JPS61136286A - Manufacture of flexible printed circuit board - Google Patents
Manufacture of flexible printed circuit boardInfo
- Publication number
- JPS61136286A JPS61136286A JP25946784A JP25946784A JPS61136286A JP S61136286 A JPS61136286 A JP S61136286A JP 25946784 A JP25946784 A JP 25946784A JP 25946784 A JP25946784 A JP 25946784A JP S61136286 A JPS61136286 A JP S61136286A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- printed wiring
- wiring board
- flexible
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明はラジオ受信機やテープレコーダ全量産すること
ができるフレキンプル印刷配線基板の製造法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing flexible printed circuit boards that can be used to mass produce radio receivers and tape recorders.
従来の技術
近年、電子機器は小型化、軽′ｉ１：、化、薄形化、高
密度実装化が急速に進められており、これ全実現する有
効な手段の一つとしてフレキ／プル印刷配線板が注目さ
れている。Conventional technology In recent years, electronic devices have been rapidly becoming smaller, lighter, thinner, and more densely packaged, and flexible/pull printed wiring is one of the effective means to achieve all of these. The board is attracting attention.
以下１図面を参照しながら従来のフレキンプル印刷配線
板の製造法について説明する。A conventional method for manufacturing a flexible printed wiring board will be described below with reference to one drawing.
第３図、第４図は従来のフレキシブル印刷配線られてい
る。４はフレキシブル印刷配線板の外形切断線、６は外
形切断線４に接するように設けられた孔である。このフ
レキシブル印刷配線板には第４図に示すようにチップ型
電子部品８１機溝部品６．挿入型電子部品７が実装され
る。3 and 4 show conventional flexible printed wiring. Reference numeral 4 indicates an outer cutting line of the flexible printed wiring board, and 6 indicates a hole provided so as to be in contact with the outer cutting line 4. As shown in FIG. 4, this flexible printed wiring board includes a chip-type electronic component 81, a groove component 6. The insertion type electronic component 7 is mounted.
以上のように構成されたフレキ７ブル印刷配線板につい
て、以下その詳細を説明する。まず、フレキシブル印刷
配線板に外形切断線４に接するように孔５をあけ、エツ
チング等により導電箔回路を形成する。次に部品全実装
し、半田付け？した後に金型により外形切断線４から切
り離す。The details of the flexible printed wiring board configured as described above will be explained below. First, a hole 5 is made in the flexible printed wiring board so as to be in contact with the outline cutting line 4, and a conductive foil circuit is formed by etching or the like. Next, mount all the parts and solder them? After that, it is cut away from the outer cutting line 4 using a mold.
発明が解決しようとする問題点
ところが、このようなフレキンプル印刷配線板の生産工
程においては１機構部品６の実装、自動半田付は全行な
う際、孔５からフラックスのガスが上昇し、機構部品６
の接点に付着し、接点不良音引き起こすという問題があ
る。このため、従来からフラックス上りを防止するため
、外形切断線に接した孔６、つまり機構部品６の直下に
ある孔６に耐熱性のあるテープでマスキングをし、自動
’ｔ’＝ＩＩｉ付は全行なっていたが、この方法ではマ
スキング金する際、位置決め精度が必要であると共にマ
スキングに関する費用が大きくなるという欠点を有して
いた。Problems to be Solved by the Invention However, in the production process of such flexible printed wiring boards, when mounting and automatic soldering of one mechanical component 6 is carried out, flux gas rises from the hole 5 and the mechanical component 6
There is a problem that it adheres to the contacts and causes contact failure noise. For this reason, in order to prevent flux build-up, the hole 6 that is in contact with the external cut line, that is, the hole 6 directly below the mechanical component 6, is masked with heat-resistant tape, and the automatic 't' = IIi attachment is However, this method has the disadvantage that positioning accuracy is required when masking, and the cost associated with masking increases.
本発明はこのような従来の問題点を解消するものであり
、簡単な構成でフラックス上りを防止することができ、
機構部品の自動半田付けを行なうことにより工数低減及
びｆＪ！構部品の接点不良全４くすることができるフレ
キンプル印刷配線板の製造法を提供するものである。The present invention solves these conventional problems, and can prevent flux build-up with a simple configuration.
Automatic soldering of mechanical parts reduces man-hours and improves fJ! The present invention provides a method for manufacturing a flexible printed wiring board that can eliminate all contact defects of component parts.
