JPS6362092B2 - - Google Patents

Info

Publication number
JPS6362092B2
JPS6362092B2 JP15645882A JP15645882A JPS6362092B2 JP S6362092 B2 JPS6362092 B2 JP S6362092B2 JP 15645882 A JP15645882 A JP 15645882A JP 15645882 A JP15645882 A JP 15645882A JP S6362092 B2 JPS6362092 B2 JP S6362092B2
Authority
JP
Japan
Prior art keywords
reaction chamber
vapor phase
semiconductor substrate
phase generation
sensitizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15645882A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5946034A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15645882A priority Critical patent/JPS5946034A/ja
Publication of JPS5946034A publication Critical patent/JPS5946034A/ja
Publication of JPS6362092B2 publication Critical patent/JPS6362092B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/482Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using incoherent light, UV to IR, e.g. lamps
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/488Protection of windows for introduction of radiation into the coating chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
JP15645882A 1982-09-08 1982-09-08 光化学気相生成方法および装置 Granted JPS5946034A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15645882A JPS5946034A (ja) 1982-09-08 1982-09-08 光化学気相生成方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15645882A JPS5946034A (ja) 1982-09-08 1982-09-08 光化学気相生成方法および装置

Publications (2)

Publication Number Publication Date
JPS5946034A JPS5946034A (ja) 1984-03-15
JPS6362092B2 true JPS6362092B2 (enrdf_load_stackoverflow) 1988-12-01

Family

ID=15628186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15645882A Granted JPS5946034A (ja) 1982-09-08 1982-09-08 光化学気相生成方法および装置

Country Status (1)

Country Link
JP (1) JPS5946034A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60216549A (ja) * 1984-04-12 1985-10-30 Fuji Electric Corp Res & Dev Ltd 半導体装置の製造方法
JPS60216555A (ja) * 1984-04-12 1985-10-30 Fuji Electric Corp Res & Dev Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS5946034A (ja) 1984-03-15

Similar Documents

Publication Publication Date Title
JP3148004B2 (ja) 光cvd装置及びこれを用いた半導体装置の製造方法
EP0168768B1 (en) Dry etching process and apparatus
JPS6362092B2 (enrdf_load_stackoverflow)
TW564480B (en) Method and apparatus for radical oxidation of silicon
JPH06302525A (ja) 気相反応装置
JPS61141141A (ja) ドライエツチング装置
JPH01175231A (ja) アッシング方法
JP2005294551A (ja) シリコン系被処理物の酸化処理方法、酸化処理装置および半導体装置の製造方法
JPS61166975A (ja) 成膜方法
JPS60202928A (ja) 光励起反応装置
JPS5987041A (ja) 気相成長法
JPS58119334A (ja) 光化学反応蒸着方法
JPS61288431A (ja) 絶縁層の製造方法
JPS6028225A (ja) 光気相成長法
JPS6272114A (ja) ラジカルビ−ム光cvd装置
JPS6156279A (ja) 成膜方法
JPS6156278A (ja) 成膜方法
JPH02234429A (ja) 窒化シリコン膜の製造方法
JPH0563552B2 (enrdf_load_stackoverflow)
JP2667930B2 (ja) 微細加工方法及び装置
JPS62127472A (ja) 薄膜形成装置
JPS60124816A (ja) 薄膜成長方法
JPS6214225B2 (enrdf_load_stackoverflow)
JPS60182127A (ja) 光励起反応装置
JPS6027124A (ja) 光プラズマ気相反応法