JPS6362339B2 - - Google Patents
Info
- Publication number
- JPS6362339B2 JPS6362339B2 JP54018715A JP1871579A JPS6362339B2 JP S6362339 B2 JPS6362339 B2 JP S6362339B2 JP 54018715 A JP54018715 A JP 54018715A JP 1871579 A JP1871579 A JP 1871579A JP S6362339 B2 JPS6362339 B2 JP S6362339B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- rotary grindstone
- grindstone blade
- silicon wafer
- cooling water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 27
- 229910052757 nitrogen Inorganic materials 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 239000011261 inert gas Substances 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 230000008016 vaporization Effects 0.000 claims description 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 239000000498 cooling water Substances 0.000 description 10
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Description
【発明の詳細な説明】
本発明は回転砥石刃による切削に際し、冷却水
を使用することなく乾式で切削するようにした乾
式切削方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a dry cutting method in which dry cutting is performed without using cooling water when cutting with a rotary grindstone blade.
IC、LSI等のシリコンウエハは、通常数十μｍ
の厚さのダイヤモンドブレードからなる回転砥石
刃を用いて数mmの間隔でさいの目状に切削され
る。この場合、回転砥石刃の破損防止と、シリコ
ンウエハのチツピング防止のため、切削位置に冷
却水を噴射して切削する。ところが、シリコンウ
エハ等の被切削物の中には、表面の酸化防止その
他の理由から冷却水を使用しての切削のできない
ものがある。したがつて、折角の回転砥石刃によ
る切削装置を使用せずに、ポイントスクライバ
（ダイヤモンドの尖鋭端等により線を引いて切る
装置）で切断しているのが現状である。 Silicon wafers for IC, LSI, etc. are usually several tens of μm thick.
It is cut into dice at intervals of several millimeters using a rotating grindstone blade made of a diamond blade with a thickness of . In this case, in order to prevent damage to the rotary grindstone blade and to prevent chipping of the silicon wafer, cooling water is sprayed at the cutting position for cutting. However, some objects to be cut, such as silicon wafers, cannot be cut using cooling water for reasons such as prevention of surface oxidation. Therefore, at present, cutting is performed with a point scriber (a device that cuts by drawing a line with the sharp end of a diamond, etc.) without using a cutting device using a rotary grindstone blade.
本発明は、このような点に鑑みなされたもの
で、回転砥石刃による切削装置において、切削位
置に不活性ガスを噴射することによつて、酸素を
遮断し、かつ冷却しつつ乾式で切削を行う方法を
提供しようとするものである。不活性ガスとして
液体窒素を用い、切削位置で気化させることによ
り、切削個所の酸素を排除し、かつ冷却も行うこ
とができる。 The present invention has been developed in view of the above-mentioned problems, and in a cutting device using a rotary grindstone blade, injects inert gas to the cutting position to cut off oxygen and perform dry cutting while cooling. It attempts to provide a method for doing so. By using liquid nitrogen as an inert gas and vaporizing it at the cutting position, oxygen can be removed from the cutting area and cooling can also be performed.
以下、本発明の一実施例を図面に基き説明す
る。 Hereinafter, one embodiment of the present invention will be described based on the drawings.
１は、シリコンウエハその他の被切削物であつ
て、切削時に冷却水を使用することのできないも
のである。このシリコンウエハ１は、受台２上に
真空吸着等によつて固定されている。この受台２
は、上下および角度調整が可能で、かつ切削時に
は、回転砥石刃３と平行でかつ水平方向に移動す
るようになつている。 1 is a silicon wafer or other workpiece to be cut, and cooling water cannot be used during cutting. This silicon wafer 1 is fixed onto a pedestal 2 by vacuum suction or the like. This pedestal 2
can be adjusted vertically and angularly, and is adapted to move horizontally parallel to the rotary grindstone blade 3 during cutting.
