欠き8をエッチング
などの手法で形成する。つぎにこの段階の発熱抵抗体層
3と金属層との積層体に対し、印画素子6の図7に破線
で示す形成領域9に対し、エッチングを施して金属層4
のみを除去する。これにより個別電極4aと共通電極4
bとが区分され、これらに挟まれて複数の印画素子6が
直線状に配列されて構成される。この後、印画素子6と
基板1の端部との距離L1をたとえば350μmの予め
定める寸法とするように、基板1の端部に対して図6に
示されるような研磨処理が行われ、除去部分10が研磨
されて除去される。
In the manufacturing process of such a thermal head 7, the glaze layer 2 is formed on the substrate 1, and the heating resistor layer 3 and the metal layer 4 forming the electrodes 4a and 4b are sputtered on the substrate 1. And the like. Next, as shown in FIG. 7, a plurality of notches 8 extending in two layers of the heating resistor layer 3 and the metal layer 4 and parallel to each other are formed by a method such as etching. Next, with respect to the laminated body of the heating resistor layer 3 and the metal layer at this stage, the formation region 9 of the printing element 6 shown by the broken line in FIG.
Remove only. Thereby, the individual electrode 4a and the common electrode 4
b is divided, and a plurality of printing elements 6 are linearly arranged so as to be sandwiched between them. After that, a polishing process as shown in FIG. 6 is performed on the end portion of the substrate 1 so that the distance L1 between the printing element 6 and the end portion of the substrate 1 is set to a predetermined dimension of, for example, 350 μm, and removed. The portion 10 is polished and removed.

【0004】一方、近年、サーマルプリンタの高画質
化、高速化などの要請のため、前記距離L1を可及的に
小さくするようにしている。これは、たとえばインクリ
ボンを用いて感熱転写を行う場合を想定すると、インク
リボンを保護膜5から剥離するまでの時間は、印画素子
6の中央の位置6aから基板1の端部1aまでの距離L
1に対応している。この距離L1が長すぎると、インク
リボンの、一旦溶融したインクが、再び凝固し始めるの
で、ボイドの多い、すなわちインクが記録紙に充分に付
着しない部分が多い印画が行われ、印画品位が低下して
しまう。したがってこの距離L1を可能な限り短くする
必要がある。
On the other hand, in recent years, the distance L1 has been made as small as possible because of the demand for higher image quality and higher speed of the thermal printer. Assuming that thermal transfer is performed using an ink ribbon, for example, the time until the ink ribbon is peeled off from the protective film 5 depends on the distance from the central position 6a of the printing element 6 to the end 1a of the substrate 1. L
Corresponds to 1. If this distance L1 is too long, the once melted ink of the ink ribbon starts to solidify again, so that printing is performed with many voids, that is, there are many portions where the ink does not adhere sufficiently to the recording paper, and the printing quality deteriorates. Resulting in. Therefore, it is necessary to make this distance L1 as short as possible.

【0005】一方で、印画動作を高速化すると1回の印
画に必要な電流密度を増大する必要があり、前記共通電
極4bの図7左右方向の幅を増大する必要がある。この
ため切欠き8の共通電極4b側の端部8aを図7左方に
ずらし、図7(2)で示されるように各印画素子6が切
欠き8で完全に区分された状態から、図7(1)に示さ
れるように印画素子6が共通電極4b側で連結した構成
とする技術が提案されている。このような従来例の例と
して特開平3−61551が挙げられる。この従来例
は、各印画素子6の図7上下方向の熱の分布を良好にし
て印画濃度を向上しようとするものである。
On the other hand, if the printing operation is speeded up, it is necessary to increase the current density required for one printing, and it is necessary to increase the width of the common electrode 4b in the left-right direction in FIG. Therefore, the end 8a of the notch 8 on the side of the common electrode 4b is shifted to the left in FIG. 7, and each printing element 6 is completely divided by the notch 8 as shown in FIG. As shown in 7 (1), a technique has been proposed in which the printing elements 6 are connected on the common electrode 4b side. As an example of such a conventional example, there is JP-A-3-61551. This conventional example is intended to improve the print density by improving the heat distribution of each print element 6 in the vertical direction in FIG.

