JPS6360549B2 - - Google Patents
Info
- Publication number
- JPS6360549B2 JPS6360549B2 JP55020496A JP2049680A JPS6360549B2 JP S6360549 B2 JPS6360549 B2 JP S6360549B2 JP 55020496 A JP55020496 A JP 55020496A JP 2049680 A JP2049680 A JP 2049680A JP S6360549 B2 JPS6360549 B2 JP S6360549B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- oxidation
- substrate
- conductivity type
- impurity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2049680A JPS56118366A (en) | 1980-02-22 | 1980-02-22 | Preparation of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2049680A JPS56118366A (en) | 1980-02-22 | 1980-02-22 | Preparation of semiconductor device |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62266328A Division JPS63119250A (ja) | 1987-10-23 | 1987-10-23 | 半導体装置の製法 |
JP1245104A Division JPH02119172A (ja) | 1989-09-22 | 1989-09-22 | 半導体装置の製法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56118366A JPS56118366A (en) | 1981-09-17 |
JPS6360549B2 true JPS6360549B2 (en)van) | 1988-11-24 |
Family
ID=12028762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2049680A Granted JPS56118366A (en) | 1980-02-22 | 1980-02-22 | Preparation of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56118366A (en)van) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3314450A1 (de) * | 1983-04-21 | 1984-10-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von hochintegrierten komplementaeren mos-feldeffekttransistorschaltungen |
JPH0628297B2 (ja) * | 1983-11-28 | 1994-04-13 | 株式会社日立製作所 | 半導体装置の製造方法 |
JPS618931A (ja) * | 1984-06-25 | 1986-01-16 | Hitachi Ltd | 半導体装置の製造方法 |
JPS6144456A (ja) * | 1984-08-09 | 1986-03-04 | Fujitsu Ltd | 半導体装置の製造方法 |
JPS63119250A (ja) * | 1987-10-23 | 1988-05-23 | Hitachi Ltd | 半導体装置の製法 |
JPH02206162A (ja) * | 1989-02-06 | 1990-08-15 | Matsushita Electron Corp | 半導体装置の製造方法 |
WO1995022174A1 (en) * | 1994-02-15 | 1995-08-17 | National Semiconductor Corporation | High-voltage cmos transistors for a standard cmos process |
US5795809A (en) * | 1995-05-25 | 1998-08-18 | Advanced Micro Devices, Inc. | Semiconductor wafer fabrication process including gettering utilizing a combined oxidation technique |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5661139A (en) * | 1979-10-25 | 1981-05-26 | Seiko Epson Corp | Manufacture of semiconductor device |
-
1980
- 1980-02-22 JP JP2049680A patent/JPS56118366A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS56118366A (en) | 1981-09-17 |
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