前記受台２の上部には、回転軸４が軸方向に進
退自在に設けられ、この回転軸４の先端には、厚
さが数十μｍのダイヤモンドブレード等からなる
回転砥石刃３が取付けられている。この回転砥石
刃３の下面を除いた外周囲にホイールカバー５が
設けられている。この回転砥石刃３の切削位置に
臨ませてノズル６が開口され、このノズル６の導
管７は、バルブ８を介して、液体窒素９を収容し
栓１０で密閉された容器１１に連結されている。
この容器１１には、液体窒素９を沸騰させるため
のシーズヒータ１２が内蔵され、このヒータ１２
は、スイツチ１３を介して電源１４に接続されて
いる。前記容器１１には、また内圧調節管１５が
バルブ１６を介して大気に連通している。 A rotary shaft 4 is provided on the top of the pedestal 2 so as to be able to move forward and backward in the axial direction, and a rotary whetstone blade 3 made of a diamond blade or the like with a thickness of several tens of μm is attached to the tip of the rotary shaft 4. ing. A wheel cover 5 is provided around the outer periphery of the rotary grindstone blade 3 except for the lower surface thereof. A nozzle 6 is opened facing the cutting position of this rotary grindstone blade 3, and a conduit 7 of this nozzle 6 is connected via a valve 8 to a container 11 containing liquid nitrogen 9 and sealed with a stopper 10. There is.
This container 11 has a built-in sheathed heater 12 for boiling the liquid nitrogen 9, and this heater 12
is connected to a power source 14 via a switch 13. An internal pressure regulating pipe 15 is also connected to the atmosphere via a valve 16 in the container 11 .
このような構成において、スイツチ１３を閉
じ、シーズヒータ１２により加熱すると、容器１
１内の液体窒素９が沸騰し、容器１１内の圧力が
上昇し、導管７、バルブ８を介してノズル６から
冷却された窒素が気化噴出する。この窒素の噴出
により、回転砥石刃３の刃先およびシリコンウエ
ハ１の切削部分における酸素が遮断され、かつ冷
却されて切削がなされる。 In such a configuration, when the switch 13 is closed and the sheathed heater 12 is heated, the container 1
The liquid nitrogen 9 in the container 1 boils, the pressure in the container 11 rises, and the cooled nitrogen is vaporized and ejected from the nozzle 6 via the conduit 7 and the valve 8. This jetting of nitrogen blocks oxygen at the cutting edge of the rotary grindstone blade 3 and the cutting portion of the silicon wafer 1, and cools and cuts the silicon wafer 1.
冷却水を使用して切削する装置を用い、冷却水
に代えて本発明の方法を採用した場合の実験をし
たところ、つぎの結果が得られた。 When an experiment was conducted using a cutting device that uses cooling water and the method of the present invention was adopted instead of cooling water, the following results were obtained.
(1) 回転砥石刃３を第２図のように、シリコンウ
エハ１の上面から下面へ移動するように回転し
て切削（ダウンカツト）した場合、冷却水を使
用した切削より、本発明の方法はわずかチツピ
ングが多い程度でほとんど差異が認められなか
つた。(1) When the rotary grindstone blade 3 is rotated to cut the silicon wafer 1 so as to move from the upper surface to the lower surface as shown in FIG. Almost no difference was observed, with only a slight increase in chipping.
(2) 逆に冷却水も、また本発明の方法も採用しな
い完全な乾式切削ではかなりのクラツクや巨大
チツピングが発生した。(2) On the other hand, in completely dry cutting without using cooling water or the method of the present invention, considerable cracks and large chippings occurred.
(3) シリコンウエハ１の水平方向の送り速度（切
削速度）も、冷却水を使用した場合と本発明の
方法とではほとんど変りがなかつた。したがつ
て回転砥石刃３は、冷却水使用のときの標準型
であつても充分使用に耐えるものである。(3) The horizontal feed speed (cutting speed) of the silicon wafer 1 was also almost the same between the case where cooling water was used and the method of the present invention. Therefore, the rotary grindstone blade 3 can be used satisfactorily even if it is a standard type when using cooling water.
(4) 切削モードとして回転砥石刃３を、第３図の
矢印方向に回転し、シリコンウエハ１も矢印の
方向に移動したいわゆるアツパー切削では、ク
ラツクが入り、かつチツピングが生じて使用で
きなかつた。これは、ノズル６が１本であるた
め、切削位置の酸素の遮断と冷却とが不完全で
あつたためである。したがつて、回転砥石刃１
の両側から窒素を噴出すれば解決できる。(4) In so-called upper cutting, in which the rotary grindstone blade 3 is rotated in the direction of the arrow in FIG. 3 and the silicon wafer 1 is also moved in the direction of the arrow as a cutting mode, cracks and chipping occur, making it unusable. . This is because, since there was only one nozzle 6, oxygen cutoff and cooling at the cutting position were incomplete. Therefore, the rotary grindstone blade 1
This can be solved by blowing out nitrogen from both sides.