【0006】[0006]

【発明が解決しようとする課題】一方、このようなサー
マルヘッド7において前述したように印画動作の高速化
を図ろうとすると、各印画素子6に供給される電流密度
が増大し、したがって共通電極4bの図7左右方向の幅
を可及的に広くする必要がある。前述したように切欠き
8が形成された段階の発熱抵抗体層3と金属層4との積
層体に対して、金属層4のみをエッチングして印画素子
6を形成しようとする場合、このようなエッチング処理
は絶縁基板1上に印画素子6を形成する領域を残し、残
余の領域を被覆する合成樹脂材料などからなるマスクを
形成して行われる。
On the other hand, if an attempt is made to speed up the printing operation in the thermal head 7 as described above, the current density supplied to each printing element 6 increases, and therefore the common electrode 4b. In FIG. 7, it is necessary to make the width in the left-right direction as wide as possible. As described above, when it is intended to form the printing element 6 by etching only the metal layer 4 with respect to the laminated body of the heating resistor layer 3 and the metal layer 4 at the stage where the notch 8 is formed as described above, The etching process is performed by leaving a region on the insulating substrate 1 where the printing element 6 is to be formed and forming a mask made of a synthetic resin material or the like to cover the remaining region.

【0007】このマスクに形成領域9に対応する透孔を
形成する場合、形成領域9の位置を定める際の位置合わ
せの誤差により、本来印画素子6を形成すべき領域であ
る図7に破線で示す前記形成領域9に対し、実際の印画
素子6が図7(1)に示すように、共通電極4b側にず
れて形成されたり、あるいは図7(2)に示すように個
別電極4a側にずれて形成される場合がある。
When a through hole corresponding to the formation region 9 is formed in this mask, due to an alignment error in determining the position of the formation region 9, the printing element 6 should be originally formed in a region shown by a broken line in FIG. An actual printing element 6 is formed on the side of the common electrode 4b as shown in FIG. 7 (1) with respect to the formation area 9 shown, or is formed on the side of the individual electrode 4a as shown in FIG. 7 (2). It may be formed with a shift.

【0008】図7(2)の場合では、形成領域9が図7
(2)の個別電極4a側にずれても、切欠き8の端部8
aが位置合わせの目安となり、大幅な位置ずれは回避さ
れ、またこのようにずれた場合には、共通電極4bが幅
広となり、製品としてもサーマルヘッド7に比較的不具
合を生じないことが知られている。
In the case of FIG. 7B, the formation region 9 is shown in FIG.
Even if it shifts to the individual electrode 4a side of (2), the end portion 8 of the notch 8
It is known that “a” serves as a guideline for alignment, and a large displacement is avoided, and in the case of such displacement, the common electrode 4b becomes wide, and the thermal head 7 as a product is relatively free from defects. ing.

【0009】一方、形成領域9が共通電極4b側にずれ
ると、共通電極4bの図7左右方向の幅が小さくなり、
共通電極4bの配線抵抗が大きくなり、また電流密度が
過大となり、大幅な電圧降下および電力損失をもたら
す。その結果、同時に発熱される印画素子6の数が多く
なるほど、印画濃度が低下して、印画された文字などが
かすれるなど印画品質が大幅に低下するという不具合を
生じる。
On the other hand, when the formation region 9 is displaced toward the common electrode 4b side, the width of the common electrode 4b in the left-right direction in FIG.
The wiring resistance of the common electrode 4b becomes large, and the current density becomes excessive, which causes a large voltage drop and power loss. As a result, as the number of printing elements 6 that generate heat at the same time increases, the printing density decreases, and the printing quality is greatly reduced, such as the printed characters are blurred.

