JPS6437680U - - Google Patents

Info

Publication number
JPS6437680U
JPS6437680U JP13239087U JP13239087U JPS6437680U JP S6437680 U JPS6437680 U JP S6437680U JP 13239087 U JP13239087 U JP 13239087U JP 13239087 U JP13239087 U JP 13239087U JP S6437680 U JPS6437680 U JP S6437680U
Authority
JP
Japan
Prior art keywords
block
groove
component
heat block
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13239087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13239087U priority Critical patent/JPS6437680U/ja
Publication of JPS6437680U publication Critical patent/JPS6437680U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案による実施例の構成図、第2
図は第1図の組立図、第3図は従来技術の構成図
、第4図はこの考案による他の実施例の構成図で
ある。 1……ヒートブロツク、2……ヒータ、3……
ブロツク、4……溝、5……部品、11……ヒー
トブロツク、12……ヒータ、14……溝。
Figure 1 is a configuration diagram of an embodiment according to this invention, Figure 2
The figures are an assembled view of FIG. 1, FIG. 3 is a block diagram of the prior art, and FIG. 4 is a block diagram of another embodiment according to this invention. 1... Heat block, 2... Heater, 3...
Block, 4... Groove, 5... Part, 11... Heat block, 12... Heater, 14... Groove.

Claims (1)

【実用新案登録請求の範囲】 ヒータ2で加熱されるヒートブロツク1と、 溝4を設け、溝4に部品5を入れるブロツク3
とを備え、 ヒートブロツク1とブロツク3が面接触するよ
うに構成し、ヒートブロツク1とブロツク3を連
結し、溝4内の部品5をヒートブロツク1で加熱
することを特徴とする部品加熱器。
[Claims for Utility Model Registration] A heat block 1 that is heated by a heater 2, and a block 3 that has a groove 4 and inserts a component 5 into the groove 4.
A component heater characterized in that the heat block 1 and the block 3 are configured so that they are in surface contact, the heat block 1 and the block 3 are connected, and the component 5 in the groove 4 is heated by the heat block 1. .
JP13239087U 1987-08-31 1987-08-31 Pending JPS6437680U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13239087U JPS6437680U (en) 1987-08-31 1987-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13239087U JPS6437680U (en) 1987-08-31 1987-08-31

Publications (1)

Publication Number Publication Date
JPS6437680U true JPS6437680U (en) 1989-03-07

Family

ID=31389304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13239087U Pending JPS6437680U (en) 1987-08-31 1987-08-31

Country Status (1)

Country Link
JP (1) JPS6437680U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6088436A (en) * 1983-10-21 1985-05-18 Nec Corp Screening device for semiconductor device
JPS6230163B2 (en) * 1977-06-09 1987-07-01 Colgate Palmolive Co
JPS62158340A (en) * 1986-01-06 1987-07-14 Hitachi Electronics Eng Co Ltd Preheating device in ic handler

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230163B2 (en) * 1977-06-09 1987-07-01 Colgate Palmolive Co
JPS6088436A (en) * 1983-10-21 1985-05-18 Nec Corp Screening device for semiconductor device
JPS62158340A (en) * 1986-01-06 1987-07-14 Hitachi Electronics Eng Co Ltd Preheating device in ic handler

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