(5) 本発明による方法の問題点として、液体窒素
を用いることにより、シリコンウエハ１の表面
が必要以上に冷却されて結露現象を起こすおそ
れがある。そのため、本来の完全な乾式切削を
達成できなくなる。これは、液体窒素の量を加
減すること、液体窒素以外の常温の窒素、アル
ゴンその他の不活性ガスを使用することにより
解決できる。(5) A problem with the method according to the present invention is that by using liquid nitrogen, the surface of the silicon wafer 1 may be cooled more than necessary, causing dew condensation. Therefore, the original complete dry cutting cannot be achieved. This can be solved by controlling the amount of liquid nitrogen, or by using room temperature nitrogen, argon, or other inert gas other than liquid nitrogen.
なお、第１図において、容器１１の内圧が異
常に高くなると危険を伴うのでこのようなとき
は、内圧調節バルブ１６が開いて内圧を大気に
逃がすようになつている。 In FIG. 1, it is dangerous if the internal pressure of the container 11 becomes abnormally high, so in such a case, the internal pressure regulating valve 16 is opened to release the internal pressure to the atmosphere.
本発明は上述のように、被切削物の切削位置に
不活性ガスを噴射することによつて、酸素を遮断
し、かつ冷却しつつ切削を行うようにしたので、
酸素を遮断し、かつ冷却しつつ乾式で切削を行う
ことができる。このため、酸化防止等のため冷却
水を使用できないような硬質の被切削物の切削に
ついても、回転砥石刃を用いた切削装置を利用で
き、この種切削装置の利用範囲が非常に広くな
り、切削位置に臨ませて不活性ガスを噴出しつつ
切削するようにしたので、回転砥石刃３を用いた
切削装置でも乾式切削が可能となり、この種切削
装置の利用範囲が非常に広くなり、しかも、ポイ
ントスクライバ等の装置も不要であり、かつ相当
な厚さの被切削物１をも切断できるなどの効果を
有する。 As described above, the present invention injects inert gas into the cutting position of the workpiece to cut off oxygen and perform cutting while cooling.
Dry cutting can be performed while cutting off oxygen and cooling. For this reason, cutting equipment using rotary grindstone blades can be used even for cutting hard workpieces for which cooling water cannot be used to prevent oxidation, etc., and the scope of use of this type of cutting equipment has become extremely wide. By facing the cutting position and cutting while blowing out inert gas, dry cutting is possible even with a cutting device using a rotary grindstone blade 3, and the scope of use of this type of cutting device is greatly expanded. , there is no need for a device such as a point scriber, and it has the advantage of being able to cut even a workpiece 1 of considerable thickness.
第１図は本発明による乾式切削方法を実施する
ための装置の説明図、第２図および第３図は、切
削位置の拡大図である。
１……被切削物（シリコンウエハ）、２……受
台、３……回転砥石刃（ダイヤモンドホイール）、
４……回転軸、５……ホイールカバー、６……ノ
ズル、７……導管、８……バルブ、９……液体窒
素、１０……栓、１１……容器、１２……シーズ
ヒータ、１３……スイツチ、１４……電源、１５
……内圧調節管、１６……内圧調節バルブ。
FIG. 1 is an explanatory diagram of an apparatus for carrying out the dry cutting method according to the present invention, and FIGS. 2 and 3 are enlarged views of the cutting position. 1... object to be cut (silicon wafer), 2... pedestal, 3... rotary grindstone blade (diamond wheel),
4... Rotating shaft, 5... Wheel cover, 6... Nozzle, 7... Conduit, 8... Valve, 9... Liquid nitrogen, 10... Plug, 11... Container, 12... Sheathed heater, 13 ...Switch, 14...Power supply, 15
...Internal pressure control pipe, 16...Internal pressure control valve.