【0010】本発明の目的は、上述の技術的課題を解消
し、印画品質を格段に向上できると共に、製造上の寸法
精度を向上することができるサーマルヘッドの製造方法
を提供することである。
SUMMARY OF THE INVENTION An object of the present invention is to solve the above technical problems and to provide a method of manufacturing a thermal head which can significantly improve the printing quality and the dimensional accuracy in manufacturing.

【0011】[0011]

【課題を解決するための手段】本発明は、絶縁基板上に
グレーズ層、抵抗体層、切欠きを介在して相互に隔てら
れる複数の個別電極と共通電極とから成る電極層、およ
びこれらを被覆する保護層とを順次形成するサーマルヘ
ッドの製造方法において、主面上にグレーズ層と抵抗体
層とが形成された絶縁基板上に金属層を成膜し、しかる
後、前記金属層をエッチング加工して共通電極部材と相
互に平行な複数の個別電極部材とを形成する工程と、個
別電極部材と共通電極部材とをエッチング加工し、個別
電極部材の領域で抵抗体層を露出させて複数の発熱素子
を形成するとともに、共通電極部材に所定幅の共通電極
を形成する工程とを含むことを特徴とするサーマルヘッ
ドの製造方法である。
According to the present invention, a glaze layer, a resistor layer, an electrode layer composed of a plurality of individual electrodes and a common electrode which are separated from each other by interposing a notch, and an electrode layer on the insulating substrate. In a method of manufacturing a thermal head in which a protective layer to be coated is sequentially formed, a metal layer is formed on an insulating substrate on which a glaze layer and a resistor layer are formed on a main surface, and then the metal layer is etched. A step of processing to form a common electrode member and a plurality of individual electrode members parallel to each other; and etching the individual electrode member and the common electrode member to expose the resistor layer in the region of the individual electrode member And the step of forming a common electrode having a predetermined width on the common electrode member.

【0012】[0012]

【作用】本発明に従うサーマルヘッドは、絶縁基板上に
グレーズ層、抵抗体層、切欠きを介在して相互に隔てら
れる複数の個別電極と共通電極とから成る電極層、およ
びこれらを被覆する保護層とを順次形成して構成され
る。このとき、主面上にグレーズ層と抵抗体層とが形成
された絶縁基板上に金属層を成膜し、相互に平行な複数
の切欠きを形成して、複数の個別電極部材と共通電極部
材とを形成し、個別電極部材と共通電極部材に亘る領域
のうち、個別電極部材の領域を含む形成領域で、抵抗体
層を露出して複数の発熱素子を構成し、同時に共通電極
部材において、前記発熱素子の形成領域の共通電極側の
端部から予め定める距離を隔てて、発熱素子の配列方向
と平行な溝部を形成する。
The thermal head according to the present invention comprises a glaze layer, a resistor layer, an electrode layer composed of a plurality of individual electrodes and a common electrode which are separated from each other by interposing notches, and a protective layer covering these layers on an insulating substrate. And layers are sequentially formed. At this time, a metal layer is formed on an insulating substrate on which a glaze layer and a resistor layer are formed on the main surface, and a plurality of notches parallel to each other are formed to form a plurality of individual electrode members and a common electrode. And forming a plurality of heating elements by exposing the resistor layer in the formation region including the region of the individual electrode member in the region extending between the individual electrode member and the common electrode member. A groove parallel to the arrangement direction of the heating elements is formed at a predetermined distance from the end on the common electrode side of the area where the heating elements are formed.

【0013】したがって、共通電極の発熱素子の配列方
向と垂直方向の幅は、前記複数の切欠きの共通電極側の
端部あるいは前記形成領域の共通電極側の端部と溝部と
の間隔で規定される。この間隔は、前記溝部などを形成
するに用いられるマスク上で固定されており、したがっ
て前記形成領域が発熱素子の配列方向と交差する双方向
のいずれにずれた場合でも、これに連動して溝部の形成
位置が移動することになり、一定幅の共通電極を得るこ
とができる。
Therefore, the width of the common electrode in the direction perpendicular to the arrangement direction of the heating elements is defined by the interval between the end of the plurality of notches on the common electrode side or the end of the formation region on the common electrode side and the groove. To be done. This interval is fixed on the mask used for forming the groove portion and the like. Therefore, even if the formation region is deviated in both directions intersecting the arrangement direction of the heating elements, the groove portion is interlocked with this. Since the formation position of is moved, a common electrode having a constant width can be obtained.

