JPS6358831A - Removal of resist from irregular shape substrate and device therefor - Google Patents

Abstract

PURPOSE:To remove a resist while preventing a stripping liquid from rising up along a substrate by a method wherein a jet of the stripping liquid is sent out obliquely downward from both sides near lower edge of an erected abnormal formed substrate while a jet of N2 gas is sent out above the stripping liquid. CONSTITUTION:A pair of right and left stripping liquid jetting means 14, 14 is provided with liquid feeding pipes 16, 16 arranged almost in parallel with the lower edge of a substrate as well as multiple nozzles 18 fixed to respective liquid pipes 16, 16. The respective nozzles 18 protruding obliquely downward from both sides near the lower edges of substrate 10 send out a jet of stripping liquid to a resist edge part 12A. On the other hand, a pair of right and left gas jetting means 20. 20 sends out a jet of N2 (nitogen) gas obliquely downward in the direction of resist edge part 12A from the stripping liquid jetting means 14, 14. Through these procedures, a jet of stripping liquid is sent out obliquely downward to the edge part 12A simultaneously a jet of N2 gas is sent out obliquely downward from the upper part so that the stripping liquid or the vapor thereof may be prevented from rising up along the substrate 10 not to corrode any other resist having no unfavorable effect thereon.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for peeling off resist attached to the periphery of a non-circular irregularly shaped substrate such as a square, and an apparatus directly used for carrying out this method. It is something.

(Background of the Invention) In the process of manufacturing semiconductor circuits and the like, it is widely practiced to apply a resist to a glass or silicon substrate and form a predetermined circuit pattern using an exposure means or the like. A spin coater is known as a method for applying this resist to a uniform thickness. In this method, liquid resist is dropped while rotating the substrate at high speed, and centrifugal force is used to apply the resist. However, when this spin coater is used, a thick layer of resist remains attached to the periphery of the substrate. The resist attached to the periphery causes dust to be generated during substrate transport in an automated line. Furthermore, since the resist remaining at the periphery is a little thicker than other parts, there is a problem in that it causes defocus during exposure.

Conventionally, circular substrates have been rotated using a spin coater, and a stripping solution is sprayed onto the periphery of the substrate to strip only the resist attached to the periphery. However, this method has a problem in that it cannot be applied to non-circular substrates such as square ones.

(Objective of the Invention) The present invention has been made in view of the above circumstances, and is intended to efficiently remove the resist that adheres to the periphery of the substrate when resist is applied to a non-circular substrate such as a square one using a spin coater or the like. A first object of the present invention is to provide a method for removing a resist from a irregularly shaped substrate, which allows for good and accurate removal of a resist.

A second object of the present invention is to provide an apparatus that can be used directly for carrying out this method.

(Structure of the Invention) According to the present invention, the first object is to spray a stripping liquid from both sides near the lower edge of an erected irregularly shaped substrate toward both lower edges in an obliquely downward direction, and to Inject N2 gas to
This is achieved by a resist stripping method for irregularly shaped substrates, characterized in that the resist is stripped while preventing the stripping liquid from rising above the substrate.

The second purpose is to provide a processing container having a slit for inserting a substrate in its upper surface, and a pair of gas jetting means positioned below the slit to jet N2 gas so as to merge downward on the center line of the slit. a pair of stripping liquid spouting means located below the gas spouting means and spouting stripping liquid so as to merge downward on the slit center line; an exhaust duct provided in the processing container; This is achieved by a resist stripping apparatus for irregularly shaped substrates, which is characterized by having a drain pipe provided at the bottom of the substrate.

(Example) FIG. 1 is a diagram illustrating the method of the present invention. In this figure, reference numeral 10 indicates a substrate, and one surface of this substrate 10 is coated with a resist 12 in advance by a spin coater. In this case, as described above, a somewhat thick resist edge 12A is formed at the periphery of the substrate IO. This substrate 10 is held in an almost vertically erect state.

Reference numeral 14.14 denotes a pair of left and right stripping liquid ejecting means, including a liquid feed pipe 16.16 arranged substantially parallel to the lower edge of the substrate 10, and a large number of nozzles 18 provided in each liquid feed pipe 16.16. Equipped with. Each nozzle 18 is directed diagonally downward from both sides near the lower edge of the substrate 10, and sprays stripping liquid onto the resist edge 12A. This stripping solution is related to the type of resist used, but in general, those whose main ingredients are phenol and halogenated organic solvents, hot concentrated sulfuric acid, fuming nitric acid, sulfuric acid and hydrogen peroxide, etc. are used. .

Reference numeral 20.20 denotes a pair of left and right gas ejecting means, which ejects N2 (nitrogen) gas diagonally downward from above the stripping liquid ejecting means 14.14 toward the resist edge 12A. By injecting the stripping liquid diagonally downward toward the edge 12A and injecting the N2 gas diagonally downward from above, the stripping liquid rises along the substrate 10, and the vapor of the stripping liquid Regis of other parts by rising) 1
2 and prevents it from corroding and causing negative effects. In this state, if the substrate 10 is moved horizontally between the opposing injection means 14, 14 and 20, 20, the resist 12
The lower edge 12A of the wafer is successfully peeled off to reveal the substrate 10 as shown in FIG. 2.3.

