JPS6359326U - - Google Patents
Info
- Publication number
- JPS6359326U JPS6359326U JP1986154185U JP15418586U JPS6359326U JP S6359326 U JPS6359326 U JP S6359326U JP 1986154185 U JP1986154185 U JP 1986154185U JP 15418586 U JP15418586 U JP 15418586U JP S6359326 U JPS6359326 U JP S6359326U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- semiconductor
- metal bumps
- wiring board
- bumps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/724—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986154185U JPH0436115Y2 (enExample) | 1986-10-07 | 1986-10-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986154185U JPH0436115Y2 (enExample) | 1986-10-07 | 1986-10-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6359326U true JPS6359326U (enExample) | 1988-04-20 |
| JPH0436115Y2 JPH0436115Y2 (enExample) | 1992-08-26 |
Family
ID=31073750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986154185U Expired JPH0436115Y2 (enExample) | 1986-10-07 | 1986-10-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436115Y2 (enExample) |
-
1986
- 1986-10-07 JP JP1986154185U patent/JPH0436115Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0436115Y2 (enExample) | 1992-08-26 |