【0014】これにより共通電極が不所望に幅狭となる
ことにより共通電極を流れる電流に関して大幅な電圧降
下や電力損失が生じる事態が防止され、これに伴う印画
品質の低下を防止することができる。
As a result, it is possible to prevent a situation in which the common electrode is undesirably narrowed to cause a large voltage drop or power loss with respect to the current flowing through the common electrode, and it is possible to prevent the print quality from being deteriorated. ..

【0015】さらに絶縁基板などの共通電極側端部を研
磨加工などする際に、研磨の進行程度の判別は前記溝部
を目安とすることができる。これにより製造上の寸法精
度が格段に向上される。
Further, when the end portion of the insulating substrate such as the common electrode is polished, the groove portion can be used as a guide for determining the progress of polishing. As a result, the dimensional accuracy in manufacturing is significantly improved.

【0016】[0016]

【実施例】図1は本発明の一実施例の断面図であり、図
2はその図1に示される実施例の平面図である。シリア
ルプリンタ用サーマルヘッド17において、アルミナ系
セラミックなどの電気絶縁性材料から成る基板11上に
は、グレーズ層12が形成される。このグレーズ層12
はたとえばSiO2 を主成分とするガラスから成る。グ
レーズ層12上および基板11上には発熱抵抗体層13
が形成される。さらにその上に全面にわたって金属、た
とえばアルミニウムまたは銅などの材料から成る金属層
14が形成され、フォトエッチングの手法を用いて個別
電極14a、共通電極14bが形成される。複数本の個
別電極14aと、それらに共通の共通電極14bとの間
では、発熱抵抗体層13が露出して印画素子16が形成
される。
1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a plan view of the embodiment shown in FIG. In the thermal head 17 for a serial printer, a glaze layer 12 is formed on a substrate 11 made of an electrically insulating material such as alumina ceramic. This glaze layer 12
Is made of, for example, glass containing SiO 2 as a main component. The heating resistor layer 13 is formed on the glaze layer 12 and the substrate 11.
Is formed. Further, a metal layer 14 made of a metal, for example, a material such as aluminum or copper is formed over the entire surface, and the individual electrode 14a and the common electrode 14b are formed by the photoetching technique. Between the plurality of individual electrodes 14a and the common electrode 14b common to them, the heating resistor layer 13 is exposed and the printing element 16 is formed.

【0017】これらの共通電極14a,14b、印画素
子16およびその他の表面には、保護膜15が形成され
る。この保護膜15は、たとえばSi34またはTa2
5などから成る。保護膜15は、個別電極14aおよ
び共通電極14bの印画時の摩耗を防ぐとともに、印画
素子16における発熱抵抗体層13の発熱による酸化を
防ぐ働きをする。
A protective film 15 is formed on the common electrodes 14a and 14b, the printing element 16 and other surfaces. The protective film 15 is formed of, for example, Si 3 N 4 or Ta 2
It consists of O 5 etc. The protective film 15 functions to prevent abrasion of the individual electrode 14a and the common electrode 14b during printing and also to prevent oxidation of the heating resistor layer 13 in the printing element 16 due to heat generation.

【0018】また共通電極14bは、副走査方向の幅W
1(たとえば50μm)に形成され、この共通電極14
bと基板11の端部側に発熱抵抗体層13が露出する幅
W2(たとえば20μm)の溝20が形成され、共通電
極14bとこの溝20を隔てて、共通電極14bと同一
材料、同一製造工程で製造される幅W3(たとえば35
μm)のダミーライン21が形成される。
The common electrode 14b has a width W in the sub-scanning direction.
1 (for example, 50 μm), and the common electrode 14
b and a groove 20 having a width W2 (for example, 20 μm) where the heating resistor layer 13 is exposed are formed on the end side of the substrate 11 and the common electrode 14b and the same material and the same manufacturing as the common electrode 14b with the groove 20 separated. Width W3 (eg 35
μm) dummy line 21 is formed.

