JPS6361130U - - Google Patents
Info
- Publication number
- JPS6361130U JPS6361130U JP15588786U JP15588786U JPS6361130U JP S6361130 U JPS6361130 U JP S6361130U JP 15588786 U JP15588786 U JP 15588786U JP 15588786 U JP15588786 U JP 15588786U JP S6361130 U JPS6361130 U JP S6361130U
- Authority
- JP
- Japan
- Prior art keywords
- mold plates
- transfer pot
- tablet
- plunger
- pressurizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
図は本考案に係る半導体装置の樹脂封止装置を
示す断面図である。
１……上側の型板、３……定盤、４……キヤビ
テイ、５……チエイスブロツク、８……下側の型
板、１０……定盤、１１……キヤビテイ、１２…
…チエイスブロツク、１３……プランジヤー、１
４……トランスフアポツト、１４ａ……タブレツ
ト投入口、１５，１６……シールブロツク、Ｂ…
…レジンタブレツト。
The figure is a sectional view showing a resin sealing device for a semiconductor device according to the present invention. 1... Upper template, 3... Surface plate, 4... Cavity, 5... Chase block, 8... Lower template, 10... Surface plate, 11... Cavity, 12...
... Chase block, 13 ... Plunger, 1
4...Transfer pot, 14a...Tablet slot, 15, 16...Seal block, B...
...Resin tablet.
Claims (1)
ヤビテイを有する上下２つの型板と、これら両型
板の周囲に各々配設された環状のシールブロツク
とを備え、前記両型板のうち下側の型板内にタブ
レツト加圧用のプランジヤーがその内部を進退す
るトランスフアポツトを取り付け、このトランス
フアポツトのタブレツト投入口はパーテイング面
側に開口されていることを特徴とする半導体装置
の樹脂封止装置。 It is equipped with two upper and lower mold plates each having a cavity forming a package for sealing a semiconductor chip, and annular seal blocks disposed around the two mold plates. A resin sealing device for a semiconductor device, characterized in that a transfer pot through which a plunger for pressurizing the tablet advances and retreats inside the plate is installed, and a tablet inlet of the transfer pot is opened on the parting surface side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986155887U JPH0533007Y2 (en) | 1986-10-09 | 1986-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986155887U JPH0533007Y2 (en) | 1986-10-09 | 1986-10-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6361130U true JPS6361130U (en) | 1988-04-22 |
| JPH0533007Y2 JPH0533007Y2 (en) | 1993-08-23 |
Family
ID=31076995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986155887U Expired - Lifetime JPH0533007Y2 (en) | 1986-10-09 | 1986-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0533007Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6032619A (en) * | 1983-08-03 | 1985-02-19 | Toshiba Corp | Low-pressure transfer molding method |
-
1986
- 1986-10-09 JP JP1986155887U patent/JPH0533007Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6032619A (en) * | 1983-08-03 | 1985-02-19 | Toshiba Corp | Low-pressure transfer molding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0533007Y2 (en) | 1993-08-23 |