FIG. 4.5 is a diagram showing a peeling method for other shapes. FIG. 4 shows a case where one side of the substrate 10A is notched in a triangular shape. In this case, a stripping liquid jetting means 14A or an N2 gas jetting means 20A bent along the triangular notch is used. . Further, FIG. 5 shows a case where only the lower edge of the substrate 10B is arcuate, and in this case, means 14B and 20B are used which are bent along the arc.

As described above, according to the method of the present invention, the resist on the periphery of a substrate having a shape other than a circle can be removed well.

FIG. 6 is a perspective view of an embodiment of the apparatus used for carrying out this method, FIG. 7 is a plan view thereof, and FIGS. 8 and 9 are cross-sectional views along the line ■-■, FIG. 10 is an enlarged sectional view of the vicinity of the slit.

In FIGS. 6 to 9, the reference numeral 100 is a processing container, and a slit 102 for inserting a substrate is formed in the upper surface of the processing container. The gas jetting means 20.20 and the stripping liquid jetting means 14.14 described in FIG. 1 are provided below this sleeve 102. In this embodiment, the gas ejection means 20 includes an opening 104 connected to the slit 102 and an opening 104 connected to the slit 102.
, and a lower plate 112 fixed to the lower surface of the upper plate 108 and forming a gas ejection slit 110. A space 106 sandwiched between the upper plate 108 and the lower plate 112 becomes a passage for N2 gas, and the processing container 1
N2 gas is supplied from the gas supply port 114 on the top surface of the 00.

The stripping liquid jetting means 14 is connected to the liquid feeding pipe 16 as in FIG. 1 above.
16 and a large number of nozzles 18.

116 is an exhaust duct provided on the side wall of the container 100, 118
is a drain pipe provided at the bottom of the container 100. Furthermore, 120
is a gas-liquid separation plate that surrounds the lower plate 112 and extends downward.

When using this embodiment, 2q of synergic liquid is transferred to the liquid sending pipe 16.
On the other hand, N2 gas is supplied from the gas supply port 114. Further, the exhaust duct 116 is connected to an exhaust fan (not shown) to exhaust the vapor of the stripping liquid to the outside, and the drain pipe 118 is connected to a drain container (not shown).

In this state, if the substrate 10 is inserted through the slit 102 and moved parallel to the sleeve 102 by an amount equivalent to the pitch of the nozzle 18 while applying a stripping liquid to the resist edge 12A, only the resist edge 12A is peeled off. At this time, since the upward flow of the stripping liquid and its vapor is restricted by the N2 gas, the resist 12 other than the lower edge of the substrate 10 is not damaged.

After the resist edge 12A on one side of the substrate 10 is peeled off in this manner, the substrate 10 may be removed from the slit 102 and the other side may be inserted again.

In this case, a sensor for detecting insertion of the substrate 10 may be provided near the slit 102, and the stripping liquid and N2 gas may be supplied only when the substrate 10 is inserted.

In this embodiment, a drain pipe 1184 is provided at the bottom of the container 100 to prevent the stripping liquid from accumulating at the bottom of the container 100.
The amount of steam generated from the stripping liquid is reduced, and the constant exhaust duct l16
Since the steam is exhausted from the slit 102, backflow of steam from the slit 102 can be reliably prevented. Therefore, the vapor
The risk of damaging the resist 12 near the center is further reduced, and it can be used indoors.

(Effects of the Invention) As described above, according to the first invention, the stripping liquid is sprayed from both sides toward the lower edge of the substrate diagonally downward, and the rise of this stripping liquid is restricted from above. Since N2 gas is injected, only the edges of the resist formed at the edges of the irregularly shaped substrate can be removed well, and there is no risk of damaging the resist near the center of the other substrates.

Further, according to the second aspect of the present invention, there is obtained an apparatus that can effectively strip only the resist edges without causing the vapor of the stripping liquid to flow back outward from the substrate insertion sleeve 2.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of the method of the present invention, FIGS. 2 and 3 are cross-sectional views and side views showing the lower part of the substrate after resist removal, and FIGS. 4 and 5 are gas ejection means for substrates of other shapes. Alternatively, FIG. 6 is a perspective view of an embodiment of the device, FIG. 7 is a plan view thereof, and FIGS. 8 and 9 are sectional views taken along the line ■-■ in FIG. 7. The sectional view taken along line IX-IX and FIG. 1O are enlarged sectional views of the vicinity of the slit. DESCRIPTION OF SYMBOLS 10...Substrate, 12...Resist, 12A...Resist edge, 14...Removal liquid ejection means, 20...Gas ejection means, ioo...Processing container, 102...Slit.

Claims (2)

[Claims] (1) A stripping liquid is sprayed diagonally downward from both sides near the lower edge of the upright irregularly shaped substrate, and at the same time, N_2 gas is sprayed above the stripping solution, so that the stripping solution is sprayed onto the substrate. 1. A method for removing a resist from a irregularly shaped substrate, the method comprising removing the resist while preventing the resist from rising. (2) A processing container in which a slit for inserting a substrate is formed on the upper surface, a pair of gas jetting means located below the slit and jetting N_2 gas so as to merge downward on the center line of the slit, and this gas a pair of stripping liquid spouting means located below the spouting means and spouting stripping liquid so as to merge downward on the center line of the slit; an exhaust duct provided in the processing container; and an exhaust duct provided at the bottom of the processing container. 1. A resist stripping device for irregularly shaped substrates, comprising: a drain pipe;