【0019】図3は本実施例のサーマルヘッド17の製
造工程を説明する工程図であり、図4および図5はこの
製造工程を説明する図である。工程a1では、図4
(1)に示されるように、基板11上にガラスなどから
成るグレーズ層12を形成する。工程a2では、この基
板11上に前記発熱抵抗体層13とたとえばアルミニウ
ムなどから成る金属層22とをそれぞれスパッタリング
などの技術で成膜する。
FIG. 3 is a process diagram for explaining the manufacturing process of the thermal head 17 of this embodiment, and FIGS. 4 and 5 are diagrams for explaining this manufacturing process. In step a1, FIG.
As shown in (1), the glaze layer 12 made of glass or the like is formed on the substrate 11. In step a2, the heating resistor layer 13 and the metal layer 22 made of, for example, aluminum are formed on the substrate 11 by a technique such as sputtering.

【0020】工程a3では、発熱抵抗体層13と金属層
22とを共に同一工程でエッチングし、基板11の周縁
部23を形成して、後述するような当該金属層22から
形成されるダミーラインが形成されるダミーライン形成
領域24を含みうる幅で、共通電極部材25を形成す
る。また前記複数の個別電極14aを形成するために相
互に間隔W4をあけて、幅W5の複数の切欠き26を相
互に平行に形成する。この切欠き26の共通電極部材2
5側端部26aは、前記印画素子16が形成される印画
素子形成領域27内に位置するように形成される。これ
により、個別電極部材28が複数形成される。
In step a3, the heating resistor layer 13 and the metal layer 22 are both etched in the same step to form a peripheral portion 23 of the substrate 11, and a dummy line formed from the metal layer 22 as described later. The common electrode member 25 is formed to have a width that can include the dummy line formation region 24 in which is formed. Further, in order to form the plurality of individual electrodes 14a, a plurality of notches 26 having a width W5 are formed in parallel with each other with a space W4 therebetween. The common electrode member 2 of this notch 26
The fifth-side end portion 26a is formed so as to be located in the printing element forming region 27 in which the printing element 16 is formed. As a result, a plurality of individual electrode members 28 are formed.

【0021】工程a4では、図4(4)に示す製造段階
の基板11に対して、図4(4)に2点鎖線で示す印画
素子形成領域27と、溝形成領域29の範囲内の金属層
22のみをエッチングする。これにより図5(1)およ
び図2に示されるように、個別電極28および共通電極
部材25に亘る範囲に各個別電極14a毎に発熱抵抗体
層23が露出して印画素子16が形成される。また印画
素子16から図2に示す距離W1を隔てて、幅W2の溝
20が形成され、溝20の共通電極14bと反対側には
金属層22が帯状に残在するダミーライン21が形成さ
れる。すなわち印画素子16と溝20とは、このような
エッチングを行う際に用いられるフォトレジストなどを
用いるフォトプロセスにおいて、フォトレジストを感光
させる同一のマスクで形成される。
In step a4, with respect to the substrate 11 in the manufacturing stage shown in FIG. 4 (4), the metal within the printing element forming region 27 and the groove forming region 29 shown by the two-dot chain line in FIG. 4 (4) is formed. Only layer 22 is etched. As a result, as shown in FIG. 5A and FIG. 2, the heating resistor layer 23 is exposed for each individual electrode 14 a in the range extending over the individual electrode 28 and the common electrode member 25, and the printing element 16 is formed. .. A groove 20 having a width W2 is formed at a distance W1 shown in FIG. 2 from the printing element 16, and a dummy line 21 having a strip-shaped metal layer 22 is formed on the opposite side of the groove 20 from the common electrode 14b. It That is, the printing element 16 and the groove 20 are formed by the same mask that exposes the photoresist in a photo process using a photoresist or the like used when performing such etching.

