JPS6360291U - - Google Patents
Info
- Publication number
- JPS6360291U JPS6360291U JP15320686U JP15320686U JPS6360291U JP S6360291 U JPS6360291 U JP S6360291U JP 15320686 U JP15320686 U JP 15320686U JP 15320686 U JP15320686 U JP 15320686U JP S6360291 U JPS6360291 U JP S6360291U
- Authority
- JP
- Japan
- Prior art keywords
- heating
- heater block
- ceramic
- temperature
- heating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims 4
- 238000003475 lamination Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Control Of Resistance Heating (AREA)
- Resistance Heating (AREA)
Description
第1図は本考案の実施例の加熱装置を示す平面
図、第2図はその断面図、第3図は従来の加熱装
置を示す平面図、第4図はその断面図である。
5……リードフレーム、6……半導体装置本体
、7……本実施例の加熱装置、8……ヒータブロ
ツク、9……加熱体、10……測温体。
FIG. 1 is a plan view showing a heating device according to an embodiment of the present invention, FIG. 2 is a sectional view thereof, FIG. 3 is a plan view showing a conventional heating device, and FIG. 4 is a sectional view thereof. 5...Lead frame, 6...Semiconductor device main body, 7...Heating device of this embodiment, 8...Heater block, 9...Heating body, 10...Temperature measuring body.
Claims (1)
熱する加熱体と該ヒータブロツクの温度を測定す
る測温体とを設けると共に、該ヒータブロツクに
被加熱体を取り付けて加熱するようにした加熱装
置において、 上記ヒータブロツクをセラミツクスで成形する
と共に、上記測温体を被加熱体取付部の近傍に位
置させ、且つ上記加熱体と上記測温体とを相互に
対面するように配置して構成したことを特徴とす
る加熱装置。 (2) 上記セラミツクスが積層体でなることを特
徴とする実用新案登録請求の範囲第1項記載の加
熱装置。 (3) 上記加熱体と上記測温体とが、積層前の上
記セラミツクスに印刷され、積層後の上記セラミ
ツクスに一体化されたことを特徴とする実用新案
登録請求の範囲第2項記載の加熱装置。[Scope of Claim for Utility Model Registration] (1) A heating element for heating the heater block and a temperature measuring element for measuring the temperature of the heater block are provided in the heater block, and a heated body is attached to the heater block. In the heating device for heating, the heater block is molded from ceramics, the temperature sensing element is located near the heated object attachment part, and the heating element and the temperature sensing element face each other. A heating device characterized by being arranged and configured as follows. (2) The heating device according to claim 1, wherein the ceramic is a laminate. (3) The heating according to claim 2 of the utility model registration claim, characterized in that the heating body and the temperature measuring body are printed on the ceramic before lamination and are integrated into the ceramic after lamination. Device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15320686U JPS6360291U (en) | 1986-10-07 | 1986-10-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15320686U JPS6360291U (en) | 1986-10-07 | 1986-10-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6360291U true JPS6360291U (en) | 1988-04-21 |
Family
ID=31071884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15320686U Pending JPS6360291U (en) | 1986-10-07 | 1986-10-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6360291U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54158738A (en) * | 1978-05-24 | 1979-12-14 | Hitachi Chem Co Ltd | Ceramic heater |
-
1986
- 1986-10-07 JP JP15320686U patent/JPS6360291U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54158738A (en) * | 1978-05-24 | 1979-12-14 | Hitachi Chem Co Ltd | Ceramic heater |
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