問題点を解決するための手段
本発明のフレキシブル印刷配線板は、部品挿入孔を打抜
くと同時にフレキンプル印刷配線板のベース材のみにエ
ンヂの鋭いカッター状の刃物でスリット加工を施し、エ
ツチングによってそのスリット加工の銅箔を除去するこ
とにより、外形切断線と接した孔と同等の役目をはたす
ようにしたことを特長とするものである。Means for Solving the Problems In the flexible printed wiring board of the present invention, at the same time as punching out the component insertion holes, slits are made only in the base material of the flexible printed wiring board using a sharp cutter-like knife, and the slits are formed by etching. The feature is that by removing the slit-processed copper foil, it serves the same role as a hole in contact with the outer cutting line.
作用
本発明のフレキシブル印刷配線板は、機構部品の直下部
にあるフレキシブル基材のベース材のみに細いスリット
を設け、このスリット部分の銅箔金工・ンチングで除去
しているため、従来のように孔がおいているものと異な
りマスキングをした状態となり、自動半田付は時のフラ
ックス上りがなくなり、機構部品の接点不良を未然に防
止することができる。Function: The flexible printed wiring board of the present invention has thin slits only in the base material of the flexible substrate directly below the mechanical parts, and the slits are removed by copper foil metalworking and nching, so it is not as easy as conventional methods. Unlike those with holes, they are in a masked state, and automatic soldering eliminates flux build-up during soldering, making it possible to prevent contact failures of mechanical parts.
実施例
以下、本発明の実施例のフレキシブル印刷配線板全図面
全参照して説明する。第１図は本発明の一実施例におけ
るフレキシブル印刷配線板の部品実装後の断面図を示す
ものである。第１図において、９は打抜き加工時にフレ
キンプル基材のベース材３のみにエッヂの鋭いカッター
状の刃物で形成したスリットであり、このスリット加工
を施した部分の銅箔はエツチングにより除去されている
。Embodiments Hereinafter, flexible printed wiring boards according to embodiments of the present invention will be explained with reference to all the drawings. FIG. 1 shows a cross-sectional view of a flexible printed wiring board according to an embodiment of the present invention after components are mounted. In Fig. 1, 9 is a slit formed only in the base material 3 of the flexible base material with a sharp cutter-like blade during the punching process, and the copper foil in the area where this slit process was performed is removed by etching. .
以下第２図全参照して本発明のフレキシブル印刷配線板
の製造方法を説明する。The method for manufacturing a flexible printed wiring board of the present invention will be described below with full reference to FIG.
まず帯状のフレキシブル基材３の片面の全面に亘って導
電箔２が形成されたフレキシブル素体１を順次送り出し
、孔明は工程１２でその素体１にプレス等により挿入型
電子部品７のリード挿入孔をあけると同時に工、ンヂの
鋭いカッター状の刃でベース材３のみにスリット９を設
ける。次にエツチング工程１３で回路用導電箔１１が形
成されると同時に機構部品６の直下部の不要部の導電箔
１０が除去される。この上うにして形成されたフレキン
プル印刷配線板は部品取付工程１４に送られリードレス
電子部品８が取付けられる。次に挿入型電子部品取付工
程１５にて挿入型電子部品７が挿入され、自動半田付工
程１６で半田付けされる。次に切断工程１７では極めて
細い刃先の力、フタ−１８により形成された打抜きパｖ
１９でフレキシブル印刷配線板の外形切断線４にそって
切り落とし、電子回路装置２ｏが形成される。First, the flexible element body 1 on which the conductive foil 2 is formed over the entire surface of one side of the band-shaped flexible base material 3 is sent out one after another, and in step 12, Komei inserts the lead of the insertion type electronic component 7 into the element body 1 by pressing or the like. At the same time as drilling the hole, a slit 9 is made only in the base material 3 using a sharp cutter-like blade. Next, in an etching step 13, the circuit conductive foil 11 is formed, and at the same time, unnecessary portions of the conductive foil 10 immediately below the mechanical component 6 are removed. The flexible printed wiring board thus formed is sent to a component attaching step 14, where leadless electronic components 8 are attached. Next, the insertion type electronic component 7 is inserted in an insertion type electronic component mounting process 15 and soldered in an automatic soldering process 16. Next, in the cutting step 17, the force of the extremely thin cutting edge is applied to the punching hole V formed by the lid 18.