【0022】工程a5では、このような製造段階の基板
11上に図5(2)で示すように、保護膜15を形成す
る。また工程a6では、サーマルヘッド17の印画品質
の向上および高速化を図る目的で、発熱素子16の中心
位置と絶縁基板11の端部との距離L2を可及的に小さ
な所望な値とするために、基板11の前記端部側を図5
(2)に示すように本来の基板11の端部11aから端
面30となるまで研磨加工を行う。
In step a5, as shown in FIG. 5B, the protective film 15 is formed on the substrate 11 in the manufacturing stage. In step a6, the distance L2 between the central position of the heating element 16 and the end of the insulating substrate 11 is set to a desired value as small as possible for the purpose of improving the printing quality of the thermal head 17 and increasing the speed. In addition, the end side of the substrate 11 is shown in FIG.
As shown in (2), polishing is performed from the original end 11a of the substrate 11 to the end face 30.

【0023】このとき研磨加工は、基板11の表面側の
研磨位置が共通電極14bに掛かると、共通電極14b
が不所望に幅狭となり少面積化が発生し、従来技術の項
で述べたような不具合が発生する。したがって本実施例
では、前記研磨加工を行うに際して、ダミーライン21
を目安とする。すなわち共通電極14b、ダミーライン
21は共にたとえばアルミニウムなどの金属から成って
おり、白く光って目視される。一方、溝20では金属層
22が剥離されており、発熱抵抗体層13で黒く目視さ
れる。
At this time, when the polishing position on the front surface side of the substrate 11 reaches the common electrode 14b, the common electrode 14b is polished.
Is undesirably narrowed and the area is reduced, resulting in the problems described in the section of the prior art. Therefore, in this embodiment, when performing the polishing process, the dummy line 21
Use as a guide. That is, both the common electrode 14b and the dummy line 21 are made of a metal such as aluminum, and are visually recognized as white. On the other hand, in the groove 20, the metal layer 22 is peeled off, and the heating resistor layer 13 is seen as black.

【0024】したがって研磨作業を、ダミーライン21
の途中であるか、あるいは、溝20がダミーライン21
と共通電極14bとに挟まれて明瞭に目視できる程度で
終了させる。研磨が過剰になると、溝20が消滅し共通
電極14bに研磨部材が進入したことになり、共通電極
14bが狭隘化し従来技術の項で説明したような不具合
を生じるが、本実施例ではこのような不具合の発生を防
止する。
Therefore, the polishing work is performed on the dummy line 21.
Is on the way, or the groove 20 is in the dummy line 21.
It is sandwiched between the common electrode 14b and the common electrode 14b, and the process is finished with a degree of being clearly visible. If the polishing is excessive, the groove 20 disappears and the polishing member enters the common electrode 14b, and the common electrode 14b becomes narrow, which causes a problem as described in the section of the prior art. Prevent the occurrence of serious problems.

【0025】以上のように、本実施例では基板11上に
発熱抵抗体層13と金属層22とを成膜し、切欠き26
を形成した段階の構成体に対して、印画素子形成領域2
7および溝形成領域29を同一のフォトマスクを用いて
エッチングするようにした。これにより当該フォトマス
クの位置決めがずれ、印画素子形成領域27が図4
(4)の右方側へずれても、溝20は同様に図4右方側
へずれ、印画素子形成領域27と溝形成領域29とで挟
まれる共通電極14bの図2左右方向の幅W1は一定で
ある。これにより、従来技術の項で述べたように、共通
電極の幅が不所望に小さくなり、印画品質が低下する事
態を防止することができる。
As described above, in this embodiment, the heating resistor layer 13 and the metal layer 22 are formed on the substrate 11, and the notch 26 is formed.
The printing element formation region 2
7 and the groove formation region 29 were etched using the same photomask. As a result, the photomask is misaligned, and the printing element forming area 27 is formed in FIG.
Even if it shifts to the right side in (4), the groove 20 shifts to the right side in FIG. 4 similarly, and the width W1 in the left-right direction in FIG. 2 of the common electrode 14b sandwiched between the printing element forming region 27 and the groove forming region 29. Is constant. As a result, it is possible to prevent the width of the common electrode from being undesirably reduced and the print quality from being deteriorated, as described in the section of the related art.

