JPS636150B2 - - Google Patents

Info

Publication number
JPS636150B2
JPS636150B2 JP56008755A JP875581A JPS636150B2 JP S636150 B2 JPS636150 B2 JP S636150B2 JP 56008755 A JP56008755 A JP 56008755A JP 875581 A JP875581 A JP 875581A JP S636150 B2 JPS636150 B2 JP S636150B2
Authority
JP
Japan
Prior art keywords
cooling
self
wind tunnel
outside air
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56008755A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57122553A (en
Inventor
Juji Sugino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56008755A priority Critical patent/JPS57122553A/ja
Publication of JPS57122553A publication Critical patent/JPS57122553A/ja
Publication of JPS636150B2 publication Critical patent/JPS636150B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56008755A 1981-01-23 1981-01-23 Self-cooling type semiconductor device Granted JPS57122553A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56008755A JPS57122553A (en) 1981-01-23 1981-01-23 Self-cooling type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56008755A JPS57122553A (en) 1981-01-23 1981-01-23 Self-cooling type semiconductor device

Publications (2)

Publication Number Publication Date
JPS57122553A JPS57122553A (en) 1982-07-30
JPS636150B2 true JPS636150B2 (cs) 1988-02-08

Family

ID=11701735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56008755A Granted JPS57122553A (en) 1981-01-23 1981-01-23 Self-cooling type semiconductor device

Country Status (1)

Country Link
JP (1) JPS57122553A (cs)

Also Published As

Publication number Publication date
JPS57122553A (en) 1982-07-30

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