At step 19, the flexible printed wiring board is cut off along the outer cutting line 4 to form the electronic circuit device 2o.
発明の効果
以上のように本発明によれば、フレキシブル印刷配線板
に実装全行なった機構部品の直下に当る部分の不要部の
導電箔ケエッチングにより除去し、その部分のベースフ
ィルムのみに形成したスリット全露出させるようにした
のでそのスリットにてマスキング効果音はたし、自動半
田付は時のフタ、ジス上りがなくなり、機構部品の接点
不良をなくすることができる。又、スリ・シトはフレキ
シブル印刷配線板の外形切断線と接しているため、電子
部品１機構部品を半田付けした後、その部分を除いて型
で打抜くことが可能であり、基板製作時の工数低減を図
ることができる。Effects of the Invention As described above, according to the present invention, unnecessary portions of the conductive foil directly under the mechanical components fully mounted on the flexible printed wiring board are removed by etching, and the conductive foil is formed only on the base film in that portion. Since the slit is fully exposed, the masking sound effect is produced by the slit, and automatic soldering eliminates the need for lids and stagnation, and eliminates contact failures of mechanical parts. In addition, since the pick-up line is in contact with the outline cutting line of the flexible printed wiring board, after soldering the electronic component 1 mechanical part, it is possible to punch out with a die excluding that part, making it easy to use when manufacturing the board. It is possible to reduce the number of man-hours.
第１図は本発明のフレキ・／プル印刷配線板の−実施例
全示す断面図、第２図は同フレキンプル印刷配線板の工
程説明図、第３図は従来のフレキンプル印刷配線板の平
面図、第４図は同フレキ／プル印刷配線板の断面図であ
る。
９・・・・・・スリット、１０・−・・・・エツチング
よす銅箔を除去した部分、１１・・・・・・回路用導電
箔。
代理人の氏名 弁理士 中 尾 敏 男 はが１名３−
−〜−Ｚ訂
９−一−スリづ１
ｔｏ−−−１・辻−フ゛ドより負Ｍ↓６８計しに會ｐザ
しＤ
ｊ２・−ＩＴＪｉ３１４％
ＩＪ−−一挿纏臂■陽和江貸
ｔｔ−ｆＪ勤デ１付Ｉ＃
ｆ９−’！Fig. 1 is a cross-sectional view showing all embodiments of the flexible/pull printed wiring board of the present invention, Fig. 2 is a process explanatory diagram of the flexible/pull printed wiring board, and Fig. 3 is a plan view of a conventional flexible/pull printed wiring board. , FIG. 4 is a sectional view of the same flexible/pull printed wiring board. 9... Slit, 10... Part from which the etched copper foil has been removed, 11... Conductive foil for circuit. Name of agent: Patent attorney Toshio Nakao, 1 person, 3-
-～-Z-edition 9-1-slip 1 to---1・Tsuji-field from negative M ↓ 68 plan to meet D j2・-ITJi314% IJ--1 insertion arm ■Yowae Rental tt-fJ workday 1 included I# f9-'!
Claims (1)
ル素材の銅箔をエッチングにて除去することにより基板
外形の切断部の一部とし、その後上記エッチングにて形
成された銅箔に半田付けすることを特徴とするフレキシ
ブル印刷配線板の製造法。The feature is that a flexible material copper foil with slits applied only to the base film is removed by etching to form a part of the cut part of the board outline, and then soldered to the copper foil formed by the above etching. A method for manufacturing flexible printed wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25946784A JPS61136286A (en) | 1984-12-07 | 1984-12-07 | Manufacture of flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25946784A JPS61136286A (en) | 1984-12-07 | 1984-12-07 | Manufacture of flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61136286A true JPS61136286A (en) | 1986-06-24 |
Family
ID=17334476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25946784A Pending JPS61136286A (en) | 1984-12-07 | 1984-12-07 | Manufacture of flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61136286A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63150952A (en) * | 1986-12-15 | 1988-06-23 | Matsushita Electric Works Ltd | Manufacture of semiconductor chip carrier |
-
1984
- 1984-12-07 JP JP25946784A patent/JPS61136286A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63150952A (en) * | 1986-12-15 | 1988-06-23 | Matsushita Electric Works Ltd | Manufacture of semiconductor chip carrier |
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