JPS6359281B2 - - Google Patents
Info
- Publication number
- JPS6359281B2 JPS6359281B2 JP19441282A JP19441282A JPS6359281B2 JP S6359281 B2 JPS6359281 B2 JP S6359281B2 JP 19441282 A JP19441282 A JP 19441282A JP 19441282 A JP19441282 A JP 19441282A JP S6359281 B2 JPS6359281 B2 JP S6359281B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- lead
- adhesive layer
- outer peripheral
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000000605 extraction Methods 0.000 claims description 7
- 239000013078 crystal Substances 0.000 description 29
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19441282A JPS5985118A (ja) | 1982-11-05 | 1982-11-05 | 厚みすべり圧電振動子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19441282A JPS5985118A (ja) | 1982-11-05 | 1982-11-05 | 厚みすべり圧電振動子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5985118A JPS5985118A (ja) | 1984-05-17 |
| JPS6359281B2 true JPS6359281B2 (US06272168-20010807-M00014.png) | 1988-11-18 |
Family
ID=16324166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19441282A Granted JPS5985118A (ja) | 1982-11-05 | 1982-11-05 | 厚みすべり圧電振動子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5985118A (US06272168-20010807-M00014.png) |
-
1982
- 1982-11-05 JP JP19441282A patent/JPS5985118A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5985118A (ja) | 1984-05-17 |
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