【0026】またサーマルヘッド17を製造する際の研
磨工程において、ダミーライン21および溝20が研磨
の進行の程度の目安となり、研磨作業を高精度で行うこ
とができる。
Further, in the polishing process for manufacturing the thermal head 17, the dummy line 21 and the groove 20 serve as a measure of the progress of polishing, and the polishing operation can be performed with high accuracy.

【0027】[0027]

【発明の効果】以上のように本発明に従うサーマルヘッ
ドは、絶縁基板上にグレーズ層、抵抗体層、切欠きを介
在して相互に隔てられる複数の個別電極と共通電極とか
ら成る電極層、およびこれらを被覆する保護層とを順次
形成して構成される。このとき、主面上にグレーズ層と
抵抗体層とが形成された絶縁基板上に金属層を成膜し、
相互に平行な複数の切欠きを形成して、複数の個別電極
部材と共通電極部材とを形成し、個別電極部材と共通電
極部材に亘る領域のうち個別電極部材の領域を含む形成
領域で、抵抗体層を露出して複数の発熱素子を構成し、
同時に共通電極部材において、前記発熱素子の形成領域
の共通電極側の端部から予め定める距離を隔てて、発熱
素子の配列方向と平行な溝部を形成する。
As described above, the thermal head according to the present invention has a glaze layer, a resistor layer, and an electrode layer composed of a plurality of individual electrodes and a common electrode which are separated from each other by interposing notches, on an insulating substrate. And a protective layer that covers these and are sequentially formed. At this time, a metal layer is formed on the insulating substrate on which the glaze layer and the resistor layer are formed on the main surface,
Forming a plurality of notches parallel to each other to form a plurality of individual electrode members and a common electrode member, in the formation region including the region of the individual electrode member in the region across the individual electrode member and the common electrode member, Exposing the resistor layer to form multiple heating elements,
At the same time, in the common electrode member, a groove parallel to the arrangement direction of the heating elements is formed at a predetermined distance from the end on the common electrode side of the area where the heating elements are formed.

【0028】したがって、共通電極の発熱素子の配列方
向と垂直方向の幅は、前記複数の切欠きの共通電極側の
端部あるいは前記形成領域の共通電極側の端部と溝部と
の間隔で決定される。この間隔は、前記溝部などを形成
するに用いられるマスク上で固定されており、したがっ
て前記形成領域が発熱素子の配列方向と交差する双方向
のいずれにずれた場合でも、これに連動して溝部の形成
位置が移動することになり、一定幅の共通電極を得るこ
とができる。これにより共通電極が不所望に幅狭となる
ことにより共通電極を流れる電流に関して大幅な電圧降
下や電力損失が生じる事態が防止され、これに伴う印画
品質の低下を防止することができる。
Therefore, the width of the common electrode in the direction perpendicular to the arrangement direction of the heating elements is determined by the end of the plurality of notches on the common electrode side or the interval between the end of the formation region on the common electrode side and the groove. To be done. This interval is fixed on the mask used for forming the groove portion and the like. Therefore, even if the formation region is deviated in both directions intersecting the arrangement direction of the heating elements, the groove portion is interlocked with this. Since the formation position of is moved, a common electrode having a constant width can be obtained. As a result, it is possible to prevent a situation in which the common electrode becomes undesirably narrow and causes a large voltage drop or power loss with respect to the current flowing through the common electrode, and it is possible to prevent the print quality from being deteriorated.

【0029】さらに絶縁基板などの共通電極側端部を研
磨加工などする際に、研磨の進行程度の判別は前記溝部
を目安とすることができる。これにより製造上の寸法精
度が格段に向上される。
Further, when the end portion of the insulating substrate or the like on the common electrode side is polished, the degree of progress of polishing can be determined by using the groove portion as a guide. As a result, the dimensional accuracy in manufacturing is significantly improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例のサーマルヘッド17の断面
図である。
FIG. 1 is a sectional view of a thermal head 17 according to an embodiment of the present invention.

