JPS6362298A - Manufacture of through-hole printed board - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a quick and inexpensive method for manufacturing silver through-hole printed circuit boards.

<Prior Art> Conventionally, through holes are formed by the procedure shown in FIGS. 6 to 10.

That is, first, fA foil plates 1 for printed wiring are attached to both sides of a base material 3 such as paper phenol, paper epoxy, combobutte, etc.
A punching hole 4 is formed between two holes (FIG. 7), and a container 5 in which silver paste 7 is stored in advance is appropriately placed directly below the punching hole 4, and the punching hole is opened toward the silver paste 7. 4, the pin 6a is lowered and entered from above (Fig. 8), and with the silver paste (7+) in the container 5 attached to the tip of the pin 6a, the pin 6a is raised again (
tj&9 figure).

At this time, since the silver paste is attached to the periphery of the pin 6a larger than the outer diameter of the pin, when the pin 6a is removed from the punching hole 4, the outer periphery of the pin is pulled into the punching hole 4, and the silver paste 72 is removed. It adheres to the punched hole 4 to form a silver through hole as shown in FIG.

<Problems to be Solved by the Invention> However, in the above-mentioned conventional method, since the silver paste adhering to the periphery of the pin 6a is removed through the punching hole 4, the silver paste adheres to the pin 6a. Since the formation of a through hole is determined by the amount of silver paste and the adhesion force of the silver paste to the punched hole 4, if the pin 6a is pulled out from the punched hole 4 at high speed, a complete through hole will not be formed.

Therefore, the speed at which the pins are removed has to be slow, which takes too much time, resulting in poor workability and impeding productivity improvement.

Measures to solve the gap m point> Punching holes are formed between the copper foil plates for printed wiring provided on both sides via a base material such as paper phenol, paper epoxy, or Funposite, and the fixed amount is filled in the punched holes. The silver paste is extruded all at once from a suction type extrusion device to form silver through holes.

<Operation> The amount of silver paste necessary for molding one through hole is sucked into a metered suction type extrusion device and injected at once toward the punched hole.

<Examples> The present invention will be described in detail below using examples shown in the drawings.

Printed wiring body foil plates 1 and 2 are inseparably attached to both sides of a base material 3 such as paper phenol, paper epoxy, and Funposit.
The diameter between the f14ri plates 1 and 2 of the base material 3 is 0.5~
After forming a punching hole of 1.0 [φ] (Fig. 2),
A silver paste container 5 containing silver paste 7 is placed directly below the punching hole 4, and the lower end of the discharge pipe 6 into which the piston 8 is inserted is inserted downward toward the punching hole, and its tip is inserted into the punching hole. Infiltrate the silver paste container 5.

Then, the amount of silver paste in the container 5 is sucked into the discharge tube 6 in a fixed quantity, that is, the amount necessary to form one through hole (Fig. 3), and then the discharge tube 6 in this state is inserted into the punched hole 4.
After removing the silver paste from the punching hole 4, the tip of the silver paste is slightly stopped at a position close to the edge of the punching hole 4, and then a certain amount of the silver paste 7□ sucked into the inside is extruded into the punching hole 4 at once. 4), while the silver paste 72 adheres to the periphery of the punched hole 4, a silver through hole 7 is formed spanning the tRM plates 1 and 2 on both sides (FIG. 5).

<Effects of the Invention> According to the method of the present invention, since the extrusion device extrudes the material from the discharge pipe to the punching hole all at once, a slow operation speed is required, unlike the conventional method in which the material adhered to the pin is secondarily deposited. You can work at high speed without having to worry about it, increasing productivity and making it easier to go online.

[Brief explanation of the drawing]

1 to 5 show an embodiment of the method of the invention. Figure 1 is a partial vertical cross-sectional view of the printed circuit board before processing, Figure 2 is a partial vertical cross-sectional view with a punched hole in the same above, and Figure 3 is a partial vertical cross-sectional view of the printed circuit board with a punched hole in the same above. A vertical cross-sectional view, Figure i%4 is a partial vertical cross-sectional view showing the state at the moment when the silver paste in the discharge tube is injected, Figure 5 is a partial vertical cross-sectional view showing the through hole completed state, Figures 6 to 10 indicates the conventional method. Figure 6 is a partial vertical cross-sectional view of the printed circuit board before processing, Figure 7 is a partial vertical cross-sectional view with punched holes provided, and Figure 8 is a partial vertical cross-sectional view of the printed circuit board with pins inserted into the punched holes. 9 is a partial longitudinal sectional view showing a state in which the pin is being pulled out, and FIG. 10 is a partial vertical sectional view showing the through hole in a completed state. 1.2... Copper foil plate, 3... Base material such as paper phenol, paper epoxy, combo knot, etc. 4... Punching hole, 5... Container 6... Discharge pipe, 7□72...・Silver paste 7,...Silver through hole

Claims (1)

[Claims] 1. A punching hole is formed between the copper foil plates for printed wiring attached on both sides of a base material such as paper phenol, paper epoxy, or composite, and 1 To form the through holes, a required amount of silver paste is sucked into an extrusion device, and the silver paste is extruded all at once from a discharge pipe of the extrusion device toward the punched holes to form the through holes. A method for manufacturing a through-hole printed circuit board.