JPS6359326U - - Google Patents
Info
- Publication number
- JPS6359326U JPS6359326U JP1986154185U JP15418586U JPS6359326U JP S6359326 U JPS6359326 U JP S6359326U JP 1986154185 U JP1986154185 U JP 1986154185U JP 15418586 U JP15418586 U JP 15418586U JP S6359326 U JPS6359326 U JP S6359326U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- semiconductor
- metal bumps
- wiring board
- bumps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986154185U JPH0436115Y2 (enExample) | 1986-10-07 | 1986-10-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986154185U JPH0436115Y2 (enExample) | 1986-10-07 | 1986-10-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6359326U true JPS6359326U (enExample) | 1988-04-20 |
| JPH0436115Y2 JPH0436115Y2 (enExample) | 1992-08-26 |
Family
ID=31073750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986154185U Expired JPH0436115Y2 (enExample) | 1986-10-07 | 1986-10-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436115Y2 (enExample) |
-
1986
- 1986-10-07 JP JP1986154185U patent/JPH0436115Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0436115Y2 (enExample) | 1992-08-26 |