JPH0186243U - - Google Patents
Info
- Publication number
- JPH0186243U JPH0186243U JP18309087U JP18309087U JPH0186243U JP H0186243 U JPH0186243 U JP H0186243U JP 18309087 U JP18309087 U JP 18309087U JP 18309087 U JP18309087 U JP 18309087U JP H0186243 U JPH0186243 U JP H0186243U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- thermocouple
- sealing
- resin
- detecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は、本考案に係る樹脂封止装置の要部を
示す断面図、第２図は従来の樹脂封止装置の要部
を示す断面図である。
図において、１はヒータ、２，３は熱電対、５
は熱盤、６はチエイスブロツクである。なお、各
図中、同一符号は同一、又は相当部分を示す。
FIG. 1 is a sectional view showing the main parts of a resin sealing device according to the present invention, and FIG. 2 is a sectional view showing the main parts of a conventional resin sealing device. In the figure, 1 is a heater, 2 and 3 are thermocouples, and 5
is a heating plate, and 6 is a chase block. In each figure, the same reference numerals indicate the same or equivalent parts.
Claims (1)
パーテイング面の表面近傍の温度を検出する熱電
対を金型に配置したことを特徴とする半導体装置
の樹脂封止装置。 1. An apparatus for resin-sealing a semiconductor device, characterized in that a thermocouple for detecting the temperature near the surface of a mold parting surface is disposed in the mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18309087U JPH0186243U (en) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18309087U JPH0186243U (en) | 1987-11-30 | 1987-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0186243U true JPH0186243U (en) | 1989-06-07 |
Family
ID=31474523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18309087U Pending JPH0186243U (en) | 1987-11-30 | 1987-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0186243U (en) |
-
1987
- 1987-11-30 JP JP18309087U patent/JPH0186243U/ja active Pending
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