JPS6357739U - - Google Patents
Info
- Publication number
- JPS6357739U JPS6357739U JP1986150769U JP15076986U JPS6357739U JP S6357739 U JPS6357739 U JP S6357739U JP 1986150769 U JP1986150769 U JP 1986150769U JP 15076986 U JP15076986 U JP 15076986U JP S6357739 U JPS6357739 U JP S6357739U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounted substrate
- bonding
- package
- abutted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986150769U JPS6357739U (enExample) | 1986-09-30 | 1986-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986150769U JPS6357739U (enExample) | 1986-09-30 | 1986-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6357739U true JPS6357739U (enExample) | 1988-04-18 |
Family
ID=31067211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986150769U Pending JPS6357739U (enExample) | 1986-09-30 | 1986-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6357739U (enExample) |
-
1986
- 1986-09-30 JP JP1986150769U patent/JPS6357739U/ja active Pending