Claims (1)
る方法において、前記被切削物の切削位置に不活
性ガスを噴射することによつて、酸素を遮断し、
かつ冷却しつつ切削するようにしたことを特徴と
する乾式切削方法。 ２ 不活性ガスは液体窒素を気化させた低温の窒
素ガスとしてなる特許請求の範囲第１項記載の乾
式切削方法。[Claims] 1. A method for cutting a hard workpiece with a rotary grindstone blade, which includes cutting off oxygen by injecting an inert gas to the cutting position of the workpiece,
A dry cutting method characterized in that cutting is performed while cooling. 2. The dry cutting method according to claim 1, wherein the inert gas is a low-temperature nitrogen gas obtained by vaporizing liquid nitrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1871579A JPS55112761A (en) | 1979-02-20 | 1979-02-20 | Dry type cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1871579A JPS55112761A (en) | 1979-02-20 | 1979-02-20 | Dry type cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55112761A JPS55112761A (en) | 1980-08-30 |
| JPS6362339B2 true JPS6362339B2 (en) | 1988-12-02 |
Family
ID=11979346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1871579A Granted JPS55112761A (en) | 1979-02-20 | 1979-02-20 | Dry type cutting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55112761A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0418265A (en) * | 1990-05-02 | 1992-01-22 | Ninben:Kk | Beverage pack containing choice beverage raw material |
| JPH0418266A (en) * | 1990-05-12 | 1992-01-22 | Ninben:Kk | Liquid pack containing beverage raw material |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56111622A (en) * | 1980-02-06 | 1981-09-03 | Tokyo Shibaura Electric Co | Blade dieing device |
| JPS57203553U (en) * | 1981-06-23 | 1982-12-24 | ||
| JPS58426U (en) * | 1981-06-25 | 1983-01-05 | 日本電気ホームエレクトロニクス株式会社 | dicing equipment |
| JPS63256319A (en) * | 1987-04-11 | 1988-10-24 | Nippon Jiryoku Senko Kk | Manufacture of short metal filament |
| AT399119B (en) * | 1989-11-29 | 1995-03-27 | Lehner Wolfgang | PLANT FOR PRODUCING THIN, SURFACE-TREATED STONE PLATES |
| JP2568975B2 (en) * | 1993-08-26 | 1997-01-08 | 山口県 | Dry grinding method and equipment |
| AU2003283553A1 (en) * | 2003-04-01 | 2004-10-25 | Unova U.K. Limited | Workpiece cooling during grinding |
| US20080083566A1 (en) * | 2006-10-04 | 2008-04-10 | George Alexander Burnett | Reclamation of components of wellbore cuttings material |
| US9073104B2 (en) | 2008-08-14 | 2015-07-07 | National Oilwell Varco, L.P. | Drill cuttings treatment systems |
| US8556083B2 (en) | 2008-10-10 | 2013-10-15 | National Oilwell Varco L.P. | Shale shakers with selective series/parallel flow path conversion |
| US9079222B2 (en) | 2008-10-10 | 2015-07-14 | National Oilwell Varco, L.P. | Shale shaker |
| DE102009040665B4 (en) * | 2009-09-09 | 2012-08-30 | HK Präzisionstechnik GmbH | Method and separation system with apparatus for separating processing of crystalline materials |
| DE102011003714B8 (en) * | 2011-02-07 | 2012-08-30 | Mag Ias Gmbh | Machining device for machining crankshafts and processing system with such a processing device |
| TWI483911B (en) * | 2011-09-28 | 2015-05-11 | Mitsuboshi Diamond Ind Co Ltd | Scribing apparatus |
| JP2013071871A (en) * | 2011-09-28 | 2013-04-22 | Mitsuboshi Diamond Industrial Co Ltd | Scribing device |
| US9643111B2 (en) | 2013-03-08 | 2017-05-09 | National Oilwell Varco, L.P. | Vector maximizing screen |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2182952A (en) * | 1938-04-30 | 1939-12-12 | Hanson Van Winkle Munning Co | Air conditioned buffing and polishing system |
| US2635399A (en) * | 1951-04-19 | 1953-04-21 | Thompson Prod Inc | Method for grinding carbide tools |
| JPS5128754A (en) * | 1974-09-04 | 1976-03-11 | Hitachi Ltd |
-
1979
- 1979-02-20 JP JP1871579A patent/JPS55112761A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2182952A (en) * | 1938-04-30 | 1939-12-12 | Hanson Van Winkle Munning Co | Air conditioned buffing and polishing system |
| US2635399A (en) * | 1951-04-19 | 1953-04-21 | Thompson Prod Inc | Method for grinding carbide tools |
| JPS5128754A (en) * | 1974-09-04 | 1976-03-11 | Hitachi Ltd |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0418265A (en) * | 1990-05-02 | 1992-01-22 | Ninben:Kk | Beverage pack containing choice beverage raw material |
| JPH0418266A (en) * | 1990-05-12 | 1992-01-22 | Ninben:Kk | Liquid pack containing beverage raw material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55112761A (en) | 1980-08-30 |
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