【図2】サーマルヘッド17の平面図である。FIG. 2 is a plan view of a thermal head 17.

【図3】本発明の一実施例のサーマルヘッド17の製造
工程を示す工程図である。
FIG. 3 is a process drawing showing a manufacturing process of the thermal head 17 of the embodiment of the present invention.

【図4】この製造工程を説明する図である。FIG. 4 is a diagram illustrating this manufacturing process.

【図5】この製造工程を説明する図である。FIG. 5 is a diagram illustrating this manufacturing process.

【図6】従来例のサーマルヘッド7の断面図である。FIG. 6 is a cross-sectional view of a conventional thermal head 7.

【図7】従来例の問題点を説明する平面図である。FIG. 7 is a plan view illustrating a problem of a conventional example.

【符号の説明】[Explanation of symbols]

11 基板 11a 端部 13 発熱抵抗体層 14a 個別電極 14b 共通電極 16 印画素子 17 サーマルヘッド 20 溝 21 ダミーライン 22 金属層 26 切欠き 27 印画素子形成領域 11 substrate 11a end part 13 heating resistor layer 14a individual electrode 14b common electrode 16 printing element 17 thermal head 20 groove 21 dummy line 22 metal layer 26 notch 27 printing element forming area

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 絶縁基板上にグレーズ層、抵抗体層、切
欠きを介在して相互に隔てられる複数の個別電極と共通
電極とから成る電極層、およびこれらを被覆する保護層
とを順次形成するサーマルヘッドの製造方法において、 主面上にグレーズ層と抵抗体層とが形成された絶縁基板
上に金属層を成膜し、しかる後、前記金属層をエッチン
グ加工して共通電極部材と相互に平行な複数の個別電極
部材とを形成する工程と、 個別電極部材と共通電極部材とをエッチング加工し、個
別電極部材の領域で抵抗体層を露出させて複数の発熱素
子を形成するとともに、共通電極部材に所定幅の共通電
極を形成する工程とを含むことを特徴とするサーマルヘ
ッドの製造方法。
1. A glaze layer, a resistor layer, an electrode layer composed of a plurality of individual electrodes and a common electrode which are separated from each other by interposing notches, and a protective layer which covers these layers are sequentially formed on an insulating substrate. In the method of manufacturing a thermal head, a metal layer is formed on an insulating substrate on which a glaze layer and a resistor layer are formed on the main surface, and then the metal layer is subjected to an etching process so as to interact with the common electrode member. A step of forming a plurality of individual electrode members parallel to each other, and etching the individual electrode member and the common electrode member, exposing the resistor layer in the region of the individual electrode members to form a plurality of heating elements, And a step of forming a common electrode of a predetermined width on the common electrode member.
JP25253891A 1991-09-30 1991-09-30 Manufacturing method of thermal head Expired - Lifetime JP3261145B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25253891A JP3261145B2 (en) 1991-09-30 1991-09-30 Manufacturing method of thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25253891A JP3261145B2 (en) 1991-09-30 1991-09-30 Manufacturing method of thermal head

Publications (2)

Publication Number Publication Date
JPH0592595A true JPH0592595A (en) 1993-04-16
JP3261145B2 JP3261145B2 (en) 2002-02-25

Family

ID=17238770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25253891A Expired - Lifetime JP3261145B2 (en) 1991-09-30 1991-09-30 Manufacturing method of thermal head

Country Status (1)

Country Link
JP (1) JP3261145B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012153116A (en) * 2011-01-28 2012-08-16 Kyocera Corp Thermal head, and method of polishing edge of board of thermal head

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012153116A (en) * 2011-01-28 2012-08-16 Kyocera Corp Thermal head, and method of polishing edge of board of thermal head

Also Published As

Publication number Publication date
JP3261145B2 (en) 2002-02-25

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